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公开(公告)号：US07885492B2
公开(公告)日：2011-02-08
申请号：US10317935
申请日：2002-12-11
申请人： David F. Welch , Vincent G. Dominic , Fred A. Kish, Jr. , Mark J. Missey , Radhakrishnan L. Nagarajan , Atul Mathur , Frank H. Peters , Robert B. Taylor , Matthew L. Mitchell , Alan C. Nilsson , Stephen G. Grubb , Richard P. Schneider , Charles H. Joyner , Ting-Kuang Chiang , Marco E. Sosa
发明人： David F. Welch , Vincent G. Dominic , Fred A. Kish, Jr. , Mark J. Missey , Radhakrishnan L. Nagarajan , Atul Mathur , Frank H. Peters , Robert B. Taylor , Matthew L. Mitchell , Alan C. Nilsson , Stephen G. Grubb , Richard P. Schneider , Charles H. Joyner , Ting-Kuang Chiang , Marco E. Sosa
IPC分类号： G02B6/12
CPC分类号： G02B6/12011 , B82Y20/00 , G01R31/31728 , G01R31/318511 , G02B6/12004 , G02B6/12007 , G02B6/12019 , G02B6/12021 , G02B6/12023 , G02B6/12026 , G02B6/12028 , G02B6/12033 , G02B6/131 , G02B6/136 , G02B6/4204 , G02F1/01725 , G02F2001/0175 , G02F2001/01758 , G02F2203/69 , H01L31/125 , H01S5/0014 , H01S5/0085 , H01S5/02248 , H01S5/026 , H01S5/0262 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/06256 , H01S5/06258 , H01S5/0683 , H01S5/06832 , H01S5/12 , H01S5/1228 , H01S5/2077 , H01S5/22 , H01S5/3408 , H01S5/4031 , H01S5/4087 , H01S5/50 , H04B10/2914 , H04B10/50 , H04J14/02 , H04J14/0246 , H04J14/025 , H04J14/0258 , H04J14/0265 , H04J14/0276 , H04J14/0282
摘要： A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
摘要翻译： 一种包括调制源阵列的光子集成电路（PIC）芯片，每个调制源提供在不同于其它调制源的信道波长的信道波长处的调制信号输出，以及具有光耦合到接收到的所有信号输出的输入的波长选择性组合器 并从芯片提供输出波导上的组合输出信号。 调制源，组合器和输出波导均集成在同一芯片上。
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2.发明授权Method of reducing insertion loss in a transition region between a plurality of input or output waveguides to a free space coupler region 有权将多个输入或输出波导之间的过渡区域中的插入损耗减小到自由空间耦合器区域的方法公开(公告)号：US07625771B2
公开(公告)日：2009-12-01
申请号：US11358784
申请日：2006-02-21
IPC分类号： H01L21/00
CPC分类号： G02B6/12011 , G02B6/12016 , G02B6/12019 , G02B6/12023 , G02B6/132 , G02B6/42 , G02B2006/12097 , G02B2006/12176 , H01S5/026 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/1014 , H01S5/2213 , H01S5/2231 , H01S5/227 , H01S5/4031 , H01S5/4087
摘要： A method for reducing insertion loss in a transition region between a plurality of input or output waveguides to a free space coupler region in a photonic integrated circuit (PIC) includes the steps of forming a passivation layer over the waveguides and region and forming the passivation overlayer such that it monotonically increases in thickness through the transition region to the free space coupler region.
摘要翻译： 一种用于将多个输入或输出波导之间的过渡区域中的插入损耗减小到光子集成电路（PIC）中的自由空间耦合器区域的方法包括以下步骤：在波导和区域上形成钝化层并形成钝化覆盖层 使得其通过过渡区域到自由空间耦合器区域的厚度单调增加。
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3.发明授权In-wafer testing of integrated optical components in photonic integrated circuits (PICs) 有权光子集成电路（PIC）中集成光学元件的晶片内测试公开(公告)号：US07006719B2
公开(公告)日：2006-02-28
申请号：US10385574
申请日：2003-03-10
申请人： Charles H. Joyner , Mark J. Missey , Radhakrishnan L. Nagarajan , Frank H. Peters , Mehrdad Ziari , Fred A. Kish, Jr.
发明人： Charles H. Joyner , Mark J. Missey , Radhakrishnan L. Nagarajan , Frank H. Peters , Mehrdad Ziari , Fred A. Kish, Jr.
CPC分类号： G02B6/12011 , G02B6/12016 , G02B6/12019 , G02B6/12023 , G02B6/132 , G02B6/42 , G02B2006/12097 , G02B2006/12176 , H01S5/026 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/1014 , H01S5/2213 , H01S5/2231 , H01S5/227 , H01S5/4031 , H01S5/4087
摘要： Disclosed are apparatus and methods of reducing insertion loss, passivation, planarization and in-wafer testing of integrated optical components and in-wafer chips in photonic integrated circuits (PICs).
