公开(公告)号：US20060027934A1

公开(公告)日：2006-02-09

申请号：US11242221

申请日：2005-10-03

申请人： Daniel Edelstein ,  Paul Andry ,  Leena Buchwalter ,  Jon Casey ,  Sherif Goma ,  Raymond Horton ,  Gareth Hougham ,  Michael Lane ,  Xiao Liu ,  Chirag Patel ,  Edmund Sprogis ,  Michelle Steen ,  Brian Sundlof ,  Cornelia Tsang ,  George Walker ,  Yu-Ting Cheng ,  Kenneth Ocheltree ,  Robert Montoye

发明人： Daniel Edelstein ,  Paul Andry ,  Leena Buchwalter ,  Jon Casey ,  Sherif Goma ,  Raymond Horton ,  Gareth Hougham ,  Michael Lane ,  Xiao Liu ,  Chirag Patel ,  Edmund Sprogis ,  Michelle Steen ,  Brian Sundlof ,  Cornelia Tsang ,  George Walker ,  Yu-Ting Cheng ,  Kenneth Ocheltree ,  Robert Montoye

IPC分类号： H01L23/48

CPC分类号： H01L23/49883 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

摘要： A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic modulus value which is less than or closely matches that of the substrate. The conductive structure may include concentric via fill areas having differing materials disposed concentrically therein, a core of the substrate material surrounded by an annular ring of conductive material, a core of CTE-matched non-conductive material surrounded by an annular ring of conductive material, a conductive via having an inner void with low CTE, or a full fill of a conductive composite material such as a metal-ceramic paste which has been sintered or fused.

摘要翻译： 一种载体结构和方法，用于制造具有通孔的载流子结构，每个导通孔具有导电结构，其有效热膨胀系数小于或接近于基板的热膨胀系数，并且具有小于或等于 或者与衬底的密切匹配。 导电结构可以包括同心的通孔填充区域，其具有同心设置的不同材料，由导电材料的环形环包围的衬底材料的芯，由导电材料的环形环包围的CTE匹配的非导电材料的芯， 具有低CTE的内部空隙的导电通孔，或已经烧结或熔合的诸如金属 - 陶瓷浆料的导电复合材料的完整填充物。

公开(公告)号：US08957498B2

公开(公告)日：2015-02-17

申请号：US13484865

申请日：2012-05-31

申请人： Yu-Ting Cheng ,  Tzu-Yuan Chao ,  Kuan-Ming Chen ,  Hsin-Fu Hsu

发明人： Yu-Ting Cheng ,  Tzu-Yuan Chao ,  Kuan-Ming Chen ,  Hsin-Fu Hsu

IPC分类号： H01L27/08 ,  H01L49/02 ,  H01L23/522 ,  H01L23/532

CPC分类号： H01L28/10 ,  H01L23/5227 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention relates to an on-chip electronic device and a method for manufacturing the same. The on-chip electronic device according to the present invention comprises a substrate, a porous layer, a plurality of magnetic bodies, and an electronic member layer. The porous layer is disposed on the substrate and has a plurality of voids; each of the plurality of magnetic bodies is disposed in the plurality of voids, respectively; and the electronic member layer is disposed on one side of the porous layer, such as upper side of or lower sider of the porous layer. Because the plurality of magnetic bodies is used as the core of the inductance, the inductance is increased effectively and the area of the on-chip electronic device is reduced. Besides the manufacturing method according to the present invention is simple and compatible with the current CMOS process, the manufacturing cost can be lowered.

