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22 条记录 (耗时 0.026 秒)

    Method of making a color filter
    7.
    发明授权
    Method of making a color filter 失效
    制作滤色片的方法

    公开(公告)号：US5952129A

    公开(公告)日：1999-09-14

    申请号：US721202

    申请日：1996-09-26

    申请人： Hiroshi Kiguchi ,  Takao Nishikawa ,  Tatsuya Shimoda ,  Masaru Kojima ,  Sadao Kanbe

    发明人： Hiroshi Kiguchi ,  Takao Nishikawa ,  Tatsuya Shimoda ,  Masaru Kojima ,  Sadao Kanbe

    IPC分类号： G02B5/20 ,  G02B5/22 ,  G02F1/1335

    CPC分类号： G02B5/223 ,  G02F1/133516

    摘要： A process of making a color filter includes a first step of producing a master having a plurality of ink charging recesses arranged in a given pattern, a second step of charging ink of preselected colors into the ink charging recesses to form an ink layer, a third step of forming a resin layer over the master into which the ink have been charged and a fourth step of separating the ink layer and the resin layer together from the master after these layers have been cured.

    摘要翻译： 制造滤色器的过程包括制备具有以给定图案布置的多个墨水填充凹槽的母版的第一步骤，将预选颜色的墨水充入墨水填充凹部中以形成墨层的第二步骤，第三步骤 在已经充有油墨的母料上形成树脂层的步骤以及在这些层已经固化之后将油墨层和树脂层与母料分离的第四步骤。

    Method of forming electrodes on a dielectric resonator part
    8.
    发明授权
    Method of forming electrodes on a dielectric resonator part 失效
    在介质谐振器部件上形成电极的方法

    公开(公告)号：US5474488A

    公开(公告)日：1995-12-12

    申请号：US184080

    申请日：1994-01-18

    申请人： Yoshio Yamamoto ,  Kei Arai ,  Nobuyuki Hayashi ,  Masaru Kojima

    发明人： Yoshio Yamamoto ,  Kei Arai ,  Nobuyuki Hayashi ,  Masaru Kojima

    IPC分类号： H01P1/205 ,  B24B1/04 ,  H01P11/00

    CPC分类号： B24B1/04 ,  H01L41/29

    摘要： An apparatus for forming input and output electrodes on the outer peripheral surface of a dielectric block coated with an electrically conductive film includes a holder for holding the block, a cutting tool with cutting surfaces, and a compression pump. Mobile tables supporting the holder and the cutting tool are controlled to cause the cutting surfaces to come in contact with a specified area on the outer peripheral surface of the block. Cutting water mixed with abrasive grains is projected by the compression pump onto the specified area, and ultrasonic vibrations generated by a vibration generator and amplified by an amplifier horn are transmitted to the cutter, causing a portion of the conductive film to be removed from a frame-shaped area, leaving an isolated piece of the conductive film separated from the remainder of the film to serve as an electrode.

    摘要翻译： 在涂覆有导电膜的电介质块的外周表面上形成输入和输出电极的装置包括用于保持块的保持器，具有切割表面的切割工具和压缩泵。 控制支撑保持器和切割工具的移动台，使切割面与块体的外周面上的指定区域接触。 与磨粒混合的切割水通过压缩泵投射到指定区域，并且由振动发生器产生并由放大器喇叭放大的超声波振动传递到切割器，导致部分导电膜从框架 形成的区域，留下与膜的其余部分分离的导电膜的隔离片以用作电极。

    Process for producing a printed circuit board
    9.
    发明授权
    Process for producing a printed circuit board 失效
    印刷电路板的制造方法

    公开(公告)号：US5377406A

    公开(公告)日：1995-01-03

    申请号：US158300

    申请日：1993-11-29

    申请人： Masuo Matsumoto ,  Naohiro Yoshida ,  Masaru Kojima

    发明人： Masuo Matsumoto ,  Naohiro Yoshida ,  Masaru Kojima

    IPC分类号： H05K1/09 ,  H05K3/06 ,  H05K3/24 ,  H05K3/34 ,  H05K3/02

    CPC分类号： H05K3/067 ,  H05K3/3473 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0405 ,  H05K2203/0723 ,  H05K3/244 ,  Y10T29/49155

    摘要： A process for producing a printed circuit board is disclosed, in which use is made of a copper-clad laminate comprising a substrate and, superimposed thereon, a copper foil having its entire surface covered with a solder foil. A solder foil 4 is applied to cover the entire surface of a copper foil 2 superimposed on a substrate 1 (the copper foil 2 and the substrate 1 forming a copper-clad laminate 3). An etching resist is applied to the surface of the solder foil 4, and the solder foil 4 and the copper foil 2 are simultaneously etched to form a conductor circuit pattern 8. Thereafter, the etching resist is stripped off, and unneeded portions of the solder foil 4 are removed on the conductor circuit pattern 8 to thereby produce a printed circuit board. The above process of the invention facilitates soldering operation for the printed circuit board and reduces the production cost thereof.

    摘要翻译： 公开了一种用于制造印刷电路板的方法，其中使用包括基底的覆铜层压板并且叠置在其上覆盖有焊料箔的整个表面的铜箔。 涂覆焊料箔4以覆盖叠加在基板1（铜箔2和形成覆铜层压板3的基板1）上的铜箔2的整个表面。 在焊料箔4的表面上涂敷抗蚀剂，同时对焊锡箔4和铜​​箔2进行蚀刻，形成导体电路图案8.此后，剥离抗蚀剂，焊料的不需要部分 箔4在导体电路图案8上被去除，从而产生印刷电路板。 本发明的上述方法有利于印刷电路板的焊接操作并降低其生产成本。

    Ceramic honeycomb structural bodies
    10.
    发明授权
    Ceramic honeycomb structural bodies 失效
    陶瓷蜂窝结构体

    公开(公告)号：US4448828A

    公开(公告)日：1984-05-15

    申请号：US278580

    申请日：1981-06-29

    申请人： Shigeru Mochida ,  Masaru Kojima

    发明人： Shigeru Mochida ,  Masaru Kojima

    IPC分类号： B01D53/86 ,  B01J35/04 ,  C04B38/00 ,  F01N3/28 ,  F28F21/04 ,  B32B3/20

    CPC分类号： F01N3/2828 ,  B01D53/86 ,  B01J35/04 ,  C04B38/0006 ,  F01N2330/48 ,  Y10T428/131 ,  Y10T428/24149 ,  Y10T428/24157 ,  Y10T428/24165

    摘要： This invention discloses ceramic honeycomb structural bodies having high thermal shock resistance and mechanical strength in which partition walls forming numerous parallel channels of the honeycomb structural bodies and/or connecting portions of the partition walls are constructed so as to have flexibility. The flexibility allows thermal stress generated in the honeycomb structural bodies to be absorbed. The bodies are characterized in that a given area of outer circumferential annular portion of said ceramic honeycomb structural bodies has a structure having a higher rigidity than the inner portion.

    摘要翻译： 本发明公开了具有高耐热冲击性和机械强度的陶瓷蜂窝结构体，其中形成蜂窝结构体的多个平行通道的隔壁和/或分隔壁的连接部分被构造成具有柔性。 灵活性允许在蜂窝结构体中产生的热应力被吸收。 这些主体的特征在于，所述陶瓷蜂窝结构体的外周环形部分的给定区域具有比内部部分更高刚性的结构。