公开(公告)号：US06848175B2

公开(公告)日：2005-02-01

申请号：US10417544

申请日：2003-04-16

申请人： David K. Fork ,  Ping Mei ,  Koenraad F. Van Schuylenbergh

发明人： David K. Fork ,  Ping Mei ,  Koenraad F. Van Schuylenbergh

IPC分类号： G03F7/20 ,  B81B1/00 ,  B81B3/00 ,  B81C1/00 ,  B81C3/00 ,  H01F17/00 ,  H01F17/02 ,  H01F27/00 ,  H01F41/04 ,  H01L21/48 ,  H01L21/60 ,  H01L23/522 ,  H01L27/08 ,  H05K3/40 ,  H05K3/00

CPC分类号： H01L27/08 ,  H01F17/0033 ,  H01F41/041 ,  H01L21/4853 ,  H01L23/5227 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K3/4092 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49218 ,  H01L2924/00

摘要： Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. In one method the springs used to form out-of-plane structures are constrained via a tether to avoid bunching and entanglement. The high yield structure may be used in numerous electronic applications such as filter circuits.

摘要翻译： 描述了用于提高包括弹簧和线圈在内的平面外微结构结构的产量的几种方法和结构。 在一种方法中，用于形成平面外结构的弹簧通过系绳来约束以避免聚束和缠结。 高产量结构可用于许多电子应用中，例如滤波电路。

公开(公告)号：US06595787B2

公开(公告)日：2003-07-22

申请号：US09780163

申请日：2001-02-09

申请人： David K. Fork ,  Ping Mei ,  Koenraad F. Van Schuylenbergh

发明人： David K. Fork ,  Ping Mei ,  Koenraad F. Van Schuylenbergh

IPC分类号： H01R1200

CPC分类号： H01L27/08 ,  H01F17/0033 ,  H01F41/041 ,  H01L21/4853 ,  H01L23/5227 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K3/4092 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49218 ,  H01L2924/00

摘要： Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. In one method the springs used to form out-of-plane structures are constrained via a tether to avoid bunching and entanglement. The high yield structure may be used in numerous electronic applications such as filter circuits.

公开(公告)号：US07284324B2

公开(公告)日：2007-10-23

申请号：US11197675

申请日：2005-08-04

申请人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

发明人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC分类号： H01R43/16

CPC分类号： H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

摘要翻译： 可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。 光刻图案的线圈结构包括具有固有应力分布的弹性构件。 固有的应力分布使形成环绕的基板远离基板偏移。 锚固部分​​保持固定到基底上。 自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。 一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

公开(公告)号：US07713388B2

公开(公告)日：2010-05-11

申请号：US11364111

申请日：2006-02-27

申请人： Christopher L. Chua ,  Thomas Hantschel ,  David K. Fork ,  Koenraad F. Van Schuylenbergh ,  Yan Yan Yang

发明人： Christopher L. Chua ,  Thomas Hantschel ,  David K. Fork ,  Koenraad F. Van Schuylenbergh ,  Yan Yan Yang

IPC分类号： C23C14/34

CPC分类号： C23C30/00 ,  B81B2203/0118 ,  B81B2203/019 ,  B81C1/00007 ,  B81C1/0019 ,  C23C28/00 ,  C23C28/021 ,  C23C28/023 ,  C25D1/003 ,  C25D1/20 ,  C25D5/022 ,  C25D5/10 ,  C25D5/50 ,  H01F17/0006 ,  H01L27/08 ,  Y10T428/24942

摘要： A structure has at least one structure component formed of a first material residing on a substrate, such that the structure is out of a plane of the substrate. A first coating of a second material then coats the structure. A second coating of a non-oxidizing material coats the structure at a thickness less than a thickness of the second material.

摘要翻译： 结构具有由驻留在基板上的第一材料形成的至少一个结构部件，使得该结构在基板的平面之外。 然后第二材料的第一涂层然后涂覆该结构。 非氧化材料的第二涂层以小于第二材料厚度的厚度涂覆结构。

公开(公告)号：US07141734B1

公开(公告)日：2006-11-28

申请号：US11313902

申请日：2005-12-20

申请人： David K. Fork ,  Koenraad F. Van Schuylenbergh

发明人： David K. Fork ,  Koenraad F. Van Schuylenbergh

IPC分类号： H01L31/42 ,  H01L31/05

CPC分类号： H01L31/02016 ,  Y02B10/14

摘要： An alternating current (AC) solar power apparatus includes a photovoltaic cell and a circuit or device for causing a signal generated by the photovoltaic cell to oscillate in a negative differential resistance range, thereby producing an AC output voltage. The photovoltaic cell exhibits negative differential resistance in its current/voltage (IV) curve in the presence of high flux illumination, wherein when the output voltage is within a negative differential resistance range, an incremental increase in the output voltage produces an associated decrease in generated current. By connecting the terminals of the photovoltaic cell to a resonator (e.g., an inductive-capacitive circuit) or other device that produces oscillation within the negative differential resistance range, the photovoltaic cell is caused to produce AC power.

