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公开(公告)号：US20160369106A1
公开(公告)日：2016-12-22
申请号：US14901905
申请日：2014-06-12
Applicant: DIC Corporation
Inventor： Sadamu NAGAHAMA , Jun SHIRAKAMI
CPC classification number: C09D5/024 , B05D1/02 , B05D1/18 , B05D1/28 , B05D1/305 , C09D5/02 , C09D5/082 , C09D7/40 , C09D133/14 , C08F2220/1825 , C08F220/14 , C08F220/34 , C08F220/06
Abstract: The present invention provides an aqueous coating agent including a vinyl polymer (A) having a basic nitrogen atom-containing group and a carboxylic group, a quaternary ammonium salt (B), and an aqueous medium (C). Particularly, the present invention provides an aqueous coating agent including a compound represented by General Formula (1) below as the quaternary ammonium salt (B). The aqueous coating agent has excellent adhesiveness, warm water resistance, corrosion resistance, and chemical resistance, and can form a film that is capable of preventing the deterioration of various substrates. In General Formula (1), R1 to R4 each independently represent an alkyl group having 1 to 20 carbon atoms or an aryl group.
Abstract translation: 通式（1）中，R 1〜R 4各自独立地表示碳原子数1〜20的烷基或芳基。
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2.发明申请LAMINATE, CONDUCTIVE PATTERN, ELECTRICAL CIRCUIT, AND METHOD FOR PRODUCING LAMINATE 有权层压体，导电图案，电路及其制造方法公开(公告)号：US20150359095A1
公开(公告)日：2015-12-10
申请号：US14762783
申请日：2014-01-21
Applicant: DIC CORPORATION
Inventor： Akira MURAKAWA , Jun SHIRAKAMI , Wataru FUJIKAWA , Yukie SAITOU
CPC classification number: H05K1/092 , C08J7/045 , C08J2379/08 , C08J2475/04 , C08J2475/14 , C09D5/00 , H05K1/0393 , H05K3/246 , H05K3/386 , H05K3/4664 , Y10T428/12549
Abstract: The present invention provides a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.
Abstract translation: 本发明提供一种叠层体，其中层叠至少一层包括载体，底漆层，第一导电层，绝缘层和第二导电层的层，其中绝缘层通过涂覆至少一部分 或整个第一导电层的表面与树脂组合物并干燥树脂组合物; 并且第二导电层包括通过用含有导电物质的流体涂覆绝缘层的表面的一部分或整体而形成的第二电镀种子层，以及形成在第二镀覆种子层的表面上的第二镀层。 该层压板在层间具有高粘合性，并且即使在暴露于高温高湿环境下也能够保持高粘合性。
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公开(公告)号：US20190070631A1
公开(公告)日：2019-03-07
申请号：US16083342
申请日：2017-03-07
Applicant: DIC Corporation
Inventor： Wataru FUJIKAWA , Jun SHIRAKAMI , Norimasa FUKAZAWA
Abstract: Provided is a method for producing a laminate in which a substrate (A) comprising a resin composition containing polyphenylene sulfide (a1), a primer resin layer (B), a metal layer (C), and a metal plating layer (D) are sequentially stacked, wherein the method is characterized by comprising: a first step of applying a fluid material containing a primer resin to the surface of the substrate (A) by an immersion method to form a primer resin layer (B); a second step of applying a fluid material containing metal particles to the surface of the primer resin layer (B) by an immersion method to form a metal layer (C); and a third step of forming a metal plating layer (D) on the surface of the metal layer (C) by an electroplating method, an electroless plating method, or a combination thereof. By the method for producing a laminate, a metal film can be easily formed with high adhesion on the surface of polyphenylene sulfide, which is a hard-to-bond base material.
