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    High frequency HID lamp system
    2.
    发明授权
    High frequency HID lamp system 失效
    高频HID灯系统

    公开(公告)号：US5998939A

    公开(公告)日：1999-12-07

    申请号：US90596

    申请日：1998-06-04

    申请人： Mark Fellows ,  Gregory Nelson ,  Robertus A. J. Keyser ,  Dale E. Work ,  Josephus C. M. Hendricx ,  Oscar J. Deurloo ,  Aswin J. G. Linden ,  Peter A. Seinen ,  Andrew Jackson

    发明人： Mark Fellows ,  Gregory Nelson ,  Robertus A. J. Keyser ,  Dale E. Work ,  Josephus C. M. Hendricx ,  Oscar J. Deurloo ,  Aswin J. G. Linden ,  Peter A. Seinen ,  Andrew Jackson

    IPC分类号： H01J61/02 ,  H01J61/12 ,  H01J61/30 ,  H01J61/34 ,  H01J61/56 ,  H01J61/82 ,  H05B41/00 ,  H05B41/298 ,  H05B37/02

    CPC分类号： H01J61/125 ,  H01J61/025 ,  H01J61/30 ,  H01J61/34 ,  H01J61/56 ,  H01J61/827 ,  H05B41/00 ,  H05B41/2988

    摘要： A high pressure gas discharge lamp system includes a high pressure discharge lamp selected to have a lowest lamp resonant frequency above the audible, on a current basis above about 19 kHz and on a power basis of above about 38 kHz. The ballast circuit energizes the discharge device so as to have a fundamental frequency below the lowest lamp resonant frequency and above the audible, while keeping the magnitude of any harmonics above the lowest lamp resonant frequency sufficiently small so as to avoid acoustic resonance. By operating below the lowest lamp resonant frequency, greatly simplifying ballast construction and cost. According to one embodiment, the discharge vessel encloses a discharge space which is circular cylindrical and having a L:ID ratio of about 1:1 to maximize the lowest lamp resonant frequency. According to another embodiment, two or more discharge devices are operated concurrently by the ballast, each having a lowest lamp resonant frequency of above the audible, and the ballast operating frequency so as to increase light output while still avoiding acoustic resonance.

    摘要翻译： 高压气体放电灯系统包括高压放电灯，其被选择为在高于约19kHz的电流基础上以及高于约38kHz的功率基础上具有低于可听见的最低灯谐振频率。 镇流器电路使放电装置通电，使基频低于最低灯谐振频率和声音之上，同时保持高于最低灯谐振频率的任何谐波的幅度足够小，以避免声共振。 通过低于最低灯谐振频率的操作，极大地简化了镇流器的构造和成本。 根据一个实施例，放电容器包围圆柱形并具有大约1:1的L：ID比的放电空间，以最大化最低的灯谐振频率。 根据另一实施例，通过镇流器同时操作两个或更多个放电装置，每个镇流器具有低于可听见的最低灯谐振频率和镇流器工作频率，以便在仍然避免声共振的同时增加光输出。

    Locking structure for hinged container
    4.
    发明申请
    Locking structure for hinged container 有权
    铰链式集装箱的锁定结构

    公开(公告)号：US20060081641A1

    公开(公告)日：2006-04-20

    申请号：US10966726

    申请日：2004-10-14

    申请人： Hollis Habeger ,  Gregory Nelson ,  Richard Steichen

    发明人： Hollis Habeger ,  Gregory Nelson ,  Richard Steichen

    IPC分类号： B65D43/14 ,  B65D6/28 ,  B65D41/16

    CPC分类号： B65D75/22 ,  B65D21/0219 ,  B65D43/162

    摘要： Locking structure for thermoformed plastic containers for food and other articles wherein the lid and the base of the containers are provided with locking means, specifically a detent and a tab. The detent, which depends from the front of the lid, has rounded ends and an inwardly extending lip disposed on its outer side. The tab, which depends from the front of the base, has an upper surface, a lower surface, and two end surfaces. The upper surface is angled toward the lower surface and the end surfaces are substantially flat. The upper surface and the inwardly extending lip are constructed and arranged with respect to each other so that when the detent is pressed into the tab the inwardly extending lip will snap into position beneath the upper surface and interlock with it to lock the lid and base.