摘要翻译： 交流（AC）太阳能发电装置包括光伏电池和用于使由光伏电池产生的信号在负的差分电阻范围内振荡的电路或装置，从而产生AC输出电压。 在存在高通量照明的情况下，光伏电池在其电流/电压（IV）曲线中呈现负的差分电阻，其中当输出电压在负的差分电阻范围内时，输出电压的增加的增加产生相应的减少 当前。 通过将光伏电池的端子连接到在负差分电阻范围内产生振荡的谐振器（例如，电感 - 电容电路）或其他装置，使得光伏电池产生AC电力。

公开(公告)号：US07121859B2

公开(公告)日：2006-10-17

申请号：US11226186

申请日：2005-09-13

申请人： Koenraad F. Van Schuylenbergh ,  Armin R. Völkel ,  Thomas H. DiStefano ,  Michel A. Rosa ,  David K. Fork ,  Eugene M. Chow ,  Meng H. Lean

发明人： Koenraad F. Van Schuylenbergh ,  Armin R. Völkel ,  Thomas H. DiStefano ,  Michel A. Rosa ,  David K. Fork ,  Eugene M. Chow ,  Meng H. Lean

IPC分类号： H01R13/15

CPC分类号： H01R12/78 ,  H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/044 ,  H05K2201/09845

摘要： A data transmission interconnect assembly capable of transmission speeds in excess of 40 Gbps in which, for example, a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring interface members are formed on the contact structure pressed against the cables to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press the contact structure, having the microspring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

摘要翻译： 一种数据传输互连组件，其能够传输超过40​​Gbps的传输速度，其中，例如，使用弯曲以在连接的板之间提供连续的平滑曲线的柔性扁平电缆将线卡可拆卸地耦合到背板，以及 通过使用对所发送的信号波透明的电缆到电缆接口部件的连接装置连接。 微型接头构件形成在抵抗电缆的接触结构上，以提供比发射信号的波长小的接口布置。 连接器装置使用凸轮机构来对准电缆，然后将具有形成在其上的微弹簧接口构件的接触结构压靠在电缆上。 替代接触结构使用各向异性导电膜。

公开(公告)号：US07000315B2

公开(公告)日：2006-02-21

申请号：US10387203

申请日：2003-03-11

申请人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

发明人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC分类号： H01R43/16

CPC分类号： H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

公开(公告)号：US06856225B1

公开(公告)日：2005-02-15

申请号：US09573815

申请日：2000-05-17

申请人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

发明人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC分类号： H01F41/04 ,  G01R1/067 ,  G01R3/00 ,  G03C5/00 ,  H01F17/00 ,  H01F17/02 ,  H01F27/29 ,  H01L21/02 ,  H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/522 ,  H01R9/03 ,  H05K7/02

CPC分类号： H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

摘要翻译： 可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。 光刻图案的线圈结构包括具有固有应力分布的弹性构件。 固有的应力分布使形成环绕的基板远离基板偏移。 锚固部分​​保持固定到基底上。 自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。 一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

公开(公告)号：US06655964B2

公开(公告)日：2003-12-02

申请号：US09780185

申请日：2001-02-09

申请人： David K. Fork ,  Christopher L. Chua ,  Koenraad F. Van Schuylenbergh ,  Noble M. Johnson ,  David K. Biegelsen

发明人： David K. Fork ,  Christopher L. Chua ,  Koenraad F. Van Schuylenbergh ,  Noble M. Johnson ,  David K. Biegelsen

IPC分类号： H01R1200

CPC分类号： H01L27/08 ,  H01F17/0033 ,  H01F41/041 ,  H01L21/4853 ,  H05K3/4092

摘要： Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. In one method the elastic members have graded perforations for controlling rate of release. In another method and structure, a layout enables the contact landing area to be increased. The high yield structures may be used in numerous electronic applications such as filter circuits.

公开(公告)号：US06621141B1

公开(公告)日：2003-09-16

申请号：US10201094

申请日：2002-07-22

申请人： Koenraad F. Van Schuylenbergh ,  Christopher L. Chua ,  David K. Fork

发明人： Koenraad F. Van Schuylenbergh ,  Christopher L. Chua ,  David K. Fork

IPC分类号： H01L2900

CPC分类号： H01L23/5227 ,  H01F17/0033 ,  H01F27/362 ,  H01G5/18 ,  H01G5/38 ,  H01L23/645 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4813 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/05599

摘要： Patterned ground planes are formed between out-of-plane microcoil structures and underlying integrated circuits (ICs). Each out-of-plane coil includes a series of loops extending from base (contact) pads formed on a dielectric layer (e.g., thick IC passivation, or BCB formed on thin passivation). Losses due to capacitive coil-to-substrate coupling are minimized using a central ground plane structure located under the base pads of the microcoil. Magnetic losses are reduced by forming a low-resistance ground plane structure including end portions located outside of the ends of the microcoil. The low-resistance ground plane can be slotted to reduce the loop size of eddy current pathways. The low-resistance ground plane is formed from one or more of the top IC metal layers, copper pads formed between the IC passivation and the dielectric, portions of the metal used to form the microcoil, or combinations thereof.

摘要翻译： 图形化的接地平面形成在平面外线圈结构和底层集成电路（IC）之间。 每个平面外线圈包括从形成在电介质层上的基底（接触）焊盘延伸的一系列环（例如，厚的IC钝化或在薄钝化上形成的BCB）。 使用位于微线圈的底座下方的中心接地平面结构，可以最大限度地减少由于电容性线圈到衬底​​耦合引起的损耗。 通过形成包括位于微线圈的端部外部的端部的低电阻接地平面结构来减小磁损耗。 低电阻接地层可以开槽，以减少涡流通路的环路尺寸。 低电阻接地层由一个或多个顶部IC金属层，形成在IC钝化层和电介质之间的铜焊盘，用于形成微型线圈的金属部分或其组合形成。