公开(公告)号：US07284324B2

公开(公告)日：2007-10-23

申请号：US11197675

申请日：2005-08-04

申请人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

发明人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC分类号： H01R43/16

CPC分类号： H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

摘要翻译： 可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。 光刻图案的线圈结构包括具有固有应力分布的弹性构件。 固有的应力分布使形成环绕的基板远离基板偏移。 锚固部分​​保持固定到基底上。 自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。 一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

公开(公告)号：US07713388B2

公开(公告)日：2010-05-11

申请号：US11364111

申请日：2006-02-27

申请人： Christopher L. Chua ,  Thomas Hantschel ,  David K. Fork ,  Koenraad F. Van Schuylenbergh ,  Yan Yan Yang

发明人： Christopher L. Chua ,  Thomas Hantschel ,  David K. Fork ,  Koenraad F. Van Schuylenbergh ,  Yan Yan Yang

IPC分类号： C23C14/34

CPC分类号： C23C30/00 ,  B81B2203/0118 ,  B81B2203/019 ,  B81C1/00007 ,  B81C1/0019 ,  C23C28/00 ,  C23C28/021 ,  C23C28/023 ,  C25D1/003 ,  C25D1/20 ,  C25D5/022 ,  C25D5/10 ,  C25D5/50 ,  H01F17/0006 ,  H01L27/08 ,  Y10T428/24942

摘要： A structure has at least one structure component formed of a first material residing on a substrate, such that the structure is out of a plane of the substrate. A first coating of a second material then coats the structure. A second coating of a non-oxidizing material coats the structure at a thickness less than a thickness of the second material.

摘要翻译： 结构具有由驻留在基板上的第一材料形成的至少一个结构部件，使得该结构在基板的平面之外。 然后第二材料的第一涂层然后涂覆该结构。 非氧化材料的第二涂层以小于第二材料厚度的厚度涂覆结构。

公开(公告)号：US07141734B1

公开(公告)日：2006-11-28

申请号：US11313902

申请日：2005-12-20

申请人： David K. Fork ,  Koenraad F. Van Schuylenbergh

发明人： David K. Fork ,  Koenraad F. Van Schuylenbergh

IPC分类号： H01L31/42 ,  H01L31/05

CPC分类号： H01L31/02016 ,  Y02B10/14

摘要： An alternating current (AC) solar power apparatus includes a photovoltaic cell and a circuit or device for causing a signal generated by the photovoltaic cell to oscillate in a negative differential resistance range, thereby producing an AC output voltage. The photovoltaic cell exhibits negative differential resistance in its current/voltage (IV) curve in the presence of high flux illumination, wherein when the output voltage is within a negative differential resistance range, an incremental increase in the output voltage produces an associated decrease in generated current. By connecting the terminals of the photovoltaic cell to a resonator (e.g., an inductive-capacitive circuit) or other device that produces oscillation within the negative differential resistance range, the photovoltaic cell is caused to produce AC power.

摘要翻译： 交流（AC）太阳能发电装置包括光伏电池和用于使由光伏电池产生的信号在负的差分电阻范围内振荡的电路或装置，从而产生AC输出电压。 在存在高通量照明的情况下，光伏电池在其电流/电压（IV）曲线中呈现负的差分电阻，其中当输出电压在负的差分电阻范围内时，输出电压的增加的增加产生相应的减少 当前。 通过将光伏电池的端子连接到在负差分电阻范围内产生振荡的谐振器（例如，电感 - 电容电路）或其他装置，使得光伏电池产生AC电力。

公开(公告)号：US07121859B2

公开(公告)日：2006-10-17

申请号：US11226186

申请日：2005-09-13

申请人： Koenraad F. Van Schuylenbergh ,  Armin R. Völkel ,  Thomas H. DiStefano ,  Michel A. Rosa ,  David K. Fork ,  Eugene M. Chow ,  Meng H. Lean

发明人： Koenraad F. Van Schuylenbergh ,  Armin R. Völkel ,  Thomas H. DiStefano ,  Michel A. Rosa ,  David K. Fork ,  Eugene M. Chow ,  Meng H. Lean

IPC分类号： H01R13/15

CPC分类号： H01R12/78 ,  H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/044 ,  H05K2201/09845

摘要： A data transmission interconnect assembly capable of transmission speeds in excess of 40 Gbps in which, for example, a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring interface members are formed on the contact structure pressed against the cables to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press the contact structure, having the microspring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

摘要翻译： 一种数据传输互连组件，其能够传输超过40​​Gbps的传输速度，其中，例如，使用弯曲以在连接的板之间提供连续的平滑曲线的柔性扁平电缆将线卡可拆卸地耦合到背板，以及 通过使用对所发送的信号波透明的电缆到电缆接口部件的连接装置连接。 微型接头构件形成在抵抗电缆的接触结构上，以提供比发射信号的波长小的接口布置。 连接器装置使用凸轮机构来对准电缆，然后将具有形成在其上的微弹簧接口构件的接触结构压靠在电缆上。 替代接触结构使用各向异性导电膜。