    摘要翻译： 用于食品和其他物品的热成型塑料容器的锁定结构，其中盖和容器的基部设置有锁定装置，特别是止动件和突舌。 从盖的前部延伸的制动器具有圆形的端部和设置在其外侧上的向内延伸的唇缘。 从基座的前部延伸的突片具有上表面，下表面和两个端面。 上表面朝向下表面倾斜，并且端表面基本上是平的。 上表面和向内延伸的唇缘相对于彼此构造和布置，使得当棘爪被压入翼片中时，向内延伸的唇缘将卡扣到上表面下方并与其互锁以锁定盖子和底座。

    Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
    6.
    发明申请
    Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices 有权
    卷对卷制造的光片和封装的半导体电路器件

    公开(公告)号：US20070105250A1

    公开(公告)日：2007-05-10

    申请号：US11335228

    申请日：2006-01-18

    申请人： John Daniels ,  Gregory Nelson

    发明人： John Daniels ,  Gregory Nelson

    IPC分类号： H01L21/00

    CPC分类号： H01L25/50 ,  F21K9/90 ,  H01L24/86 ,  H01L24/95 ,  H01L33/52 ,  H01L2224/95145 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/48

    摘要： A method of making a light active sheet. A bottom substrate having an electrically conductive surface is provided. A hotmelt adhesive sheet is provided. Light active semiconductor elements, such as LED die, are embedded in the hotmelt adhesive sheet. The LED die each have a top electrode and a bottom electrode. A top substrate is provided having a conductive layer. The hotmelt adhesive sheet with the embedded LED die is inserted between the electrically conductive surface and the conductive layer to form a lamination. The lamination is run through a heated pressure roller system to melt the hotmelt adhesive sheet and electrically insulate and bind the top substrate to the bottom substrate. As the hotmelt sheet is softened, the LED die breakthrough so that the top electrode comes into electrical contact with the conductive layer of the top substrate and the bottom electrode comes into electrical contact with the electrically conductive surface of the bottom substrate. Thus, the p and n sides of each LED die are automatically connected to the top conductive layer and the bottom conductive surface. Each LED die is encapsulated and secured between the substrates in the flexible, hotmelt adhesive sheet layer. The bottom substrate, the hotmelt adhesive (with the embedded LED die) and the top substrate can be provided as rolls of material. The rolls are brought together in a continuous roll fabrication process, resulting in a flexible sheet of lighting material.

    摘要翻译： 制备轻活性片材的方法。 提供具有导电表面的底部基板。 提供热熔粘合片。 诸如LED模具的光活性半导体元件被嵌入热熔粘合片中。 LED芯片各自具有顶部电极和底部电极。 提供具有导电层的顶部衬底。 将具有嵌入式LED管芯的热熔粘合片插入在导电表面和导电层之间以形成层压。 层压通过加热的压力辊系统来熔化热熔粘合片并将顶部基底电绝缘并结合到底部基底。 当热熔片被软化时，LED管芯突破，使得顶部电极与顶部基板的导电层电接触，并且底部电极与底部基板的导电表面电接触。 因此，每个LED管芯的p侧和n侧自动连接到顶部导电层和底部导电表面。 每个LED芯片被封装并固定在柔性热熔粘合片层中的基板之间。 底部基材，热熔粘合剂（具有嵌入式LED模具）和顶部基材可以以卷材料形式提供。 辊以连续的辊制造工艺聚集在一起，产生柔性的照明材料片。

    Roll-to-roll fabricated electronically active device
    7.
    发明申请
    Roll-to-roll fabricated electronically active device 有权
    卷对卷制造的电子有源器件