摘要翻译： 片上电子装置及其制造方法技术领域本发明涉及一种片上电子装置及其制造方法。 根据本发明的片上电子器件包括衬底，多孔层，多个磁体和电子构件层。 多孔层设置在基板上并具有多个空隙; 所述多个磁性体中的每一个分别设置在所述多个空隙中; 并且电子部件层设置在多孔层的一侧，例如多孔层的上侧或下部。 由于使用多个磁体作为电感的核心，所以有效地增加了电感，降低了片上电子装置的面积。 此外，根据本发明的制造方法简单且兼容于目前的CMOS工艺，可以降低制造成本。

公开(公告)号：US08922976B2

公开(公告)日：2014-12-30

申请号：US13350813

申请日：2012-01-15

申请人： Yi-Hsiu Pan ,  Yu-Ting Cheng ,  Li-Duan Tsai ,  Chi-Lun Chen ,  Cheng-Liang Cheng

发明人： Yi-Hsiu Pan ,  Yu-Ting Cheng ,  Li-Duan Tsai ,  Chi-Lun Chen ,  Cheng-Liang Cheng

IPC分类号： H01G4/228 ,  H01G5/38 ,  H01G9/048 ,  H01G9/15 ,  H01G9/26 ,  H01G9/08

CPC分类号： H01G9/048 ,  H01G9/08 ,  H01G9/15 ,  H01G9/26 ,  Y10T29/417

摘要： A decoupling device including a lead frame, multiple capacitor units, a protective layer and a packaging element is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions disposed at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor units are connected in parallel and disposed on the lead frame. Each capacitor unit has a cathode portion and an opposite anode portion. The cathode portion is electrically connected with the cathode terminal portion. The anode portion is electrically connected with the anode terminal portion. The protective layer wraps at least one of the anode portion and the cathode portion of the capacitor unit. The packaging element covers the lead frame, the capacitor units and the protective layer. The packaging element exposes a bottom surface of the lead frame.

摘要翻译： 提供一种包括引线框，多个电容器单元，保护层和封装元件的去耦装置。 引线框架包括阴极端子部分和设置在阴极端子部分两端的至少两个相对的阳极端子部分。 两个阳极端子部分通过导线彼此电连接。 电容器单元并联连接并设置在引线框架上。 每个电容器单元具有阴极部分和相对的阳极部分。 阴极部分与阴极端子部电连接。 阳极部与阳极端子部电连接。 保护层包裹电容器单元的阳极部分和阴极部分中的至少一个。 封装元件覆盖引线框架，电容器单元和保护层。 包装元件暴露引线框架的底表面。

公开(公告)号：US08876070B2

公开(公告)日：2014-11-04

申请号：US13492862

申请日：2012-06-09

申请人： Ching-Wei Liu ,  Yu-Ting Cheng

发明人： Ching-Wei Liu ,  Yu-Ting Cheng

IPC分类号： F16M11/38 ,  F16M13/00 ,  A47G29/00 ,  F16M13/02 ,  F16M11/24 ,  F16M11/10 ,  F16M11/20

CPC分类号： F16M13/02 ,  F16M11/10 ,  F16M11/2021 ,  F16M11/24 ,  F16M13/00 ,  Y10T16/5475

摘要： A thin-type collapsible foot stand includes a base unit, a first rotatable unit and a second rotatable unit. The base unit includes a base body having a first pivot portion, a first connection portion and a first extending portion. The first rotatable unit includes a rotatable platform having a second pivot portion corresponding to the first extending portion, a second connection portion corresponding to the first connection portion, and a second extending portion corresponding to the first pivot portion. The second rotatable unit includes two rotatable support frames. Each rotatable support frame includes a support body disposed between the base body and the rotatable platform, a first pivot structure connected between one end portion of the support body and the first pivot portion, and a second pivot structure connected between the other end portion of the support body and the second pivot portion.

摘要翻译： 薄型可折叠脚架包括基座单元，第一可旋转单元和第二可旋转单元。 基座单元包括具有第一枢转部分，第一连接部分和第一延伸部分的基体。 第一可旋转单元包括具有对应于第一延伸部分的第二枢转部分，对应于第一连接部分的第二连接部分和对应于第一枢转部分的第二延伸部分的可旋转平台。 第二可旋转单元包括两个可旋转的支撑框架。 每个可旋转的支撑框架包括设置在基体和可旋转平台之间的支撑体，连接在支撑体的一个端部与第一枢转部分之间的第一枢轴结构以及连接在该支撑体的另一端部之间的第二枢转结构 支撑体和第二枢转部分。

