公开(公告)号：US08952513B2

公开(公告)日：2015-02-10

申请号：US13279545

申请日：2011-10-24

申请人： Choong-bin Yim ,  Dae-Young Choi ,  Mi-Yeon Kim ,  Ji-yong Park

发明人： Choong-bin Yim ,  Dae-Young Choi ,  Mi-Yeon Kim ,  Ji-yong Park

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/28 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10 ,  H01L23/31 ,  H01L23/538

CPC分类号： H01L23/49816 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L25/105 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/056 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24105 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/82 ,  H01L2224/82105 ,  H01L2225/0651 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/15322 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stack type semiconductor package and a method of fabricating the stack type semiconductor package. The stack type semiconductor package includes: a lower semiconductor package including a circuit board, a semiconductor chip which is disposed on an upper surface of the circuit board, via-pads which are arrayed on the upper surface of the circuit board around the semiconductor chip, and an encapsulation layer which encapsulates the upper surface of the circuit board and has via-holes through which the via-pads are exposed; and an upper semiconductor package which is stacked on the encapsulation layer, is electrically connected to the lower semiconductor package, and comprises internal connection terminals which are formed on a lower surface of the upper semiconductor package.

摘要翻译： 堆叠型半导体封装以及叠层型半导体封装的制造方法。 叠层型半导体封装包括：下半导体封装，包括电路板，设置在电路板的上表面上的半导体芯片，排列在电路板的上表面周围的半导体芯片的通孔焊盘， 以及封装层，其封装电路板的上表面并具有通孔，通孔穿过该通孔; 并且层叠在封装层上的上半导体封装电连接到下半导体封装，并且包括形成在上半导体封装的下表面上的内部连接端子。

公开(公告)号：US20100078791A1

公开(公告)日：2010-04-01

申请号：US12547662

申请日：2009-08-26

申请人： Choong-bin Yim ,  Tae-je Cho

发明人： Choong-bin Yim ,  Tae-je Cho

IPC分类号： H01L25/11 ,  H01L23/31

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01049

摘要： A semiconductor package includes a substrate which includes a chip mounting unit disposed on a first surface thereof and a pad forming unit disposed on an outer region of the chip mounting unit. The semiconductor package further includes a plurality of pads disposed on the pad forming unit of the substrate, a semiconductor chip disposed on the chip mounting unit of the substrate, a dam disposed on the first surface of the substrate between the semiconductor chip and the pad forming unit, and wherein the dam separates at least a portion of the pads from the semiconductor chip. In addition, the semiconductor package further includes an underfill material disposed between an active surface of the semiconductor chip and the first surface of the substrate and wherein an upper surface of the dam is rounded due to surface tension.

摘要翻译： 半导体封装包括：衬底，其包括设置在其第一表面上的芯片安装单元和设置在芯片安装单元的外部区域上的焊盘形成单元。 半导体封装还包括设置在基板的焊盘形成单元上的多个焊盘，设置在基板的芯片安装单元上的半导体芯片，设置在半导体芯片和焊盘形成之间的基板的第一表面上的坝 单元，并且其中所述坝将所述焊盘的至少一部分与所述半导体芯片分离。 此外，半导体封装还包括设置在半导体芯片的有源表面和基板的第一表面之间的底部填充材料，并且由于表面张力，坝的上表面被倒圆。

公开(公告)号：US20110275177A1

公开(公告)日：2011-11-10

申请号：US13182588

申请日：2011-07-14

申请人： Choong-bin Yim ,  Tae-je Cho

发明人： Choong-bin Yim ,  Tae-je Cho

IPC分类号： H01L21/58

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01049

摘要： A semiconductor package includes a substrate which includes a chip mounting unit disposed on a first surface thereof and a pad forming unit disposed on an outer region of the chip mounting unit. The semiconductor package further includes a plurality of pads disposed on the pad forming unit of the substrate, a semiconductor chip disposed on the chip mounting unit of the substrate, a dam disposed on the first surface of the substrate between the semiconductor chip and the pad forming unit, and wherein the dam separates at least a portion of the pads from the semiconductor chip. In addition, the semiconductor package further includes an underfill material disposed between an active surface of the semiconductor chip and the first surface of the substrate and wherein an upper surface of the dam is rounded due to surface tension.

