公开(公告)号：US20080160675A1

公开(公告)日：2008-07-03

申请号：US11648719

申请日：2006-12-29

申请人： Belgacem Haba ,  Stuart E. Wilson

发明人： Belgacem Haba ,  Stuart E. Wilson

IPC分类号： H01L21/00

CPC分类号： H01L21/4853 ,  H01L23/142 ,  H01L23/3677 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of forming a microelectronic package including the steps of providing a three-layer metal plate, having a first layer, a second layer and a third layer. A plurality of conductive elements is formed from the first layer of the metal plate. A dielectric sheet is attached to the first layer of the metal plate, such that the dielectric sheet is remote from the third layer. A plurality of conductive features is then formed from the third layer of the metal plate which are also remote from the dielectric sheet. A microelectronic element is next electrically conducted to the conductive elements and a heat spreader is thermally connected the microelectronic element.

摘要翻译： 一种形成微电子封装的方法，包括以下步骤：提供具有第一层，第二层和第三层的三层金属板。 多个导电元件由金属板的第一层形成。 电介质片附接到金属板的第一层，使得电介质片远离第三层。 然后，也从金属板的第三层形成多个导电特征，其也远离电介质片。 微电子元件接下来导电到导电元件，并且散热器热连接到微电子元件。

公开(公告)号：US07176043B2

公开(公告)日：2007-02-13

申请号：US11014439

申请日：2004-12-16

申请人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  Ilyas Mohammed ,  Stuart E. Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Burl Thompson

发明人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  Ilyas Mohammed ,  Stuart E. Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Burl Thompson

IPC分类号： H01L21/66

CPC分类号： H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/17 ,  H01L2224/1703 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.

摘要翻译： 微电子封装包括具有面和触点的微电子元件和与微电子元件的第一面间隔开并且覆盖其上的柔性基板。 该封装还包括从柔性基板延伸并从远离微电子元件的第一面突出的多个导电柱，其中至少一些导电柱与微电子元件电互连，以及多个支撑元件 微电子元件上的柔性衬底。 导电柱从支撑元件偏移以便于基板的挠曲和柱相对于微电子元件的移动。

公开(公告)号：US07554206B2

公开(公告)日：2009-06-30

申请号：US11607372

申请日：2006-12-01

申请人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  Ilyas Mohammed ,  Stuart E. Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Burl Thompson

发明人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  Ilyas Mohammed ,  Stuart E. Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Burl Thompson

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L23/40 ,  H01L23/485 ,  H01L23/498

CPC分类号： H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/17 ,  H01L2224/1703 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The package includes a plurality of support elements disposed between the microelectronic element and the substrate and supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements. The assembly includes a circuitized substrate having conductive pads confronting the conductive posts of the microelectronic package, whereby the conductive posts are electrically interconnected with the conductive pads.

摘要翻译： 微电子组件包括具有微电子元件的微电子封装，所述微电子元件具有面和触点，与微电子元件的第一面间隔开并覆盖所述微电子元件的第一面的柔性基板以及从所述柔性基板延伸并远离所述第一面突出的多个导电柱 微电子元件，至少一些导电柱与微电子元件电互连。 所述封装包括设置在所述微电子元件和所述基板之间的多个支撑元件，并且在所述微电子元件上支撑所述柔性基板。 至少一些导电柱从支撑元件偏移。 组件包括具有面对微电子封装的导电柱的导电焊盘的电路化衬底，由此导电柱与导电焊盘电互连。

公开(公告)号：US08034665B2

公开(公告)日：2011-10-11

申请号：US12760094

申请日：2010-04-14

申请人： Belgacem Haba ,  Stuart E. Wilson

发明人： Belgacem Haba ,  Stuart E. Wilson

IPC分类号： H01L21/00

CPC分类号： H01L21/4853 ,  H01L23/142 ,  H01L23/3677 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of forming a microelectronic package including the steps of providing a three-layer metal plate, having a first layer, a second layer and a third layer. A plurality of conductive elements is formed from the first layer of the metal plate. A dielectric sheet is attached to the first layer of the metal plate, such that the dielectric sheet is remote from the third layer. A plurality of conductive features is then formed from the third layer of the metal plate which are also remote from the dielectric sheet. A microelectronic element is next electrically conducted to the conductive elements and a heat spreader is thermally connected the microelectronic element.