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4.发明申请公开(公告)号：US20180162106A1
公开(公告)日：2018-06-14
申请号：US15739599
申请日：2016-06-23
Applicant: DIC Corporation
Inventor： Wataru FUJIKAWA , Jun SHIRAKAMI , Akira MURAKAWA , Taku SHIMAYA
CPC classification number: B32B27/08 , B29C45/14311 , B29C2045/1664 , B29C2045/1693 , B29L2009/00 , B32B7/04 , B32B7/10 , B32B7/12 , B32B15/06 , B32B15/08 , B32B15/082 , B32B15/095 , B32B15/098 , B32B25/16 , B32B27/286 , B32B27/308 , B32B2250/04 , B32B2250/246 , B32B2255/06 , B32B2255/205 , B32B2270/00 , B32B2274/00 , B32B2307/202 , B32B2307/212 , B32B2319/00 , B32B2327/12 , B32B2333/08 , B32B2457/00 , B32B2457/08 , C08F265/06 , C08J7/045 , C08J2381/04 , C08J2433/14 , C08J2475/06 , C08J2491/06 , C08L21/00 , C08L27/16 , C23C18/1803 , C23C18/20 , C23C18/31 , C23C28/00 , C25D3/38 , C25D7/00 , H05K3/022 , H05K3/1208 , H05K3/125 , H05K3/246 , H05K3/38 , H05K3/386 , H05K2201/0133 , H05K2203/0723
Abstract: The present invention provides a laminated body including a support (A) that includes a polyphenylene sulfide resin composition containing a polyphenylene sulfide (a1) and an elastomer (a2), and a metal layer (B) and a metal-plating layer (C) that are laminated on the support (A) in this order, wherein the elastomer (a2) is contained in the polyphenylene sulfide resin composition in an amount in the range of 0.3 to 90 parts by mass relative to 100 parts by mass of the polyphenylene sulfide (a1). The laminated body is excellent in adhesiveness between the polyphenylene sulfide as the support and the metal-plating layer, and also has a thermal resistance so as to maintain the excellent adhesiveness even when exposed to a high-temperature environment.
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公开(公告)号：US20170158857A1
公开(公告)日：2017-06-08
申请号：US15320524
申请日：2015-06-25
Applicant: DIC Corporation
Inventor： Junichi MIYAKE , Jun SHIRAKAMI
IPC: C08L75/14 , C09J175/14 , C09D175/14
CPC classification number: C08L75/14 , C08F299/06 , C08G18/0823 , C08G18/12 , C08G18/3206 , C08G18/4238 , C08G18/44 , C08G18/67 , C08G18/6755 , C08G18/758 , C08K5/07 , C08K5/33 , C08K5/53 , C08L75/04 , C08L2201/54 , C09D5/02 , C09D7/40 , C09D175/14 , C09J175/14 , C08G18/3246
Abstract: The present invention provides an ultraviolet curable composition including: an urethane resin having a polymerizable unsaturated group, which is obtained by reacting a polyol and a polyisocyanate with each other, wherein the polyol contains an alkylene diol having two or more polymerizable unsaturated groups, which is represented by general formula (1), or an oxyalkylene diol having two or more polymerizable unsaturated groups, which is represented by general formula (2); an aqueous medium; and a photopolymerization initiator having an absorption peak at a wavelength in the range of from 320 to 460 nm. The ultraviolet curable composition is satisfactorily cured even when using an LED lamp as a light source, and can form a cured coating film having both elongation and surface hardness. HO—R1—OH (1) HO—R1O—R2—OR3—OH (2)
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Patent Agency Ranking
6.发明申请公开(公告)号：US20160198594A1
公开(公告)日：2016-07-07
申请号：US15067031
申请日：2016-03-10
Applicant: DIC Corporation
Inventor： Akira MURAKAWA , Jun SHIRAKAMI , Wataru FUJIKAWA , Yukie SAITOU
IPC: H05K9/00 , H05K1/02 , H05K3/12 , H01L21/321 , H05K3/38 , H05K3/46 , H01L23/532 , H01L21/288 , H05K1/09 , H05K3/24
CPC classification number: H05K9/0086 , H01L21/288 , H01L21/321 , H01L23/5328 , H01L2924/0002 , H05K1/0298 , H05K1/09 , H05K1/097 , H05K3/1208 , H05K3/246 , H05K3/389 , H05K3/4644 , H05K9/0081 , H05K2203/0723 , H01L2924/00
Abstract: An object to be achieved by the present invention is to provide a conductive pattern having such a level of adhesion that a conductive layer containing a conductive substance such as silver does not separate from a primer layer with time. The present invention relates to a conductive pattern including a conductive layer (A) containing a compound (a1) having a basic nitrogen atom-containing group and a conductive substance (a2); a primer layer (B) containing a compound (b1) having a functional group [X]; and a substrate layer (C), the conductive layer (A), the primer layer (B), and the substrate layer (C) being stacked, in which a bond is formed by reacting the basic nitrogen atom-containing group of the compound (a1) contained in the conductive layer (A) with the functional group [X] of the compound (b1) contained in the primer layer (B).