公开(公告)号：US06848175B2

公开(公告)日：2005-02-01

申请号：US10417544

申请日：2003-04-16

申请人： David K. Fork ,  Ping Mei ,  Koenraad F. Van Schuylenbergh

发明人： David K. Fork ,  Ping Mei ,  Koenraad F. Van Schuylenbergh

IPC分类号： G03F7/20 ,  B81B1/00 ,  B81B3/00 ,  B81C1/00 ,  B81C3/00 ,  H01F17/00 ,  H01F17/02 ,  H01F27/00 ,  H01F41/04 ,  H01L21/48 ,  H01L21/60 ,  H01L23/522 ,  H01L27/08 ,  H05K3/40 ,  H05K3/00

CPC分类号： H01L27/08 ,  H01F17/0033 ,  H01F41/041 ,  H01L21/4853 ,  H01L23/5227 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K3/4092 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49218 ,  H01L2924/00

摘要： Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. In one method the springs used to form out-of-plane structures are constrained via a tether to avoid bunching and entanglement. The high yield structure may be used in numerous electronic applications such as filter circuits.

摘要翻译： 描述了用于提高包括弹簧和线圈在内的平面外微结构结构的产量的几种方法和结构。 在一种方法中，用于形成平面外结构的弹簧通过系绳来约束以避免聚束和缠结。 高产量结构可用于许多电子应用中，例如滤波电路。

公开(公告)号：US06595787B2

公开(公告)日：2003-07-22

申请号：US09780163

申请日：2001-02-09

申请人： David K. Fork ,  Ping Mei ,  Koenraad F. Van Schuylenbergh

发明人： David K. Fork ,  Ping Mei ,  Koenraad F. Van Schuylenbergh

IPC分类号： H01R1200

CPC分类号： H01L27/08 ,  H01F17/0033 ,  H01F41/041 ,  H01L21/4853 ,  H01L23/5227 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K3/4092 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49218 ,  H01L2924/00

摘要： Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils are described. In one method the springs used to form out-of-plane structures are constrained via a tether to avoid bunching and entanglement. The high yield structure may be used in numerous electronic applications such as filter circuits.

公开(公告)号：US07426117B2

公开(公告)日：2008-09-16

申请号：US11314827

申请日：2005-12-21

申请人： Koenraad F. Van Schuylenbergh ,  Eric Peeters ,  David K. Fork ,  Thomas Hantschel

发明人： Koenraad F. Van Schuylenbergh ,  Eric Peeters ,  David K. Fork ,  Thomas Hantschel

IPC分类号： H05K7/00

CPC分类号： H01L23/36 ,  H01L23/22 ,  H01L23/295 ,  H01L23/315 ,  H01L23/3185 ,  H01L23/32 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/42 ,  H01L23/49833 ,  H01L23/552 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/72 ,  H01L24/81 ,  H01L2023/4043 ,  H01L2224/10135 ,  H01L2224/13109 ,  H01L2224/16 ,  H01L2224/17517 ,  H01L2224/29109 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/73253 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81901 ,  H01L2224/83951 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19043 ,  H01L2924/3025 ,  Y10T29/49147 ,  H01L2924/0132 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/72

摘要： An integrated circuit (IC) die/substrate assembly includes an IC die and a substrate that are electrically coupled through an interconnect formed on the IC die. The IC die/substrate assembly further includes at least one coupling that facilitates maintaining an IC die/substrate gap definition between the IC die and the substrate.

摘要翻译： 集成电路（IC）管芯/衬底组件包括通过形成在IC管芯上的​​互连电耦合的IC管芯和衬底。 IC芯片/基板组件还包括至少一个耦合，其有助于保持IC管芯和衬底之间的IC管芯/衬底间隙限定。

公开(公告)号：US07293996B2

公开(公告)日：2007-11-13

申请号：US11463283

申请日：2006-08-08

申请人： Koenraad F. Van Schuylenbergh ,  Christopher L. Chua ,  David K. Fork

发明人： Koenraad F. Van Schuylenbergh ,  Christopher L. Chua ,  David K. Fork

IPC分类号： H01R12/00

CPC分类号： H01L24/72 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06761 ,  G01R1/06772 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P3/081 ,  H01P3/085 ,  H01R12/718 ,  H01R13/24 ,  H01R13/6461 ,  H01R13/6477 ,  H05K1/0218 ,  H05K3/4092

摘要： A curved transmission-line spring structure formed by self-bending materials (e.g., stress-engineered materials, intermetallic compounds and/or bimorphs) that are layered to form a stripline or microstrip transmission line. A dielectric layer is sandwiched between two conductive layers, which form the signal and ground lines of the structure. The various layers are etched to form an elongated spring structure, and then one end of the spring structure is released from the underlying substrate, causing the tip of the released end to bend away from the substrate for contact with a second device. One or both of the conductive layers is fabricated using self-bending spring metals to facilitate the bending process, and plated metal is utilized for conductivity. Alternatively, or in addition, the dielectric layer is formed using a stress-engineered dielectric material. Two-tip and three-tip structures are used to facilitate connection of both the ground and signal lines.