    公开(公告)号：US20070026570A1

    公开(公告)日：2007-02-01

    申请号：US11543517

    申请日：2006-10-03

    申请人： John Daniels ,  Gregory Nelson

    发明人： John Daniels ,  Gregory Nelson

    IPC分类号： H01L21/00

    CPC分类号： B32B17/10036 ,  B32B17/10174 ,  B32B17/10321 ,  F21K9/00 ,  F21V5/04 ,  H01L21/67132 ,  H01L25/0753 ,  H01L27/14625 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01033

    摘要： An electronically active sheet, comprising a first substrate having an electrically conductive surface; a second substrate having an electrically conductive pattern disposed thereon; at least one semiconductor element having a first conductor and a second conductor. The electronically active sheet includes an adhesive having at least one semiconductor element fixed thereto and disposed between the electrically conductive surface and the electrically conductive pattern to form a lamination. The adhesive is activatable to bind the second substrate to the first substrate so that one of the first conductor and the second conductor of the at least one semiconductor element is automatically brought into electrical communication with the electrically conductive pattern and so that the other of the first conductor and the second conductor of the at least one semiconductor element is automatically brought into and maintained in electrical communication with the electrically conductive surface of the first substrate.

    摘要翻译： 一种电子活性片，包括具有导电表面的第一基底; 具有设置在其上的导电图案的第二基板; 至少一个半导体元件具有第一导体和第二导体。 电子活性片材包括具有固定到其上的至少一个半导体元件并且设置在导电表面和导电图案之间以形成层压的粘合剂。 粘合剂可激活以将第二基板结合到第一基板，使得至少一个半导体元件的第一导体和第二导体中的一个自动地与导电图案电连通，并且使得第一基板中的另一个 导体和至少一个半导体元件的第二导体自动进入并保持与第一基板的导电表面电连通。

    Scored negative file system and method
    8.
    发明申请
    Scored negative file system and method 有权
    得分负文件系统和方法

    公开(公告)号：US20050283429A1

    公开(公告)日：2005-12-22

    申请号：US10870554

    申请日：2004-06-17

    申请人： Michael Bates ,  Gregory Nelson

    发明人： Michael Bates ,  Gregory Nelson

    IPC分类号： G06Q40/00

    CPC分类号： G06Q40/00 ,  G06Q20/40 ,  G06Q40/025

    摘要： System and method for validating a payment. The method can include obtaining a first account identifier, accessing a database containing a plurality of risk scores, each one of the plurality of risk scores being associated with one of a plurality of account identifiers, obtaining a first risk score from the plurality of risk scores, the first risk score being associated with the first account identifier, and determining an acceptance decision by comparing the first risk score against a risk threshold value.

    摘要翻译： 用于验证付款的系统和方法。 该方法可以包括获得第一帐户标识符，访问包含多个风险分数的数据库，所述多个风险分数中的每一个与多个帐户标识符中的一个相关联，从所述多个风险分数中获得第一风险评分 所述第一风险分数与所述第一帐户标识符相关联，以及通过将所述第一风险分数与风险阈值进行比较来确定接受决定。

    Light active sheet material
    9.
    发明申请
    Light active sheet material 审中-公开

    公开(公告)号：US20070194332A1

    公开(公告)日：2007-08-23

    申请号：US11704044

    申请日：2007-02-07

    申请人： John Daniels ,  Gregory Nelson

    发明人： John Daniels ,  Gregory Nelson

    IPC分类号： H01L33/00

    CPC分类号： H01L27/14625 ,  F21K9/00 ,  F21V5/04 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/01015 ,  H01L2924/00

    摘要： Device structures for sheets of light active material. A first substrate has a transparent first conductive layer. A pattern of light active semiconductor elements are fixed to the first substrate. The light active semiconductor elements have an n-side and a p-side. Each light active semiconductor element has either of the n-side or the p-side in electrical communication with the transparent conductive layer. A second substrate has a second conductive layer. An adhesive secures the second substrate to the first substrate so that the other of said n-side or said p-side of each said light active semiconductor element is in electrical communication with the second conductive layer. Thus forming a solid-state light active device.