摘要翻译： 一种形成微电子封装的方法，包括以下步骤：提供具有第一层，第二层和第三层的三层金属板。 多个导电元件由金属板的第一层形成。 电介质片附接到金属板的第一层，使得电介质片远离第三层。 然后，也从金属板的第三层形成多个导电特征，其也远离电介质片。 微电子元件接下来导电到导电元件，并且散热器热连接到微电子元件。

公开(公告)号：US20100197081A1

公开(公告)日：2010-08-05

申请号：US12760094

申请日：2010-04-14

申请人： Belgacem Haba ,  Stuart E. Wilson

发明人： Belgacem Haba ,  Stuart E. Wilson

IPC分类号： H01L21/50

CPC分类号： H01L21/4853 ,  H01L23/142 ,  H01L23/3677 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of forming a microelectronic package including the steps of providing a three-layer metal plate, having a first layer, a second layer and a third layer. A plurality of conductive elements is formed from the first layer of the metal plate. A dielectric sheet is attached to the first layer of the metal plate, such that the dielectric sheet is remote from the third layer. A plurality of conductive features is then formed from the third layer of the metal plate which are also remote from the dielectric sheet. A microelectronic element is next electrically conducted to the conductive elements and a heat spreader is thermally connected the microelectronic element.

摘要翻译： 一种形成微电子封装的方法，包括以下步骤：提供具有第一层，第二层和第三层的三层金属板。 多个导电元件由金属板的第一层形成。 电介质片附接到金属板的第一层，使得电介质片远离第三层。 然后，也从金属板的第三层形成多个导电特征，其也远离电介质片。 微电子元件接下来导电到导电元件，并且散热器热连接到微电子元件。

公开(公告)号：US07709297B2

公开(公告)日：2010-05-04

申请号：US11648719

申请日：2006-12-29

申请人： Belgacem Haba ,  Stuart E. Wilson

发明人： Belgacem Haba ,  Stuart E. Wilson

IPC分类号： H01L21/00

CPC分类号： H01L21/4853 ,  H01L23/142 ,  H01L23/3677 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of forming a microelectronic package including the steps of providing a three-layer metal plate, having a first layer, a second layer and a third layer. A plurality of conductive elements is formed from the first layer of the metal plate. A dielectric sheet is attached to the first layer of the metal plate, such that the dielectric sheet is remote from the third layer. A plurality of conductive features is then formed from the third layer of the metal plate which are also remote from the dielectric sheet. A microelectronic element is next electrically conducted to the conductive elements and a heat spreader is thermally connected the microelectronic element.

摘要翻译： 一种形成微电子封装的方法，包括以下步骤：提供具有第一层，第二层和第三层的三层金属板。 多个导电元件由金属板的第一层形成。 电介质片附接到金属板的第一层，使得电介质片远离第三层。 然后，也从金属板的第三层形成多个导电特征，其也远离电介质片。 微电子元件接下来导电到导电元件，并且散热器热连接到微电子元件。

公开(公告)号：US07489524B2

公开(公告)日：2009-02-10

申请号：US11143201

申请日：2005-06-02

申请人： Ronald Green ,  Sridhar Krishnan ,  Stuart E. Wilson ,  James Gill Shook ,  Ming Tsai ,  Andy Stavros

发明人： Ronald Green ,  Sridhar Krishnan ,  Stuart E. Wilson ,  James Gill Shook ,  Ming Tsai ,  Andy Stavros

IPC分类号： H05K1/11

CPC分类号： H05K3/368 ,  H05K1/145 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/366 ,  H05K3/403 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2201/0999 ,  H05K2201/10484

摘要： An assembly is provided which includes a first circuit panel having a top surface, a first dielectric element and first conductive traces disposed on the first dielectric element. In addition, a second circuit panel has a bottom surface, a second dielectric element and second conductive traces disposed on the second dielectric element, where at least a portion of the second circuit panel overlies at least a portion of the first circuit panel. The assembly further includes an interconnect circuit panel having a third dielectric element which has a front surface, a rear surface opposite the front surface, a top end extending between the front and rear surfaces, a bottom end extending between the front and rear surfaces, and a plurality of interconnect traces disposed on the dielectric element. The bottom end of the interconnect element abuts the top surface of the first circuit panel and the top end abuts the bottom surface of the second circuit panel, where at least some of the first conductive traces are in conductive communication with the second conductive traces through the interconnect traces.

摘要翻译： 提供了一种组件，其包括具有顶表面的第一电路板，设置在第一介电元件上的第一介电元件和第一导电迹线。 此外，第二电路板具有底表面，第二介电元件和设置在第二电介质元件上的第二导电迹线，其中第二电路板的至少一部分覆盖在第一电路板的至少一部分上。 该组件还包括具有第三电介质元件的互连电路板，第三电介质元件具有前表面，与前表面相对的后表面，在前表面和后表面之间延伸的顶端，在前表面和后表面之间延伸的底端，以及 布置在电介质元件上的多个互连迹线。 互连元件的底端邻接第一电路板的顶表面，并且顶端邻接第二电路板的底表面，其中至少一些第一导电迹线通过第二导电迹线与第二导电迹线导通连通 互连线。

