摘要:
A NAND-type nonvolatile semiconductor memory device comprising a cell string that comprises a dummy cell interposed between and connected in series to a string selection transistor and a nonvolatile memory cell is provided. The NAND-type nonvolatile semiconductor memory device further comprises a dummy word line driver adapted to activate a dummy word line to gate the dummy cell.
摘要:
An integrated circuit memory device includes a memory cell array including first and second bit lines that extend side-by-side, a plurality of page buffers, a first isolation device electrically coupled to an end of the first bit line, and a second isolation device electrically coupled to an end of the second bit line. The second isolation device is arranged farther from the plurality of page buffers than the first isolation device. A first connection line is electrically coupled at a first end thereof to the first isolation device, and is electrically coupled at a second end thereof to one of the plurality of page buffers. A second connection line is electrically coupled at a first end thereof to the second isolation device, and is electrically coupled at a second end thereof to a farther one of the plurality of page buffers. The second connection line is arranged immediately adjacent to the first bit line.
摘要:
In one aspect, a programming method is provided for a non-volatile semiconductor memory device which includes a plurality of electrically programmable and erasable memory cells, and transmission transistors for providing predetermined voltages to the memory cells. The method includes a primary programming process which includes providing a first program voltage to a selected memory cell to program the selected memory cell, a verify read process which includes reading the selected memory cell to verify a programmed status of the selected memory cell resulting from the primary programming process, and a secondary programming process which includes providing a second program voltage to the selected memory cell so as to reprogram the selected memory cell after the verify read process. During the verify read process, the transmission transistors are continuously gated by a boosted voltage generated during the primary programming process. The boosted voltage has a voltage level which is sufficient to provide the first and second program voltages to the memory cell.
摘要:
A semiconductor memory device comprises a cell array including a plurality of memory cells. The semiconductor memory device further comprises a plurality of bitlines formed in a bit layer and connected to the plurality of memory cells, wherein the bitlines extend from the cell array along a single direction. A common source line is formed in a common source layer and adapted to provide a predetermined source voltage to the plurality of memory cells. A voltage control block comprising a plurality of voltage control circuits adapted to control the voltage levels of the plurality of bitlines through voltage supply lines formed in a voltage-line metal layer is formed on one side of the cell array.
摘要:
A memory device may include a gate structure including a plurality of gate electrode layers and a plurality of insulating layers alternately stacked on a substrate, a plurality of etching stop layers, extending from the insulating layers respectively, being on respective lower portions of the gate electrode layers; and a plurality of contacts connected to the gate electrode layers above upper portions of the etching stop layers, respectively, wherein respective ones of the etching stop layers include an air gap therein.
摘要:
A method of operating a non-volatile memory device included in a memory card can be provided by re-mapping addresses of bad blocks in a first non-volatile MAT in a memory card and re-mapping addresses of bad blocks in a second non-volatile MAT in the memory card, the second non-volatile MAT including blocks that are address mapped with blocks in the first non-volatile MAT. Also a method of scanning a non-volatile memory device for bad blocks can be provided by sequentially scanning blocks in a non-volatile memory device for data indicating that a respective block is a bad block starting at a starting block address that is above a lowermost block address of the non-volatile memory device, wherein the starting block address is based on a yield for the non-volatile memory device.
摘要:
A method of operating a non-volatile memory device included in a memory card can be provided by re-mapping addresses of bad blocks in a first non-volatile MAT in a memory card and re-mapping addresses of bad blocks in a second non-volatile MAT in the memory card, the second non-volatile MAT including blocks that are address mapped with blocks in the first non-volatile MAT. Also a method of scanning a non-volatile memory device for bad blocks can be provided by sequentially scanning blocks in a non-volatile memory device for data indicating that a respective block is a bad block starting at a starting block address that is above a lowermost block address of the non-volatile memory device, wherein the starting block address is based on a yield for the non-volatile memory device.
摘要:
A semiconductor memory device comprises a cell array including a plurality of memory cells. The semiconductor memory device further comprises a plurality of bitlines formed in a bit layer and connected to the plurality of memory cells, wherein the bitlines extend from the cell array along a single direction. A common source line is formed in a common source layer and adapted to provide a predetermined source voltage to the plurality of memory cells. A voltage control block comprising a plurality of voltage control circuits adapted to control the voltage levels of the plurality of bitlines through voltage supply lines formed in a voltage-line metal layer is formed on one side of the cell array.
摘要:
Flash memory devices include at least one flash memory array and an address compare circuit that is configured to indicate whether an applied row address associated with a first operation (e.g., program, erase) is within or without an unlock area of the at least one flash memory array. A control circuit is also provided. This control circuit is configured to block performance of the first operation on the flash memory array in response to detecting an indication from the address compare circuit that the applied row address is outside the unlock area of the flash memory array.
摘要:
A memory device may include a gate structure including a plurality of gate electrode layers and a plurality of insulating layers alternately stacked on a substrate, a plurality of etching stop layers, extending from the insulating layers respectively, being on respective lower portions of the gate electrode layers; and a plurality of contacts connected to the gate electrode layers above upper portions of the etching stop layers, respectively, wherein respective ones of the etching stop layers include an air gap therein.