摘要翻译： 半导体封装包括：衬底，其包括设置在其第一表面上的芯片安装单元和设置在芯片安装单元的外部区域上的焊盘形成单元。 半导体封装还包括设置在基板的焊盘形成单元上的多个焊盘，设置在基板的芯片安装单元上的半导体芯片，设置在半导体芯片和焊盘形成之间的基板的第一表面上的坝 单元，并且其中所述坝将所述焊盘的至少一部分与所述半导体芯片分离。 此外，半导体封装还包括设置在半导体芯片的有源表面和基板的第一表面之间的底部填充材料，并且由于表面张力，坝的上表面被倒圆。

公开(公告)号：US08187921B2

公开(公告)日：2012-05-29

申请号：US13182588

申请日：2011-07-14

申请人： Choong-bin Yim ,  Tae-je Cho

发明人： Choong-bin Yim ,  Tae-je Cho

IPC分类号： H01L23/02

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01049

摘要： A semiconductor package includes a substrate which includes a chip mounting unit disposed on a first surface thereof and a pad forming unit disposed on an outer region of the chip mounting unit. The semiconductor package further includes a plurality of pads disposed on the pad forming unit of the substrate, a semiconductor chip disposed on the chip mounting unit of the substrate, a dam disposed on the first surface of the substrate between the semiconductor chip and the pad forming unit, and wherein the dam separates at least a portion of the pads from the semiconductor chip. In addition, the semiconductor package further includes an underfill material disposed between an active surface of the semiconductor chip and the first surface of the substrate and wherein an upper surface of the dam is rounded due to surface tension.

摘要翻译： 半导体封装包括：衬底，其包括设置在其第一表面上的芯片安装单元和设置在芯片安装单元的外部区域上的焊盘形成单元。 半导体封装还包括设置在基板的焊盘形成单元上的多个焊盘，设置在基板的芯片安装单元上的半导体芯片，设置在半导体芯片和焊盘形成之间的基板的第一表面上的坝 单元，并且其中所述坝将所述焊盘的至少一部分与所述半导体芯片分离。 此外，半导体封装还包括设置在半导体芯片的有源表面和基板的第一表面之间的底部填充材料，并且由于表面张力，坝的上表面被倒圆。

公开(公告)号：US07999368B2

公开(公告)日：2011-08-16

申请号：US12547662

申请日：2009-08-26

申请人： Choong-bin Yim ,  Tae-je Cho

发明人： Choong-bin Yim ,  Tae-je Cho

IPC分类号： H01L23/02

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01049

摘要： A semiconductor package includes a substrate which includes a chip mounting unit disposed on a first surface thereof and a pad forming unit disposed on an outer region of the chip mounting unit. The semiconductor package further includes a plurality of pads disposed on the pad forming unit of the substrate, a semiconductor chip disposed on the chip mounting unit of the substrate, a dam disposed on the first surface of the substrate between the semiconductor chip and the pad forming unit, and wherein the dam separates at least a portion of the pads from the semiconductor chip. In addition, the semiconductor package further includes an underfill material disposed between an active surface of the semiconductor chip and the first surface of the substrate and wherein an upper surface of the dam is rounded due to surface tension.

摘要翻译： 半导体封装包括：衬底，其包括设置在其第一表面上的芯片安装单元和设置在芯片安装单元的外部区域上的焊盘形成单元。 半导体封装还包括设置在基板的焊盘形成单元上的多个焊盘，设置在基板的芯片安装单元上的半导体芯片，设置在半导体芯片和焊盘形成之间的基板的第一表面上的坝 单元，并且其中所述坝将所述焊盘的至少一部分与所述半导体芯片分离。 此外，半导体封装还包括设置在半导体芯片的有源表面和基板的第一表面之间的底部填充材料，并且由于表面张力，坝的上表面被倒圆。