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公开(公告)号：US20160053146A1
公开(公告)日：2016-02-25
申请号：US14781010
申请日：2014-02-25
Applicant: DIC CORPORATION
Inventor： Junichi MIYAKE , Hiroyoshi KANNARI , Jun SHIRAKAMI
IPC: C09J175/06 , C09D175/06
CPC classification number: C09J175/06 , C08F299/06 , C08G18/0823 , C08G18/12 , C08G18/44 , C08G18/67 , C08G18/672 , C08G18/673 , C08L75/14 , C09D5/02 , C09D175/06 , C09D175/14 , C09D175/16 , C08G18/3246
Abstract: The present invention provides a urethane resin composition containing a urethane resin having polymerizable unsaturated groups and an aqueous medium. The urethane resin is obtained by reacting a polyol with a polyisocyanate. The polyol contains an alkylenediol having two or more polymerizable unsaturated groups or an oxyalkylenediol having two or more polymerizable unsaturated groups. The alkylenediol is represented by general formula (1): HO—R1—OH (1) (where R1 is a linear alkylene group of one to nine carbon atoms having two or more atomic groups containing a polymerizable unsaturated group in side chains thereof). The oxyalkylenediol (a1-2) is represented by general formula (2): HO—R1O—R2—OR3—OH (2) (where R1 and R3 are ethylene groups having a total of two or more atomic groups containing a polymerizable unsaturated group in side chains thereof, and R2 is an alkylene group of one to five carbon atoms). This urethane resin composition can form a coating with good elongation and flexibility and high hardness.
Abstract translation: 本发明提供含有聚合性不饱和基团的聚氨酯树脂和水性介质的聚氨酯树脂组合物。 聚氨酯树脂通过使多元醇与多异氰酸酯反应得到。 多元醇含有具有两个或多个可聚合不饱和基团的亚烷基二醇或具有两个或多个可聚合不饱和基团的氧化烯二醇。 亚烷基二醇由通式（1）表示：HO-R1-OH（1）（其中R1是具有两个或更多个在其侧链中含有可聚合不饱和基团的原子团的1至9个碳原子的直链亚烷基）。 氧化烯二醇（a1-2）由通式（2）表示：HO-R1O-R2-OR3-OH（2）（其中R1和R3是具有总共两个或更多个含有可聚合不饱和基团的原子团的亚乙基 在其侧链中，R 2是1至5个碳原子的亚烷基）。 该聚氨酯树脂组合物可以形成具有良好的伸长率和柔韧性和高硬度的涂层。
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8.发明申请公开(公告)号：US20180206368A1
公开(公告)日：2018-07-19
申请号：US15918237
申请日：2018-03-12
Applicant: DIC Corporation
Inventor： Akira MURAKAWA , Jun SHIRAKAMI , Wataru FUJIKAWA , Yukie SAITOU
IPC: H05K9/00 , H05K1/09 , H05K1/02 , H01L23/532 , H01L21/288 , H01L21/321 , H05K3/38 , H05K3/24 , H05K3/12 , H05K3/46
CPC classification number: H05K9/0086 , H01L21/288 , H01L21/321 , H01L23/5328 , H01L2924/0002 , H05K1/0298 , H05K1/09 , H05K1/097 , H05K3/1208 , H05K3/246 , H05K3/389 , H05K3/4644 , H05K9/0081 , H05K2203/0723 , H01L2924/00
Abstract: An object to be achieved by the present invention is to provide a conductive pattern having such a level of adhesion that a conductive layer containing a conductive substance such as silver does not separate from a primer layer with time. The present invention relates to a conductive pattern including a conductive layer (A) containing a compound (a1) having a basic nitrogen atom-containing group and a conductive substance (a2); a primer layer (B) containing a compound (b1) having a functional group [X]; and a substrate layer (C), the conductive layer (A), the primer layer (B), and the substrate layer (C) being stacked, in which a bond is formed by reacting the basic nitrogen atom-containing group of the compound (a1) contained in the conductive layer (A) with the functional group [X] of the compound (b1) contained in the primer layer (B).