摘要翻译： 公开了减少光子集成电路（PIC）中的集成光学部件和晶片内芯片的插入损耗，钝化，平面化和晶片内测试的装置和方法。
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4.发明授权Transmitter photonic integrated circuits (TXPICS) with directly modulated lasers and wavelength selective combiners 有权具有直接调制激光器和波长选择组合器的发射机光子集成电路（TXPICS）公开(公告)号：US07512295B2
公开(公告)日：2009-03-31
申请号：US11766077
申请日：2007-06-20
申请人： David F. Welch , Vincent G. Dominic , Fred A. Kish, Jr. , Mark J. Missey , Radhakrishnan L. Nagarajan , Atul Mathur , Frank H. Peters , Robert B. Taylor , Matthew L. Mitchell , Alan C. Nilsson , Stephen G. Grubb , Richard P. Schneider , Charles H. Joyner , Jonas Webjorn , Drew D. Perkins
发明人： David F. Welch , Vincent G. Dominic , Fred A. Kish, Jr. , Mark J. Missey , Radhakrishnan L. Nagarajan , Atul Mathur , Frank H. Peters , Robert B. Taylor , Matthew L. Mitchell , Alan C. Nilsson , Stephen G. Grubb , Richard P. Schneider , Charles H. Joyner , Jonas Webjorn , Drew D. Perkins
IPC分类号： G02B6/12
CPC分类号： G02B6/12011 , B82Y20/00 , G01R31/31728 , G01R31/318511 , G02B6/12004 , G02B6/12007 , G02B6/12019 , G02B6/12021 , G02B6/12023 , G02B6/12026 , G02B6/12028 , G02B6/12033 , G02B6/131 , G02B6/136 , G02B6/4204 , G02F1/01725 , G02F2001/0175 , G02F2001/01758 , G02F2203/69 , H01L31/125 , H01S5/0014 , H01S5/0085 , H01S5/02248 , H01S5/026 , H01S5/0262 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/06256 , H01S5/06258 , H01S5/0683 , H01S5/06832 , H01S5/12 , H01S5/1228 , H01S5/2077 , H01S5/22 , H01S5/3408 , H01S5/4031 , H01S5/4087 , H01S5/50 , H04B10/2914 , H04B10/50 , H04J14/02 , H04J14/0246 , H04J14/025 , H04J14/0258 , H04J14/0265 , H04J14/0276 , H04J14/0282
摘要： A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
摘要翻译： 一种包括调制源阵列的光子集成电路（PIC）芯片，每个调制源提供在不同于其它调制源的信道波长的信道波长处的调制信号输出，以及具有光耦合到接收到的所有信号输出的输入的波长选择性组合器 并从芯片提供输出波导上的组合输出信号。 调制源，组合器和输出波导均集成在同一芯片上。
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5.发明授权Method of optimizing optical channel signal demultiplexing in a monolithic receiver photonic integrated circuit (RxPIC) 有权在单片接收机光子集成电路（RxPIC）中优化光信道信号解复用的方法公开(公告)号：US07158699B2
公开(公告)日：2007-01-02
申请号：US11136735
申请日：2005-05-24
申请人： David F. Welch , Radhakrishnan L. Nagarajan , Fred A. Kish, Jr. , Mark J. Missey , Vincent G. Dominic , Atul Mathur , Frank H. Peters , Charles H. Joyner
发明人： David F. Welch , Radhakrishnan L. Nagarajan , Fred A. Kish, Jr. , Mark J. Missey , Vincent G. Dominic , Atul Mathur , Frank H. Peters , Charles H. Joyner
CPC分类号： H04B10/2914 , B82Y20/00 , G02B6/12004 , G02B6/12007 , G02B6/12011 , G02B6/12019 , G02B6/12023 , G02B6/12026 , G02B6/12028 , G02B6/1203 , G02B6/12033 , G02B6/4249 , G02F1/01725 , G02F2001/0175 , G02F2001/01758 , H01S5/026 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/0425 , H01S5/06256 , H01S5/06258 , H01S5/0683 , H01S5/101 , H01S5/1014 , H01S5/12 , H01S5/1228 , H01S5/183 , H01S5/2077 , H01S5/22 , H01S5/2224 , H01S5/227 , H01S5/3404 , H01S5/3408 , H01S5/34306 , H01S5/4025 , H01S5/4031 , H01S5/4087 , H01S5/50 , H01S5/5072 , H04B10/25 , H04B10/50 , H04B10/675 , H04J14/02
摘要： A method is disclosed for optimizing optical channel signal demultiplexing in a monolithic receiver photonic integrated circuit (RxPIC) chip by providing an integrated channel signal demultiplexing with multiple waveguide input verniers provided to an WDM signal demultiplexer. The RxPIC chip may optionally include an integrated amplifier in at least some of the waveguide input verniers. The RxPIC chip may be comprised of, in monolithic form, a plurality of optional semiconductor optical amplifiers (SOAs) at the input of the chip to receive a WDM signal from an optical link which is provided along a plurality of waveguide input verniers to an integrated optical demultiplexer, such as, but not limited to, an arrayed waveguide grating (AWG), as a WDM signal demultiplexer. Thus, optical outputs from the respective semiconductor laser amplifiers are provided as vernier inputs to the optical demultiplexer forming a plurality of input verniers at the input to the optical demultiplexer. One of the vernier inputs to the chip is selected for operation in the RxPIC chip that corresponds to an optimum performance in matching a WDM channel signal wavelength grid of the received WDM signal to a wavelength grid of the on-chip optical demultiplexer.
