公开(公告)号：US20080160675A1

公开(公告)日：2008-07-03

申请号：US11648719

申请日：2006-12-29

申请人： Belgacem Haba ,  Stuart E. Wilson

发明人： Belgacem Haba ,  Stuart E. Wilson

IPC分类号： H01L21/00

CPC分类号： H01L21/4853 ,  H01L23/142 ,  H01L23/3677 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of forming a microelectronic package including the steps of providing a three-layer metal plate, having a first layer, a second layer and a third layer. A plurality of conductive elements is formed from the first layer of the metal plate. A dielectric sheet is attached to the first layer of the metal plate, such that the dielectric sheet is remote from the third layer. A plurality of conductive features is then formed from the third layer of the metal plate which are also remote from the dielectric sheet. A microelectronic element is next electrically conducted to the conductive elements and a heat spreader is thermally connected the microelectronic element.

摘要翻译： 一种形成微电子封装的方法，包括以下步骤：提供具有第一层，第二层和第三层的三层金属板。 多个导电元件由金属板的第一层形成。 电介质片附接到金属板的第一层，使得电介质片远离第三层。 然后，也从金属板的第三层形成多个导电特征，其也远离电介质片。 微电子元件接下来导电到导电元件，并且散热器热连接到微电子元件。

公开(公告)号：US07176043B2

公开(公告)日：2007-02-13

申请号：US11014439

申请日：2004-12-16

申请人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  Ilyas Mohammed ,  Stuart E. Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Burl Thompson

发明人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  Ilyas Mohammed ,  Stuart E. Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Burl Thompson

IPC分类号： H01L21/66

CPC分类号： H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/17 ,  H01L2224/1703 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.

摘要翻译： 微电子封装包括具有面和触点的微电子元件和与微电子元件的第一面间隔开并且覆盖其上的柔性基板。 该封装还包括从柔性基板延伸并从远离微电子元件的第一面突出的多个导电柱，其中至少一些导电柱与微电子元件电互连，以及多个支撑元件 微电子元件上的柔性衬底。 导电柱从支撑元件偏移以便于基板的挠曲和柱相对于微电子元件的移动。

公开(公告)号：US07554206B2

公开(公告)日：2009-06-30

申请号：US11607372

申请日：2006-12-01

申请人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  Ilyas Mohammed ,  Stuart E. Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Burl Thompson

发明人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  Ilyas Mohammed ,  Stuart E. Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Burl Thompson

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L23/40 ,  H01L23/485 ,  H01L23/498

CPC分类号： H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/17 ,  H01L2224/1703 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The package includes a plurality of support elements disposed between the microelectronic element and the substrate and supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements. The assembly includes a circuitized substrate having conductive pads confronting the conductive posts of the microelectronic package, whereby the conductive posts are electrically interconnected with the conductive pads.

摘要翻译： 微电子组件包括具有微电子元件的微电子封装，所述微电子元件具有面和触点，与微电子元件的第一面间隔开并覆盖所述微电子元件的第一面的柔性基板以及从所述柔性基板延伸并远离所述第一面突出的多个导电柱 微电子元件，至少一些导电柱与微电子元件电互连。 所述封装包括设置在所述微电子元件和所述基板之间的多个支撑元件，并且在所述微电子元件上支撑所述柔性基板。 至少一些导电柱从支撑元件偏移。 组件包括具有面对微电子封装的导电柱的导电焊盘的电路化衬底，由此导电柱与导电焊盘电互连。

公开(公告)号：US08034665B2

公开(公告)日：2011-10-11

申请号：US12760094

申请日：2010-04-14

申请人： Belgacem Haba ,  Stuart E. Wilson

发明人： Belgacem Haba ,  Stuart E. Wilson

IPC分类号： H01L21/00

CPC分类号： H01L21/4853 ,  H01L23/142 ,  H01L23/3677 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of forming a microelectronic package including the steps of providing a three-layer metal plate, having a first layer, a second layer and a third layer. A plurality of conductive elements is formed from the first layer of the metal plate. A dielectric sheet is attached to the first layer of the metal plate, such that the dielectric sheet is remote from the third layer. A plurality of conductive features is then formed from the third layer of the metal plate which are also remote from the dielectric sheet. A microelectronic element is next electrically conducted to the conductive elements and a heat spreader is thermally connected the microelectronic element.