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公开(公告)号：US20160037632A1
公开(公告)日：2016-02-04
申请号：US14775576
申请日：2014-03-06
Applicant: DIC Corporation
Inventor： Akira MURAKAWA , Jun SHIRAKAMI , Wataru FUJIKAWA , Yukie SAITOU
CPC classification number: H05K1/092 , B32B7/02 , B32B27/00 , G06K19/07722 , H05K1/0298 , H05K1/0346 , H05K3/1208 , H05K3/1283 , H05K3/181 , H05K3/246 , H05K3/386 , H05K2201/0154
Abstract: Provided is a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.
Abstract translation: 本发明提供一种层叠体，其中层叠至少一层包含载体，底漆层，第一导电层，绝缘层和第二导电层的层，其中绝缘层通过涂覆至少一部分或全部 的第一导电层的表面用树脂组合物干燥树脂组合物; 并且第二导电层包括通过用含有导电物质的流体涂覆绝缘层的表面的一部分或整体而形成的第二电镀种子层，以及形成在第二镀覆种子层的表面上的第二镀层。 该层压板在层间具有高粘合性，并且即使在暴露于高温高湿环境下也能够保持高粘合性。
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10.发明申请ABSORBING-LAYER-FORMING COMPOSITION AND ABSORBING SUBSTRATE, PRINTED ITEM, CONDUCTIVE PATTERN, AND ELECTRIC CIRCUIT PRODUCED USING THE SAME 有权吸收层形成组合物和吸收底物，印刷物，导电图案和使用其制造的电路公开(公告)号：US20150353747A1
公开(公告)日：2015-12-10
申请号：US14762789
申请日：2014-01-16
Applicant: DIC CORPORATION
Inventor： Wataru FUJIKAWA , Jun SHIRAKAMI , Akira MURAKAWA , Yukie SAITOU
IPC: C09D11/102 , C09D11/52 , B41J2/01 , H05K1/09 , H05K3/12
CPC classification number: C09D11/102 , B32B2307/202 , B32B2307/4026 , B32B2307/75 , B32B2457/00 , B32B2457/08 , B32B2457/20 , B41J2/01 , B41M5/5263 , C09D11/52 , H05K1/092 , H05K3/1208 , H05K3/125 , H05K3/182 , H05K2203/0709
Abstract: The present invention provides an absorbing-layer-forming composition including a blocked isocyanate such that the amount of the blocked isocyanate is 50% by mass to 100% by mass of the solid content of the absorbing-layer-forming composition and an absorbing substrate, a printed item, and a conductive pattern that are formed using the absorbing-layer-forming composition. The absorbing-layer-forming composition according to the present invention can be used for forming an absorbing layer which is capable of carrying a fluid such as an ink therein and which enables good adhesion between various types of supports and a conductive layer to be achieved. In particular, using a blocked isocyanate having a number-average molecular weight of 1,000 to 5,000 further increases the adhesion between various types of supports and the conductive layer.
Abstract translation: 本发明提供一种吸收层形成组合物，其包含封端异氰酸酯，使得封端异氰酸酯的量为吸收层形成用组合物和吸收性基材的固体成分的50质量％〜100质量％ 印刷品和使用该吸收层形成组合物形成的导电图案。 根据本发明的吸收层形成组合物可以用于形成能够在其中承载诸如油墨的流体的吸收层，并且能够实现各种类型的载体和导电层之间的良好粘合。 特别地，使用数均分子量为1,000〜5000的封端异氰酸酯进一步增加了各种载体和导电层之间的粘附性。
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