摘要翻译： 公开了一种用于通过提供给提供给WDM信号解复用器的多个波导输入游标的集成信道信号解复用来优化单片接收机光子集成电路（RxPIC）芯片中的光信道信号解复用的方法。 RxPIC芯片可以可选地在至少一些波导输入游标中包括集成放大器。 RxPIC芯片可以以单片形式包括在芯片的输入端处的多个可选的半导体光放大器（SOA），以从沿着多个波导输入游标提供的集成的光链路接收WDM信号 光解复用器，例如但不限于阵列波导光栅（AWG），作为WDM信号解复用器。 因此，来自各个半导体激光放大器的光输出被提供为在光解复用器的输入处形成多个输入游标的光解复用器的游标输入。 选择芯片的游标输入之一用于RxPIC芯片中的操作，其对应于将所接收的WDM信号的WDM信道信号波长网格与芯片上的光解复用器的波长网格匹配的最佳性能。
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6.发明授权Method for forming and apparatus comprising optical waveguides leading to a free space coupler region 有权用于形成的方法和包括通向自由空间耦合器区域的光波导的设备公开(公告)号：US07027703B2
公开(公告)日：2006-04-11
申请号：US11018149
申请日：2004-12-21
申请人： Charles H. Joyner , Mark J. Missey , Radhakrishnan L. Nagarajan , Frank H. Peters , Mehrdad Ziari , Fred A. Kish, Jr.
发明人： Charles H. Joyner , Mark J. Missey , Radhakrishnan L. Nagarajan , Frank H. Peters , Mehrdad Ziari , Fred A. Kish, Jr.
CPC分类号： G02B6/12011 , G02B6/12016 , G02B6/12019 , G02B6/12023 , G02B6/132 , G02B6/42 , G02B2006/12097 , G02B2006/12176 , H01S5/026 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/1014 , H01S5/2213 , H01S5/2231 , H01S5/227 , H01S5/4031 , H01S5/4087
摘要： A method for forming and apparatus comprising a free space coupler region having a plurality of optical waveguides coupled to the space coupler region at an interface region, the waveguides converging with one another to the interface region, and a trench formed between adjacent waveguides, the depth of the trench or trenches extending from an outer point to the interface region and monotonically decreasing in depth from the outer point to the interface region.
摘要翻译： 一种用于形成和装置的方法，包括具有多个光波导的自由空间耦合器区域，所述多个光波导在界面区域处耦合到所述空间耦合器区域，所述波导彼此会聚到所述界面区域，以及在相邻波导之间形成的沟槽，所述深度 的沟槽或沟槽从外部点延伸到界面区域，并且从外部点到界面区域的深度单调递减。
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7.发明申请MONOLITHIC TRANSMITTER PHOTONIC INTEGRATED CIRCUIT (TXPIC) WITH A TRANSVERSELY DISPOSED OUTPUT 有权具有横向输出输出的单片发射器光电集成电路（TXPIC）公开(公告)号：US20090022452A1
公开(公告)日：2009-01-22
申请号：US12240543
申请日：2008-09-29
申请人： David F. Welch , Vincent G. Dominic , Fred A. Kish, JR. , Mark J. Missey , Radhakrishnan L. Nagarajan , Atul Mathur , Frank H. Peters , Robert B. Taylor , Matthew L. Mitchell , Alan C. Nilsson , Stephen G. Grubb , Richard P. Schneider , Charles H. Joyner , Jonas Webjorn , Drew D. Perkins
发明人： David F. Welch , Vincent G. Dominic , Fred A. Kish, JR. , Mark J. Missey , Radhakrishnan L. Nagarajan , Atul Mathur , Frank H. Peters , Robert B. Taylor , Matthew L. Mitchell , Alan C. Nilsson , Stephen G. Grubb , Richard P. Schneider , Charles H. Joyner , Jonas Webjorn , Drew D. Perkins
IPC分类号： G02B6/12
CPC分类号： G02B6/12004 , G02B6/12007 , G02B6/12019 , G02B6/12023 , G02B6/12033 , G02B6/131 , G02B6/136 , H01S5/026 , H01S5/0262 , H01S5/0265 , H01S5/0268 , H01S5/0612 , H01S5/12 , H01S5/4025 , H01S5/4031 , H01S5/4087 , H01S5/50 , H04J14/02
摘要： A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.
