摘要:
A composite laminate includes first sheet layers and second sheet layers. The first sheet layers include a first particulate aggregate and the second sheet layers include a second particulate aggregate. Each of internal second sheet layers is disposed between two first sheet layers and two external second sheet layers constitute two main faces of the composite laminate. The thickness of the internal second sheet layers is greater than the thickness of the external second sheet layers. The first sheet layers and the second sheet layers are bonded to each other by penetration of a part of the first particulate aggregate contained in the first sheet layers into the second sheet layers. This configuration can reduce the transverse shrinkage in the firing step of the composite laminate.
摘要:
A composite laminate includes first sheet layers and second sheet layers. The first sheet layers include a first particulate aggregate and the second sheet layers include a second particulate aggregate. Each of internal second sheet layers is disposed between two first sheet layers and two external second sheet layers constitute two main faces of the composite laminate. The thickness of the internal second sheet layers is greater than the thickness of the external second sheet layers. The first sheet layers and the second sheet layers are bonded to each other by penetration of a part of the first particulate aggregate contained in the first sheet layers into the second sheet layers. This configuration can reduce the transverse shrinkage in the firing step of the composite laminate.
摘要:
A composite laminate includes first sheet layers and second sheet layers. The first sheet layers include a first particulate aggregate and the second sheet layers include a second particulate aggregate. Each of internal second sheet layers is disposed between two first sheet layers and two external second sheet layers constitute two main faces of the composite laminate. The thickness of the internal second sheet layers is greater than the thickness of the external second sheet layers. The first sheet layers and the second sheet layers are bonded to each other by penetration of a part of the first particulate aggregate contained in the first sheet layers into the second sheet layers. This configuration can reduce the transverse shrinkage in the firing step of the composite laminate.
摘要:
There is disclosed a hybrid laminate comprising: a substrate layer containing a compact of first powder; and a functional material layer being in contact with the substrate layer and containing a compact of second powder; wherein the compact of the first powder comprises a glass material; the compact of the second powder comprises a ceramic material having at least one specific electric property selected from dielectricity, magnetism, resistivity and insulation; at least a part of the first powder is in a sintered state; and the second powder is in an unsintered state and is bonded together by diffusion or a flow of a part of the material of the substrate layer into the functional material layer.
摘要:
A positive characteristic thermistor device includes a device main body made of a semiconductor ceramic material which reliably and cleanly delaminates upon the application of excessive voltage thereto. The main body has outer layers having lower porosity formed on both sides of an inner layer having higher porosity. The inner layer having higher porosity can be obtained by burning a ceramic material for positive characteristic thermistors including resin beads mixed therein. After forming the main body, an electrode is formed on the outer surface of each of the outer layers. When an overvoltage is applied to this positive characteristic thermistor device, delamination occurs in the inner layer having higher porosity to create an open-circuit in a circuit in which the thermistor device is connected.
摘要:
There is provided a positive characteristics thermistor device having excellent thermal breakdown characteristics. According to the present invention, a positive characteristics thermistor device has a positive characteristics thermistor element 1 and electrodes 2 and 3 formed on principal surfaces of the positive characteristics thermistor element 1. The positive characteristics thermistor element 1 includes an inner region 4 and outer regions 5 and 6 and a porosity occupying rate of the outer regions 5 and 6 is set higher than that of the inner region 4.
摘要:
A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 μm or more is adhered to the end surface of the laminate, for example, by a sandblast method or a brush polishing method. The external electrode is defined by a plating film that is formed by electroplating or electroless plating.
摘要:
A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 μm or less, and a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 μm or less. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.
摘要:
A method for manufacturing a laminated electronic component is performed such that a water-repellent agent is applied to end surfaces at which ends of internal electrodes are exposed so as to be filled in spaces along interfaces between insulating layers and the internal electrodes. Subsequently, an abrading step is performed such that the internal electrodes are sufficiently exposed at the end surfaces and an excess water-repellent agent is removed therefrom to enable plating films to be directly formed on the end surfaces.
摘要:
A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 μm or less when a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 μm or less, and is about 20 μm or less when a protruding length of the adjacent internal electrodes from the end surface is at least about 0.1 μm. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.