公开(公告)号：US20120033404A1

公开(公告)日：2012-02-09

申请号：US13271169

申请日：2011-10-11

申请人： CHIA-HAO WU ,  CHUN-CHANG WU

发明人： CHIA-HAO WU ,  CHUN-CHANG WU

IPC分类号： F21V9/16 ,  F21V21/00

CPC分类号： F21K9/64 ,  F21K9/20 ,  F21K9/232 ,  F21V3/00 ,  F21Y2101/00 ,  F21Y2115/10 ,  H01L33/507 ,  H01L33/508 ,  H01L33/56 ,  H01L2933/0091

摘要： An illumination device includes a base, a light-emitting module, a first layer, and a second layer. The light-emitting module is disposed on the base for generating a progressive-type light-emitting intensity. The first layer encapsulates the light-emitting module. The second layer encloses the first layer. The second layer has a progressive-type thickness corresponding to the progressive-type light-emitting intensity, and both the progressive-type light-emitting intensity and the progressive-type thickness are decreased or increased gradually, thus the progressive-type light-emitting intensity can be transformed into the same light-emitting intensity through the progressive-type thickness of the second layer.

摘要翻译： 照明装置包括基座，发光模块，第一层和第二层。 发光模块设置在基座上，用于产生渐进型发光强度。 第一层封装发光模块。 第二层包围第一层。 第二层具有与渐进型发光强度对应的渐进式厚度，并且渐进式发光强度和渐进式厚度都逐渐减小或逐渐增加，因此逐行发光 强度可以通过第二层的渐进式厚度变换成相同的发光强度。

公开(公告)号：US20130087816A1

公开(公告)日：2013-04-11

申请号：US13557403

申请日：2012-07-25

申请人： CHIA-HAO WU ,  CHUN-CHANG WU

发明人： CHIA-HAO WU ,  CHUN-CHANG WU

IPC分类号： H01L33/50

CPC分类号： F21K9/64 ,  F21K9/20 ,  F21K9/232 ,  F21V3/00 ,  F21Y2101/00 ,  F21Y2115/10 ,  H01L33/507 ,  H01L33/508 ,  H01L33/56 ,  H01L2933/0091

摘要： An illumination device includes a base, a light-emitting module, a first layer, and a second layer. The light-emitting module is disposed on the base for generating a progressive-type light-emitting intensity. The first layer encapsulates the light-emitting module. The second layer encloses the first layer. The second layer has a progressive-type thickness corresponding to the progressive-type light-emitting intensity, and both the progressive-type light-emitting intensity and the progressive-type thickness are decreased or increased gradually, thus the progressive-type light-emitting intensity can be transformed into the same light-emitting intensity through the progressive-type thickness of the second layer.

公开(公告)号：US20130201465A1

公开(公告)日：2013-08-08

申请号：US13490422

申请日：2012-06-06

申请人： YAN-YI WANG ,  CHIA-HAO WU ,  MING-KUN WENG ,  CHUNG-YU CHOU

发明人： YAN-YI WANG ,  CHIA-HAO WU ,  MING-KUN WENG ,  CHUNG-YU CHOU

IPC分类号： G03B27/58

CPC分类号： H01L24/78 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/48 ,  H01L2224/78701 ,  H01L2224/7898 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A positioning system includes a first working platform, a second working platform spaced apart from the first working platform, and a carrier. The carrier is fixed on the first working platform or the second working platform. The carrier has at least one fixing member for fixing the substrate onto the carrier and fixing the mask onto the substrate. The substrate has at least one fixing hole formed thereon for receiving the fixing member, and the mask has at least one positioning hole formed thereon in alignment with the fixing hole. The fixing member is capable of inserting sequentially through the fixing hole of the substrate and the positioning hole of the mask.