公开(公告)号：US20080042250A1

公开(公告)日：2008-02-21

申请号：US11506472

申请日：2006-08-18

申请人： Stuart E. Wilson ,  Ronald Green ,  Richard Dewitt Crisp ,  Giles Humpston

发明人： Stuart E. Wilson ,  Ronald Green ,  Richard Dewitt Crisp ,  Giles Humpston

IPC分类号： H01L23/02

CPC分类号： H01L23/66 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/09701 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00

摘要： A stacked microelectronic assembly includes a base substrate having conductive elements projecting from a bottom surface thereof and a first microelectronic subassembly underlying a bottom surface of the base substrate. The first microelectronic subassembly includes a first dielectric substrate, a first microelectronic element connected with the first dielectric substrate and first conductive posts projecting from the first dielectric substrate toward the bottom surface of the base substrate for electrically interconnecting the first microelectronic element and the base substrate. The assembly also has a second microelectronic subassembly overlying the base substrate. The second microelectronic subassembly includes a second dielectric substrate, a second microelectronic element connected with the second dielectric substrate and second conductive posts projecting toward the top surface of the base substrate for electrically interconnecting the second microelectronic element and the base substrate. The first microelectronic subassembly has a first height and the conductive elements projecting from the bottom surface of the base substrate have a second height that is greater than the first height of the first microelectronic subassembly.

摘要翻译： 堆叠的微电子组件包括具有从其底表面突出的导电元件的基底基板和位于基底基底的底表面下方的第一微电子子组件。 第一微电子子组件包括第一电介质衬底，与第一电介质衬底连接的第一微电子元件和从第一电介质衬底向基底衬底的底表面突出的第一导电柱，用于将第一微电子元件和基底衬底电互连。 组件还具有覆盖在基底基板上的第二微电子子组件。 第二微电子子组件包括第二电介质衬底，与第二电介质衬底连接的第二微电子元件和朝向基底衬底的顶表面突出的第二导电柱，用于电连接第二微电子元件和基底衬底。 第一微电子子组件具有第一高度，并且从基底衬底的底表面突出的导电元件具有大于第一微电子子组件的第一高度的第二高度。

公开(公告)号：US07151502B2

公开(公告)日：2006-12-19

申请号：US11025397

申请日：2004-12-29

申请人： Andy Stavros ,  Ming Tsai ,  Stuart E. Wilson

发明人： Andy Stavros ,  Ming Tsai ,  Stuart E. Wilson

IPC分类号： H01Q21/00

CPC分类号： H01Q9/285 ,  H01Q21/0025

摘要： A phased antenna array is disclosed. The phased antenna array is composed of one or more modules and has a plurality of antenna. The array has a plurality of antenna configured to operate as an array and each module has at least one antenna. The modules have a substrate that supports the antenna, a microelectronic device for sending signals to or receiving signals from said antenna and conductive traces that connect that antenna to the microelectronic device. In those embodiments where the phased antenna array has more than one module, a common substrate supports the one or more modules. A combination of circuitry and interconnects achieves the desired electrical interconnection between the modules.

摘要翻译： 公开了一种相控天线阵列。 相控天线阵列由一个或多个模块组成并具有多个天线。 阵列具有被配置为作为阵列操作的多个天线，并且每个模块具有至少一个天线。 模块具有支撑天线的基板，用于向所述天线发送信号或从所述天线接收信号的微电子装置和将该天线连接到微电子装置的导电迹线。 在相控天线阵列具有多于一个模块的那些实施例中，公共基板支撑一个或多个模块。 电路和互连的组合实现了模块之间期望的电互连。

公开(公告)号：US08155663B2

公开(公告)日：2012-04-10

申请号：US12006053

申请日：2007-12-28

申请人： Stuart E. Wilson ,  Ilyas Mohammed ,  Charles White ,  Hari Chakravarthula

发明人： Stuart E. Wilson ,  Ilyas Mohammed ,  Charles White ,  Hari Chakravarthula

IPC分类号： H04W4/00

CPC分类号： H04M1/0264 ,  H04M1/0202 ,  H04M1/026 ,  H04M1/0279 ,  H04M1/05 ,  H04M1/6066 ,  H04M1/7253 ,  H04M2250/02 ,  H04M2250/12 ,  H04M2250/52

摘要： A cellular telephone is provided with a wearable housing, desirably in a form which can be concealed in the user's clothing, wallet, or other place. The housing may be devoid of switches or buttons for controlling the cellular telephone, and control inputs can be provided through free space communications such as a short-range radio link. A module for use in portable communications devices includes chips superposed on one another on a stack, and incorporates an interposer for facilitating connections between the chips.

摘要翻译： 蜂窝电话设置有可佩戴的外壳，理想地是可以隐藏在用户的衣服，钱包或其他地方的形式。 壳体可以没有用于控制蜂窝电话的开关或按钮，并且可以通过诸如短距离无线电链路的自由空间通信来提供控制输入。 用于便携式通信设备的模块包括在堆叠上彼此重叠的芯片，并且包括用于促进芯片之间的连接的插入器。