摘要翻译： 一种包括调制源阵列的光子集成电路（PIC）芯片，每个调制源提供在不同于其它调制源的信道波长的信道波长处的调制信号输出，以及具有光耦合到接收到的所有信号输出的输入的波长选择性组合器 并从芯片提供输出波导上的组合输出信号。 调制源，组合器和输出波导均集成在同一芯片上。
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8.发明授权Formation of cleaved grooves in a passivation layer formed over a surface of a wafer prior to wafer singulation 有权在晶片切割之前在晶片的表面上形成钝化层中的切割槽的形成公开(公告)号：US07280715B2
公开(公告)日：2007-10-09
申请号：US11362952
申请日：2006-02-27
CPC分类号： G02B6/12011 , G02B6/12016 , G02B6/12019 , G02B6/12023 , G02B6/132 , G02B6/42 , G02B2006/12097 , G02B2006/12176 , H01S5/026 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/1014 , H01S5/2213 , H01S5/2231 , H01S5/227 , H01S5/4031 , H01S5/4087
摘要： Cleaved grooves, also referred to herein as “cleave streets”, are formed exclusively in a wafer passivation layer overlaying a wafer to provide for correctly aligned and sharp cleaves prior to singulation of the wafer into separate die or chips. The deployment of cleave streets is applicable to both Group III–V-base wafers, such as InP-based wafers with photonic integrated circuits (PICs), and silicon-based wafers with integrated circuits where such wafers utilize a passivating layer
摘要翻译： 在本文中也称为“切割街道”的切割凹槽仅专门形成在覆盖晶片的晶片钝化层中，以在将晶片分离成单独的芯片或芯片之前提供正确对准和尖锐的切割。 劈裂街道的部署适用于III-V族晶圆，例如具有光子集成电路（PIC）的基于InP的晶片，以及具有集成电路的硅基晶片，其中这些晶片利用钝化层
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9.发明授权In-wafer testing of integrated optical components in photonic integrated circuits (PICs) 有权光子集成电路（PIC）中集成光学元件的晶片内测试公开(公告)号：US07135382B2
公开(公告)日：2006-11-14
申请号：US11014410
申请日：2004-12-16
申请人： Charles H. Joyner , Mark J. Missey , Radhakrishnan L. Nagarajan , Frank H. Peters , Mehrdad Ziari , Fred A. Kish, Jr.
发明人： Charles H. Joyner , Mark J. Missey , Radhakrishnan L. Nagarajan , Frank H. Peters , Mehrdad Ziari , Fred A. Kish, Jr.
IPC分类号： H01L21/30
CPC分类号： G02B6/12011 , G02B6/12016 , G02B6/12019 , G02B6/12023 , G02B6/132 , G02B6/42 , G02B2006/12097 , G02B2006/12176 , H01S5/026 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/1014 , H01S5/2213 , H01S5/2231 , H01S5/227 , H01S5/4031 , H01S5/4087
摘要： Disclosed is a method of in-wafer testing of integrated optical components and in-wafer chips with photonic integrated circuits (PICs).
摘要翻译： 公开了一种使用光子集成电路（PIC）的集成光学部件和晶片内芯片的晶片内测试的方法。
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10.发明授权Benzocyclobutene polymer (BCB) as a passivation layer for optical passive elements 有权苯并环丁烯聚合物（BCB）作为光无源元件的钝化层公开(公告)号：US07065266B2
公开(公告)日：2006-06-20
申请号：US11242519
申请日：2005-10-03
CPC分类号： G02B6/12011 , G02B6/12016 , G02B6/12019 , G02B6/12023 , G02B6/132 , G02B6/42 , G02B2006/12097 , G02B2006/12176 , H01S5/026 , H01S5/0264 , H01S5/0265 , H01S5/0268 , H01S5/1014 , H01S5/2213 , H01S5/2231 , H01S5/227 , H01S5/4031 , H01S5/4087
摘要： An InP-based photonic integrated circuit (PIC) includes an optical passive element in the circuit with no bias current applied to such an element. A passivation cladding layer overlies a surface of the optical passive element where the passivation layer comprises benzocyclobutene polymer or BCB.
摘要翻译： 基于InP的光子集成电路（PIC）包括电路中的无源元件，其中没有偏置电流施加到这种元件。 钝化覆层位于钝化层包括苯并环丁烯聚合物或BCB的光无源元件的表面上。
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