摘要翻译： 定位系统包括第一工作平台，与第一工作平台间隔开的第二工作平台和托架。 承运人固定在第一工作平台或第二工作平台上。 载体具有至少一个固定构件，用于将基底固定到载体上并将掩模固定到基底上。 基板具有形成在其上的至少一个固定孔，用于接收固定构件，并且掩模具有与固定孔对准的至少一个定位孔。 固定构件能够依次穿过基板的固定孔和掩模的定位孔。

公开(公告)号：US20120194067A1

公开(公告)日：2012-08-02

申请号：US13447129

申请日：2012-04-13

申请人： CHIA-HAO WU ,  TIEN-YU LEE

发明人： CHIA-HAO WU ,  TIEN-YU LEE

IPC分类号： H01J1/70

CPC分类号： H01L33/505 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2924/00014

摘要： A LED device includes a base structure having a receiving space, a light-emitting chip, an encapsulating structure, and a phosphor layer. The receiving space is defined by an inner bottom surface of the base structure and an inner side wall surrounding the inner bottom surface. The light-emitting chip is mounted on the bottom of the receiving space. The encapsulating structure is filled into the receiving space to cover the light-emitting chip. The phosphor layer is formed on the encapsulating structure. The dimension of the phosphor layer is more than the dimension of the receiving space and less than 1.5 times that of the receiving space, so as to mount on the top surface of the base structure.

摘要翻译： LED器件包括具有接收空间的基底结构，发光芯片，封装结构和荧光体层。 接收空间由基底结构的内底表面和围绕内底表面的内侧壁限定。 发光芯片安装在接收空间的底部。 将封装结构填充到容纳空间中以覆盖发光芯片。 磷光体层形成在封装结构上。 荧光体层的尺寸大于接收空间的尺寸，小于接收空间的1.5倍，以便安装在基底结构的顶表面上。

公开(公告)号：US20130234177A1

公开(公告)日：2013-09-12

申请号：US13531462

申请日：2012-06-22

申请人： KUO-MING CHIU ,  TSUNG-CHI LEE ,  CHIA-HAO WU ,  MENG-SUNG CHOU

发明人： KUO-MING CHIU ,  TSUNG-CHI LEE ,  CHIA-HAO WU ,  MENG-SUNG CHOU

IPC分类号： H01L33/64 ,  H01L33/60

CPC分类号： H01L25/0753 ,  H01L33/60 ,  H01L33/642 ,  H01L2924/00 ,  H01L2924/0002

摘要： The present invention relates to a package structure for light-emitting diodes (LEDs). The package structure includes a substrate, a heat-dissipating structure disposed on the substrate, and a plurality of LED chips uniformly disposed on the heat-dissipating structure. The heat-dissipating structure has a central portion and at least one peripheral portion surrounding thereof. The central portion is capable of dissipating more heat than the peripheral portion. Thus, the temperature difference between the LED chips disposed on the central portion and the LED chips disposed on the peripheral portion can be reduced.

摘要翻译： 本发明涉及发光二极管（LED）的封装结构。 封装结构包括基板，设置在基板上的散热结构以及均匀地设置在散热结构上的多个LED芯片。 散热结构具有中心部分和围绕其的至少一个周边部分。 中心部分能够比周边部分散发更多的热量。 因此，可以减小设置在中心部分上的LED芯片与设置在周边部分上的LED芯片之间的温差。

公开(公告)号：US20130105835A1

公开(公告)日：2013-05-02

申请号：US13558557

申请日：2012-07-26

申请人： CHIA-HAO WU ,  CHEN-HSIU LIN ,  MING-KUN WENG ,  YI-CHIEN CHANG

发明人： CHIA-HAO WU ,  CHEN-HSIU LIN ,  MING-KUN WENG ,  YI-CHIEN CHANG

IPC分类号： H01L33/08

CPC分类号： H01L25/0753 ,  F21Y2113/17 ,  F21Y2115/10 ,  H01L33/486 ,  H01L33/505 ,  H01L33/58 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light-emitting diode device includes: a substrate; an upper metal film disposed on an upper surface of the substrate, and including a chip-mounting region and a plurality of conductive pad regions; two first light-emitting chips and two second light-emitting chips disposed on the chip-mounting region, the first and second light-emitting chips being disposed alternately, two of the first and second light-emitting chips being opposite to each other; a fluorescent layer coated on the first light-emitting chips; and a lens disposed on the substrate to cover the first and second light-emitting chips and the fluorescent layer.

摘要翻译： 发光二极管装置包括：基板; 上金属膜，其设置在所述基板的上表面上，并且包括芯片安装区域和多个导电焊盘区域; 两个第一发光芯片和设置在芯片安装区域上的两个第二发光芯片，第一和第二发光芯片交替布置，第一和第二发光芯片中的两个彼此相对; 涂覆在第一发光芯片上的荧光层; 以及设置在基板上以覆盖第一和第二发光芯片和荧光层的透镜。