公开(公告)号：US08773844B2

公开(公告)日：2014-07-08

申请号：US13053195

申请日：2011-03-21

申请人： Cheng-Liang Cheng ,  Yi-Hsiu Pan ,  Yu-Ting Cheng ,  Li-Duan Tsai

发明人： Cheng-Liang Cheng ,  Yi-Hsiu Pan ,  Yu-Ting Cheng ,  Li-Duan Tsai

IPC分类号： H01G4/228 ,  H01G9/00 ,  H01G9/10 ,  H05K5/03

CPC分类号： H01G9/14 ,  H01G9/012 ,  H01G9/04 ,  H01G9/15

摘要： A decoupling device including a lead frame and at least one capacitor unit assembly is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions located at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor unit assembly includes multiple capacitor elements. The multiple capacitor elements of the capacitor unit assembly is connected in parallel, arrayed on the same plane and disposed on the lead frame. Each capacitor element has a cathode portion and an anode portion opposite to each other. The cathode portion of the capacitor element is electrically connected with the cathode terminal portion. The anode portion of the capacitor element is electrically connected with the anode terminal portion. When multiple capacitor unit assemblies exists, the capacitor unit assemblies are arrayed in a stacked way.

摘要翻译： 提供一种包括引线框和至少一个电容器单元组件的去耦装置。 引线框架包括阴极端子部分和位于阴极端子部分两端的至少两个相对的阳极端子部分。 两个阳极端子部分通过导线彼此电连接。 电容器单元组件包括多个电容器元件。 电容器单元组件的多个电容器元件并联连接，排列在同一平面上，并设置在引线框架上。 每个电容器元件具有彼此相对的阴极部分和阳极部分。 电容器元件的阴极部分与阴极端子部电连接。 电容器元件的阳极部分与阳极端子部电连接。 当存在多个电容器单元组件时，电容器单元组件以堆叠的方式排列。

公开(公告)号：US08543361B2

公开(公告)日：2013-09-24

申请号：US13204945

申请日：2011-08-08

申请人： Chien-Chang Chen ,  Yu-Ting Cheng

发明人： Chien-Chang Chen ,  Yu-Ting Cheng

IPC分类号： G06G7/56

CPC分类号： G06F17/5036 ,  G06F2217/80

摘要： A method and a non-transitory computer readable medium thereof for thermal analysis modeling are provided. The method includes establishing an electrothermal network π model on the basis of electronic modules of an electronic system to define a heat source, propagation paths and a common base of the electronic system. Observation points in the electronic system are defined, in which each observation point is located at an isothermal surface enclosing a volume surrounding a reference point, and where the reference point is the heat source or one observation point. A heat conduction temperature difference and a heat convection temperature difference are calculated according to a power density function, a thermal conductivity coefficient and a distance vector between the reference point and each observation point. A temperature distribution is established according to the heat conduction and the heat convection temperature difference and a defined temperature of the common base.

摘要翻译： 提供了一种用于热分析建模的方法和非暂时计算机可读介质。 该方法包括基于电子系统的电子模块建立电热网络pi模型，以定义电子系统的热源，传播路径和公共基座。 定义电子系统中的观测点，其中每个观测点位于包围参考点周围的体积的等温表面，并且其中参考点是热源或一个观察点。 根据功率密度函数，导热系数和参考点与每个观察点之间的距离矢量计算导热温差和热对流温差。 根据热传导和热对流温差以及公共基底的定义温度建立温度分布。

公开(公告)号：US20130187635A1

公开(公告)日：2013-07-25

申请号：US13616338

申请日：2012-09-14

申请人： SHIH-HSIEN CHENG ,  Ming-Jhe Du ,  Lien-Yi Cho ,  Yu-Ting Cheng ,  Yung-Chang Chen

发明人： SHIH-HSIEN CHENG ,  Ming-Jhe Du ,  Lien-Yi Cho ,  Yu-Ting Cheng ,  Yung-Chang Chen

IPC分类号： G01R19/00

CPC分类号： G01R15/181

摘要： The invention discloses an electrical sensor for a two-wire power cable. The sensor includes: a flexible substrate joined onto the power cable or the protective jacket thereon; an inductive coil formed on the flexible substrate; a pair of metal electrodes formed on the flexible substrate and at the opposite sides of the power cable, respectively; and a readout circuit formed on the flexible substrate, electrically connected to the inductive coil so as to measure the current in the power cable, and electrically connected to the metal electrodes so as to measure the voltage in the power cable.

