摘要:
Fusion splicing of optical fiber generally requires removal of a polymer coating from the end portions of two lengths of fiber. A conventional removal method involves immersion of the fiber ends in an appropriate polymer stripping liquid, e.g., in hot, concentrated sulfuric acid. It is known that the strength of fusion splices generally is statistically distributed, such that there exists a probability that a given splice will pass at a given proof test level. We have found that the splice strength distribution can be shifted towards higher strength if the polymer stripping liquid comprises means for insuring that the liquid is essentially free of strength-reducing particles. Preferred means are concentrated nitric acid. Exemplarily, the liquid is at a temperature in the range 170.degree.-200.degree. C. and comprises concentrated (about 95%) sulfuric acid and about 5% b.v. concentrated (about 70%) nitric acid.
摘要:
Disclosed is a planar optical waveguide that is manufacturable by the compression molding or embossing of a multilayer film of polymeric material. In one embodiment, the waveguide comprises a core layer of relatively high refractive index included between cladding layers of lower refractive index. The waveguiding channels are bounded by regions where the cladding layers are in contact and from which core material has been excluded.
摘要:
A latent-imaging photopolymer system for recording thick refractive index patterns is disclosed. The system utilizes a porous matrix which has been sensitized by chemisorption of a photosensitive polymerization initiator. The sensitized matrix is exposed to light in the desired pattern. This light destroys initiator to impress the pattern. Then the pores are filled with a monomer composition. Finally the entire filled matrix is irradiated to induce polymerization initiation by the sensitizer remaining after the initial exposure. Polymerization produces locally induced refractive index gradients corresponding to the pattern of the light in the initial exposure step.
摘要:
A water-based polymeric coating comprising a novolak resin is deposited electrolytically from a solution of a novolak resin upon a conductive substrate at an initial current density ranging from 10-30 milliamperes per square centimeter. The resultant coating, after cross linking by subsequent chemical treatment, is flexible, firmly adherent and evidences good thermal stability and insulation characteristics, so suggesting its use as a cover coat for printed circuits.
摘要:
Lowered cost fabrication including preparation of large bodies of void-free, high-silica glass, depends upon gellation of an aqueous sol of colloidal silica particles, followed by drying and firing of such gel. Freedom from cracks in the dried gel is the consequence of included polymeric material which wets the particles. The polymeric material is removed by thermal decomposition attended upon temperature attained in firing.
摘要:
Siloxane compounds formed by the reaction of a hydridosiloxane with vinylsiloxane are employed in a wide variety of uses, e.g., coatings for optical fibers and flexible layers for touch screen cathode ray tubes. These siloxane materials are substantially improved through treatment with a lower alkene such as ethylene to prevent hydrogen evolution and undesirable crosslinking.
摘要:
Circuit boards with advantageous properties are produced through the addition of a fluorescent dye. The presence of the dye allows an expeditious inspection of the metallic pattern on the circuit board by induced fluorescence.
摘要:
Conformal layers of a silicon oxide, such as silicon dioxide, are deposited at temperatures below 600 degrees C. through the decomposition of compounds such as diacetoxyditertiarybutoxysilane. The required temperatures do not significantly affect temperature-sensitive structures. Therefore, it is possible to form silicon oxide regions in the processing of devices having these structures. More generally, lowered-temperature processing can be applied to the deposition of other materials which include silicon oxide. For example, borophosphosilicate glasses can be deposited by chemical vapor deposition processing involving flash-evaporation of a mixture of liquid precursor reagents.
摘要:
Conformal layers of a silicon oxide, such as silicon dioxide, are deposited at temperatures below 600 degrees C. through the decomposition of compounds such as diacetoxyditertiarybutoxysilane. The required temperatures do not significantly affect temperature-sensitive structures. Therefore, it is possible to form silicon oxide regions in the processing of devices having these structures.
摘要:
Photosensitive bodies that are sensitive to ultraviolet radiation and that exhibit excellent contrast are formed from base soluble polymers such as poly(methyl methacrylate-co-methacrylic acid) physically mixed with base insoluble materials such as o,o'-dinitrobenzyl esters. The base insoluble esters decompose upon irradiation to form base soluble entities in the irradiated regions. These irradiated portions are then soluble in basic solutions that are used to develop the desired image.