摘要翻译： 一种形成微电子封装的方法，包括以下步骤：提供具有第一层，第二层和第三层的三层金属板。 多个导电元件由金属板的第一层形成。 电介质片附接到金属板的第一层，使得电介质片远离第三层。 然后，也从金属板的第三层形成多个导电特征，其也远离电介质片。 微电子元件接下来导电到导电元件，并且散热器热连接到微电子元件。

公开(公告)号：US20100197081A1

公开(公告)日：2010-08-05

申请号：US12760094

申请日：2010-04-14

申请人： Belgacem Haba ,  Stuart E. Wilson

发明人： Belgacem Haba ,  Stuart E. Wilson

IPC分类号： H01L21/50

CPC分类号： H01L21/4853 ,  H01L23/142 ,  H01L23/3677 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of forming a microelectronic package including the steps of providing a three-layer metal plate, having a first layer, a second layer and a third layer. A plurality of conductive elements is formed from the first layer of the metal plate. A dielectric sheet is attached to the first layer of the metal plate, such that the dielectric sheet is remote from the third layer. A plurality of conductive features is then formed from the third layer of the metal plate which are also remote from the dielectric sheet. A microelectronic element is next electrically conducted to the conductive elements and a heat spreader is thermally connected the microelectronic element.

摘要翻译： 一种形成微电子封装的方法，包括以下步骤：提供具有第一层，第二层和第三层的三层金属板。 多个导电元件由金属板的第一层形成。 电介质片附接到金属板的第一层，使得电介质片远离第三层。 然后，也从金属板的第三层形成多个导电特征，其也远离电介质片。 微电子元件接下来导电到导电元件，并且散热器热连接到微电子元件。

公开(公告)号：US07709297B2

公开(公告)日：2010-05-04

申请号：US11648719

申请日：2006-12-29

申请人： Belgacem Haba ,  Stuart E. Wilson

发明人： Belgacem Haba ,  Stuart E. Wilson

IPC分类号： H01L21/00

CPC分类号： H01L21/4853 ,  H01L23/142 ,  H01L23/3677 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of forming a microelectronic package including the steps of providing a three-layer metal plate, having a first layer, a second layer and a third layer. A plurality of conductive elements is formed from the first layer of the metal plate. A dielectric sheet is attached to the first layer of the metal plate, such that the dielectric sheet is remote from the third layer. A plurality of conductive features is then formed from the third layer of the metal plate which are also remote from the dielectric sheet. A microelectronic element is next electrically conducted to the conductive elements and a heat spreader is thermally connected the microelectronic element.

摘要翻译： 一种形成微电子封装的方法，包括以下步骤：提供具有第一层，第二层和第三层的三层金属板。 多个导电元件由金属板的第一层形成。 电介质片附接到金属板的第一层，使得电介质片远离第三层。 然后，也从金属板的第三层形成多个导电特征，其也远离电介质片。 微电子元件接下来导电到导电元件，并且散热器热连接到微电子元件。

公开(公告)号：US09125333B2

公开(公告)日：2015-09-01

申请号：US13183870

申请日：2011-07-15

申请人： Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Belgacem Haba ,  Piyush Savalia ,  Craig Mitchell

发明人： Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Belgacem Haba ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H05K1/03 ,  H05K1/09 ,  H05K3/40

CPC分类号： H01L24/05 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05169 ,  H01L2224/056 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01074 ,  H01L2924/013 ,  H05K1/09 ,  H05K3/4007 ,  H05K2201/032 ,  H05K2201/0326 ,  H05K2201/0338

摘要： Barrier layers for use in electrical applications. In some embodiments the barrier layer is a laminated barrier layer. In some embodiments the barrier layer includes a graded barrier layer.

摘要翻译： 用于电气应用的阻隔层。 在一些实施例中，阻挡层是层压阻挡层。 在一些实施例中，阻挡层包括梯度阻挡层。

公开(公告)号：US08988895B2

公开(公告)日：2015-03-24

申请号：US13215725

申请日：2011-08-23

申请人： Ilyas Mohammed ,  Belgacem Haba

发明人： Ilyas Mohammed ,  Belgacem Haba

IPC分类号： H05K7/04 ,  H01B7/00 ,  H01R43/00 ,  H01L21/50 ,  H05K3/46 ,  H01L23/498 ,  H01L21/48 ,  H01R12/52

CPC分类号： H05K3/4602 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01R12/523 ,  H05K2201/10378 ,  H05K2203/0235 ,  Y10T29/49176

