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    RESINS FOR USE AS TIE LAYERS IN MULTILAYER FILMS AND MULTILAYER FILMS COMPRISING THE SAME
    3.
    发明申请
    RESINS FOR USE AS TIE LAYERS IN MULTILAYER FILMS AND MULTILAYER FILMS COMPRISING THE SAME 有权

    公开(公告)号：US20210276303A1

    公开(公告)日：2021-09-09

    申请号：US16332436

    申请日：2017-08-21

    Applicant: Dow Global Technologies LLC

    Inventor： Yong Zheng ,  Suzanne M. Guerra ,  Sydney E. Hansen ,  Brian W. Walther

    IPC: B32B7/12 ,  C08L23/08 ,  C08L51/06 ,  B32B27/34 ,  B32B27/08 ,  B32B27/30 ,  B32B27/32

    Abstract: The present disclosure provides resins that can be used as a tie layer in a multilayer structure and to multilayer structures comprising one or more tie layers formed from such resins. In one aspect, a resin for use as a tie layer in a multilayer structure comprises a first composition, wherein the first composition comprises at least one ethylene-based polymer and wherein the first composition comprises a MWCDI value greater than 0.9, and a melt index ratio (I10/I2) that meets the following equation: I10/I2 ? 7.0−1.2×log (I2), wherein the first composition comprises 1 to 99 weight percent of the resin; and a maleic anhydride grafted polyethylene comprising a maleic anhydride grafted high density polyethylene, a maleic anhydride grafted linear low density polyethylene, a maleic anhydride grafted polyethylene elastomer, or a combination thereof, wherein the maleic anhydride grafted polyethylene comprises 1 to 99 weight percent of the resin.

    CELL SIZE ENLARGING AGENT FOR STYRENIC FOAM
    6.
    发明申请
    CELL SIZE ENLARGING AGENT FOR STYRENIC FOAM 审中-公开
    用于陶瓷泡沫的细胞尺寸放大剂

    公开(公告)号：US20150267020A1

    公开(公告)日：2015-09-24

    申请号：US14437215

    申请日：2013-11-11

    Applicant: DOW GLOBAL TECHNOLOGIES LLC

    Inventor： Kendra M. Giza ,  Mark A. Barger ,  Richard T. Fox ,  Suzanne M. Guerra ,  Brian W. Walther

    IPC: C08J9/00 ,  C08J9/12

    CPC classification number: C08J9/0061 ,  C08J9/0019 ,  C08J9/122 ,  C08J2201/03 ,  C08J2203/06 ,  C08J2300/102 ,  C08J2323/06 ,  C08J2325/04 ,  C08J2325/06 ,  C08J2351/06 ,  C08J2451/06 ,  C08L25/06 ,  C08L2203/14 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2207/062 ,  C08L51/06

    Abstract: A styrenic polymer foam contains a polymer composition in the form of a continuous matrix defining multiple cells therein, the polymer composition contains a first polymer and second polymer, the first polymer being a maleic anhydride-grafted high density polyethylene and the second polymer being a styrenic polymer resin that is free of grafted maleic anhydride. The first polymer contains on average 0.05 or more weight-parts of grafted maleic anhydride based on total weight of the first polymer and the concentration of first polymer in the polymer composition is sufficient to provide at least six weight-parts of grafted maleic an hydride per million weight parts of the polymer composition.

    Abstract translation: 苯乙烯聚合物泡沫体含有在其中限定多个细胞的连续基质形式的聚合物组合物，聚合物组合物含有第一聚合物和第二聚合物，第一聚合物是马来酸酐接枝的高密度聚乙烯，第二聚合物是苯乙烯 不含接枝马来酸酐的聚合物树脂。 第一聚合物基于第一聚合物的总重量平均含有0.05或更多重量的接枝马来酸酐，并且聚合物组合物中的第一聚合物的浓度足以提供至少6重量份的接枝马来酸酐 百万重量份的聚合物组合物。

    RESINS FOR USE AS TIE LAYERS IN MULTILAYER FILMS AND MULTILAYER FILMS COMPRISING THE SAME
    7.
    发明申请
    RESINS FOR USE AS TIE LAYERS IN MULTILAYER FILMS AND MULTILAYER FILMS COMPRISING THE SAME 有权

    公开(公告)号：US20230079895A1

    公开(公告)日：2023-03-16

    申请号：US17875598

    申请日：2022-07-28

    Applicant: Dow Global Technologies LLC

    Inventor： Yong Zheng ,  Suzanne M. Guerra ,  Sydney E. Hansen ,  Brian W. Walther

    IPC: B32B7/12 ,  B32B27/08 ,  B32B27/30 ,  B32B27/32 ,  B32B27/34 ,  C08L23/08 ,  C08L51/06

    Abstract: The present disclosure provides resins that can be used as a tie layer in a multilayer structure and to multilayer structures comprising one or more tie layers formed from such resins. In one aspect, a resin for use as a tie layer in a multilayer structure comprises a first composition, wherein the first composition comprises at least one ethylene-based polymer and wherein the first composition comprises a MWCDI value greater than 0.9, and a melt index ratio (I10/I2) that meets the following equation: I10/I2≥7.0−1.2×log (I2), wherein the first composition comprises 1 to 99 weight percent of the resin; and a maleic anhydride grafted polyethylene comprising a maleic anhydride grafted high density polyethylene, a maleic anhydride grafted linear low density polyethylene, a maleic anhydride grafted polyethylene elastomer, or a combination thereof, wherein the maleic anhydride grafted polyethylene comprises 1 to 99 weight percent of the resin.

    POLYMERIC COATINGS FOR COATED CONDUCTORS
    8.
    发明申请
    POLYMERIC COATINGS FOR COATED CONDUCTORS 有权
    用于涂层导体的聚合物涂层

    公开(公告)号：US20150122529A1

    公开(公告)日：2015-05-07

    申请号：US14397385

    申请日：2013-05-15

    Applicant: DOW GLOBAL TECHNOLOGIES LLC

    Inventor： Suh Joon Han ,  Suzanne M. Guerra ,  Jeffrey M. Cogen ,  Gary R. Marchand ,  Jerker B.L. Kjellqvist

    IPC: H01B3/44

    CPC classification number: H01B3/441 ,  H01B7/2813

    Abstract: Coated conductors comprising a conductive core at least partially surrounded by a polymeric coating. The polymeric coating comprises an α-olefin based polymer and an α-olefin block composite. The α-olefin block composite comprises block copolymers having hard segments and soft segments.

    Abstract translation: 涂层导体包括至少部分地由聚合物涂层包围的导电芯。 聚合物涂层包含α-烯烃基聚合物和α-烯烃嵌段复合材料。 α-烯烃嵌段复合材料包括具有硬链段和软链段的嵌段共聚物。

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