摘要翻译： 本发明公开了一种用于双线电力电缆的电传感器。 传感器包括：连接到电力电缆或其上的保护外套的柔性基板; 形成在柔性基板上的感应线圈; 一对金属电极，分别形成在柔性基板上和电源电缆的相对侧; 以及读出电路，形成在柔性基板上，电连接到感应线圈，以测量电力电缆中的电流，并且电连接到金属电极，以便测量电力电缆中的电压。

公开(公告)号：US20130120903A1

公开(公告)日：2013-05-16

申请号：US13350813

申请日：2012-01-15

申请人： Yi-Hsiu Pan ,  Yu-Ting Cheng ,  Li-Duan Tsai ,  Chi-Lun Chen ,  Cheng-Liang Cheng

发明人： Yi-Hsiu Pan ,  Yu-Ting Cheng ,  Li-Duan Tsai ,  Chi-Lun Chen ,  Cheng-Liang Cheng

IPC分类号： H01G4/236 ,  H01G9/08

CPC分类号： H01G9/048 ,  H01G9/08 ,  H01G9/15 ,  H01G9/26 ,  Y10T29/417

摘要： A decoupling device including a lead frame, multiple capacitor units, a protective layer and a packaging element is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions disposed at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor units are connected in parallel and disposed on the lead frame. Each capacitor unit has a cathode portion and an opposite anode portion. The cathode portion is electrically connected with the cathode terminal portion. The anode portion is electrically connected with the anode terminal portion. The protective layer wraps at least one of the anode portion and the cathode portion of the capacitor unit. The packaging element covers the lead frame, the capacitor units and the protective layer. The packaging element exposes a bottom surface of the lead frame.

摘要翻译： 提供一种包括引线框，多个电容器单元，保护层和封装元件的去耦装置。 引线框架包括阴极端子部分和设置在阴极端子部分的两端的至少两个相对的阳极端子部分。 两个阳极端子部分通过导线彼此电连接。 电容器单元并联连接并设置在引线框架上。 每个电容器单元具有阴极部分和相对的阳极部分。 阴极部分与阴极端子部电连接。 阳极部与阳极端子部电连接。 保护层包裹电容器单元的阳极部分和阴极部分中的至少一个。 封装元件覆盖引线框架，电容器单元和保护层。 包装元件暴露引线框架的底表面。

公开(公告)号：US20090227823A1

公开(公告)日：2009-09-10

申请号：US12397303

申请日：2009-03-03

申请人： George W. Huber ,  Yu-Ting Cheng ,  Torren Carlson ,  Tushar Vispute ,  Jungho Jae ,  Geoff Tompsett

发明人： George W. Huber ,  Yu-Ting Cheng ,  Torren Carlson ,  Tushar Vispute ,  Jungho Jae ,  Geoff Tompsett

IPC分类号： C07C1/00

CPC分类号： C10G1/002 ,  C10G1/08 ,  C10G2300/1014 ,  C10G2300/1018 ,  C10G2300/305 ,  C10G2400/02 ,  C10G2400/20 ,  C10G2400/30 ,  Y02P30/42