摘要： An interconnection element is disclosed that includes a plurality of drawn metal conductors, a dielectric layer, and opposed surfaces having a plurality of wettable contacts thereon. The conductors may include grains having lengths oriented in a direction between the first and second ends of the conductors. A dielectric layer for insulating the conductors may have first and second opposed surfaces and a thickness less than 1 millimeter between the first and second surface. One or more conductors may be configured to carry a signal to or from a microelectronic element. First and second wettable contacts may be used to bond the interconnection element to at least one of a microelectronic element and a circuit panel. The wettable contacts may match a spatial distribution of element contacts at a face of a microelectronic element or of circuit contacts exposed at a face of component other than the microelectronic element.

摘要翻译： 公开了一种互连元件，其包括多个拉制的金属导体，电介质层和在其上具有多个可湿接触点的相对表面。 导体可以包括具有沿导体的第一和第二端之间的方向定向的长度的晶粒。 用于绝缘导体的电介质层可以具有第一和第二相对表面，并且在第一和第二表面之间可以具有小于1毫米的厚度。 一个或多个导体可以被配置为将信号传送到微电子元件或从微电子元件传送信号。 可以使用第一和第二可湿触点将互连元件接合到微电子元件和电路板中的至少一个。 可湿性触点可以匹配微电子元件的表面处的元件触点的空间分布或暴露在微电子元件以外的部件的表面处的电路触点。

公开(公告)号：US08937361B2

公开(公告)日：2015-01-20

申请号：US13114243

申请日：2011-05-24

申请人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC分类号： H01L31/0232 ,  H01L27/146

CPC分类号： H01L27/14625 ,  H01L27/1461 ,  H01L27/14629 ,  H01L27/14632 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14687

摘要： A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a rear face. A semiconductor region has a first thickness between the first light sensing element and the rear face and a second thickness between the second light sensing element and the rear face such that the first and second light sensing elements receive light of substantially the same intensity. A dielectric region is provided at least substantially filling a space of the semiconductor region adjacent at least one of the light sensing elements. The dielectric region may include at least one light guide.

摘要翻译： 提供了一种用于背面照明的微电子图像传感器组件及其制造方法。 该组件包括具有在正面暴露的触点的微电子元件和被布置成通过后表面接收不同波长的光的光感测元件。 半导体区域在第一光感测元件和后表面之间具有第一厚度，并且在第二光感测元件和后表面之间具有第二厚度，使得第一和第二光感测元件接收基本上相同强度的光。 提供至少基本上填充与至少一个光感测元件相邻的半导体区域的空间的电介质区域。 电介质区域可以包括至少一个光导。

公开(公告)号：US08916781B2

公开(公告)日：2014-12-23

申请号：US13296785

申请日：2011-11-15

申请人： Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Cyprian Emeka Uzoh

发明人： Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Cyprian Emeka Uzoh

IPC分类号： H05K1/11 ,  H05K1/03 ,  H05K1/09 ,  H05K1/00 ,  H01L23/498 ,  H01R12/71 ,  H05K3/42

CPC分类号： H05K1/0271 ,  H01L23/49827 ,  H01L2924/0002 ,  H01R12/714 ,  H05K1/114 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09645 ,  H05K2201/10378 ,  H05K2203/0242 ,  H05K2203/025 ,  Y10T29/49165 ,  H01L2924/00

摘要： An interconnection component includes an element with an opening, a plurality of conductors electrically insulted from one another extending through the opening, and a plurality of second contacts electrically insulated from one another. The element is comprised of a material having a coefficient of thermal expansion of less than 10 parts per million per degree Celsius. At least some of the conductors extend along at least one inner surface of the opening. The conductors define a plurality of wettable first contacts at the first surface. The first contacts are at least partially aligned with the opening in a direction of the thickness and electrically insulated from one another.

摘要翻译： 互连部件包括具有开口的元件，延伸穿过开口彼此电绝缘的多个导体以及彼此电绝缘的多个第二触点。 该元件由热膨胀系数小于10ppm /℃的材料构成。 至少一些导体沿开口的至少一个内表面延伸。 导体在第一表面限定多个可润湿的第一接触。 第一触点在厚度方向上与开口至少部分地对齐，并且彼此电绝缘。