摘要翻译： 通过层叠以形成带状线或微带传输线的自弯曲材料（例如，应力工程材料，金属间化合物和/或双压电晶片）形成的弯曲传输线弹簧结构。 介电层夹在两个导电层之间，形成结构的信号和接地线。 蚀刻各种层以形成细长的弹簧结构，然后弹簧结构的一端从下面的基底释放，使得释放端的尖端远离基板弯曲以与第二装置接触。 使用自弯曲弹簧金属制造一个或两个导电层以促进弯曲过程，并且将电镀金属用于导电性。 或者或另外，使用应力工程介电材料形成电介质层。 两端和三端结构用于促进接地和信号线的连接。

公开(公告)号：US07015584B2

公开(公告)日：2006-03-21

申请号：US10615653

申请日：2003-07-08

申请人： Eugene M. Chow ,  David K. Fork ,  Thomas Hantschel ,  Koenraad F. Van Schuylenbergh ,  Christopher L. Chua

发明人： Eugene M. Chow ,  David K. Fork ,  Thomas Hantschel ,  Koenraad F. Van Schuylenbergh ,  Christopher L. Chua

IPC分类号： H01L23/48

CPC分类号： F16F1/027

摘要： Lithographically defined and etched spring structures are produced by various methods such that they avoid the formation of a plated metal wedge on an underside of the spring structure after release. A post is utilized to offset the spring from an underlying substrate by a distance greater than the thickness of the plated metal. A trench is etched into the substrate below the spring to provide clearance during deflection of the spring. Another spring includes a knee (bend) that provides the necessary clearance during deflection. A plating process is limited to the upper side of another spring. A released spring is used as a shadow mask for patterning resist that prevents wedge formation during plating. Various tip arrangements are disclosed that can be utilized with each spring structure

摘要翻译： 通过各种方法制造光刻定义和蚀刻的弹簧结构，使得它们在释放之后避免在弹簧结构的下侧上形成电镀金属楔。 使用柱子将弹簧从下面的衬底偏移大于电镀金属的厚度的距离。 在弹簧下方的衬底中蚀刻沟槽，以在弹簧偏转期间提供间隙。 另一个弹簧包括在偏转期间提供必要的间隙的膝盖（弯头）。 电镀工艺限于另一弹簧的上侧。 释放的弹簧用作用于图案化抗蚀剂的荫罩，其防止电镀期间的楔形成。 公开了可以与每个弹簧结构一起使用的各种尖端装置

公开(公告)号：US06966784B2

公开(公告)日：2005-11-22

申请号：US10742501

申请日：2003-12-19

申请人： Koenraad F. Van Schuylenbergh ,  Armin R. Völkel ,  Thomas H. DiStefano ,  Michel A. Rosa ,  David K. Fork ,  Eugene M. Chow ,  Meng H. Lean

发明人： Koenraad F. Van Schuylenbergh ,  Armin R. Völkel ,  Thomas H. DiStefano ,  Michel A. Rosa ,  David K. Fork ,  Eugene M. Chow ,  Meng H. Lean

IPC分类号： H05K1/14 ,  H01B11/00 ,  H01R12/00 ,  H01R12/04 ,  H05K3/32 ,  H05K3/36

CPC分类号： H01R12/78 ,  H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/044 ,  H05K2201/09845

摘要： A data transmission interconnect assembly (e.g., a router) capable of transmission speeds in excess of 40 Gbps in which a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring contact structures are formed on the cables, or on a contact structure pressed against the cables, to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press a contact structure, having micro spring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

摘要翻译： 能够传输速度超过40Gbps的数据传输互连组件（例如，路由器），其中线卡可以使用柔性扁平电缆可拆卸地耦合到背板，弯曲以在连接的板之间提供连续的平滑曲线 并且通过采用对所发送的信号波透明的电缆到电缆接口部件的连接装置连接。 微电缆接触结构形成在电缆上或按压在电缆上的接触结构上，以提供小于传输信号的波长的接口布置。 连接器装置使用凸轮机构对准电缆，然后将形成有微弹簧接口构件的接触结构压靠在电缆上。 替代接触结构使用各向异性导电膜。