摘要： This invention relates to compositions and methods for fluid hydrocarbon product, and more specifically, to compositions and methods for fluid hydrocarbon product via catalytic pyrolysis. Some embodiments relate to methods for the production of specific aromatic products (e.g., benzene, toluene, naphthalene, xylene, etc.) via catalytic pyrolysis. Some such methods may involve the use of a composition comprising a mixture of a solid hydrocarbonaceous material and a heterogeneous pyrolytic catalyst component. In some embodiments, the mixture may be pyrolyzed at high temperatures (e.g., between 500° C. and 1000° C.). The pyrolysis may be conducted for an amount of time at least partially sufficient for production of discrete, identifiable biofuel compounds. Some embodiments involve heating the mixture of catalyst and hydrocarbonaceous material at high rates (e.g., from about 50° C. per second to about 1000° C. per second). The methods described herein may also involve the use of specialized catalysts. For example, in some cases, zeolite catalysts may be used; optionally, the catalysts used herein may have high silica to alumina molar ratios. In some instances, the composition fed to the pyrolysis reactor may have a relatively high catalyst to hydrocarbonaceous material mass ratio (e.g., from about 5:1 to about 20:1).

摘要翻译： 本发明涉及流体烃产物的组合物和方法，更具体地说，涉及通过催化裂解的流化烃产物的组合物和方法。 一些实施方案涉及通过催化热解生产特定芳族产物（例如苯，甲苯，萘，二甲苯等）的方法。 一些这样的方法可以涉及使用包含固体烃类材料和非均相热解催化剂组分的混合物的组合物。 在一些实施方案中，混合物可在高温（例如500℃至1000℃）之间热解。 热解可以进行至少部分足以产生离散的，可识别的生物燃料化合物的时间量。 一些实施方案涉及以高速率（例如，每秒约50℃至约1000℃/秒）加热催化剂和含烃材料的混合物。 本文所述的方法还可以涉及使用专门的催化剂。 例如，在某些情况下，可以使用沸石催化剂; 任选地，本文使用的催化剂可具有高二氧化硅与氧化铝的摩尔比。 在一些情况下，进料到热解反应器的组合物可具有相对较高的催化剂与烃质量比（例如约5:1至约20:1）。

公开(公告)号：US08481364B2

公开(公告)日：2013-07-09

申请号：US12900016

申请日：2010-10-07

申请人： Tzu-Yuan Chao ,  Chia-Wei Liang ,  Yu-Ting Cheng

发明人： Tzu-Yuan Chao ,  Chia-Wei Liang ,  Yu-Ting Cheng

IPC分类号： H01L23/12 ,  H01L21/302 ,  H01L21/50

CPC分类号： H01L23/52 ,  H01L21/02068 ,  H01L21/32134 ,  H01L21/4846 ,  H01L21/6835 ,  H01L23/4985 ,  H01L23/5222 ,  H01L23/66 ,  H01L24/05 ,  H01L24/08 ,  H01L24/80 ,  H01L24/95 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2223/6627 ,  H01L2224/05005 ,  H01L2224/05155 ,  H01L2224/05541 ,  H01L2224/05644 ,  H01L2224/08238 ,  H01L2224/80006 ,  H01L2224/8001 ,  H01L2224/80203 ,  H01L2224/80444 ,  H01L2224/80895 ,  H01L2224/95 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2224/80 ,  H01L2924/00

摘要： A fabrication method for integrating chip(s) onto a flexible substrate in forming a flexible micro-system. The method includes a low-temperature flip-chip and a wafer-level fabrication process. Using the low-temperature flip-chip technique, the chip is bonded metallically onto the flexible substrate. To separate the flexible substrate from the substrate, etching is used to remove the sacrificial layer underneath the flexible substrate. The instant disclosure applies standardized micro-fabrication process for integrating chip(s) onto the flexible substrate. Without using special materials or fabrication procedures, the instant disclosure offers a cost-effective fabrication method for flexible micro-systems.

摘要翻译： 一种用于将芯片集成到柔性基板上以形成柔性微系统的制造方法。 该方法包括低温​​倒装芯片和晶片级制造工艺。 使用低温倒装芯片技术，将芯片金属结合到柔性基板上。 为了将柔性基板与基板分离，使用蚀刻去除柔性基板下方的牺牲层。 本公开使用用于将芯片集成到柔性基板上的标准化微制造工艺。 本发明不使用特殊材料或制造工艺，为柔性微系统提供了具有成本效益的制造方法。