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公开(公告)号：US20090175964A1
公开(公告)日：2009-07-09
申请号：US12316205
申请日：2008-12-10
IPC分类号： A61K36/00
CPC分类号： A61K31/198 , A61K36/39 , A61K36/8965 , A61K2300/00
摘要： Disclosed is an edible composition for enhanced immunity comprising theanine or a source of theanine and a herb selected from Shankhpushpi, Shatavari, or a mixture thereof.
摘要翻译： 公开了一种用于增强免疫力的可食用组合物，其包含茶氨酸或茶氨酸源和选自Shankhpushpi，Shatavari或其混合物的草药。
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公开(公告)号：US20090169654A1
公开(公告)日：2009-07-02
申请号：US12316203
申请日：2008-12-10
申请人： Gautam Banerjee , Vishi Bansal , Jyoti Bhat , Rajendra Mohan Dobriyal , Hem Chandra Joshi , Smitha Ashok Upadhyaya , Pankaj Pradyumnarai Vaishnav
发明人： Gautam Banerjee , Vishi Bansal , Jyoti Bhat , Rajendra Mohan Dobriyal , Hem Chandra Joshi , Smitha Ashok Upadhyaya , Pankaj Pradyumnarai Vaishnav
IPC分类号： A61K36/82
摘要： A composition comprising tea, 0.1 to 15% by weight of herb selected from Shankhpushpi, Shatavari, Vidarikhand, Arogyapacha or a mixture thereof; and 0.01 to 0.5% by weight of a flavouring agent is disclosed. Also disclosed is a process for manufacturing the composition.
摘要翻译： 一种组合物，其包含0.1至15重量％的选自Shankhpushpi，Shatavari，Vidarikhand，Arogyapacha或其混合物的草本的茶; 并且公开了0.01至0.5重量％的调味剂。 还公开了制造组合物的方法。
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公开(公告)号：US20140170084A1
公开(公告)日：2014-06-19
申请号：US14125323
申请日：2012-05-15
申请人： Prasun Bandyopadhyay , Gautam Banerjee , Amit Kumar Ghosh , Reshmee Mukhopadhyay , Smitha Ashok Upadhyaya
发明人： Prasun Bandyopadhyay , Gautam Banerjee , Amit Kumar Ghosh , Reshmee Mukhopadhyay , Smitha Ashok Upadhyaya
摘要： The present invention relates to an oral care composition comprising catechins. We have found that the catechins tend to darken the colour of the chalk based toothpaste due to its oxidation which happens at the high pH of the toothpaste. Once the catechins are oxidized and darken the colour of the toothpaste it is no longer available as such for providing anti-inflammatory benefits. It is an object of the invention to provide a chalk based toothpaste formulation which does not turn substantially dark due to ox illation of catechins. The present inventors while working with oral care compositions comprising catechins preferably green tea catechins for providing anti-inflammatory benefits, surprisingly found that some selected zinc salts when added in particular quantities do not result in darkening the colour of the toothpaste, and also, when stored, are able to deliver green tea catechins.
摘要翻译： 本发明涉及包含儿茶素的口腔护理组合物。 我们已经发现，由于在牙膏的高pH下发生的氧化，儿茶素倾向于使白垩牙膏的颜色变暗。 一旦儿茶素被氧化并使牙膏的颜色变暗，则不再可用于提供抗炎益处。 本发明的一个目的是提供一种基于白垩的牙膏配方，其不会由于儿茶素的氧化而变黑。 本发明人在使用包含儿茶素的口腔护理组合物时，优选用于提供抗炎益处的绿茶儿茶素令人惊奇地发现，当特定量添加时，某些选择的锌盐不会导致牙膏的颜色变暗，并且当储存时 ，能够提供绿茶儿茶素。
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公开(公告)号：US09439846B2
公开(公告)日：2016-09-13
申请号：US14125323
申请日：2012-05-15
申请人： Prasun Bandyopadhyay , Gautam Banerjee , Amit Kumar Ghosh , Reshmee Mukhopadhyay , Smitha Ashok Upadhyaya
发明人： Prasun Bandyopadhyay , Gautam Banerjee , Amit Kumar Ghosh , Reshmee Mukhopadhyay , Smitha Ashok Upadhyaya
IPC分类号： A61Q11/00 , A61K8/27 , A61K33/30 , A61K33/06 , A61K33/10 , A61K36/82 , A61K8/97 , A61K8/49 , A61K8/19
摘要： The present invention relates to an oral care composition comprising catechins. We have found that the catechins tend to darken the color of the chalk based toothpaste due to its oxidation which happens at the high pH of the toothpaste. Once the catechins are oxidized and darken the color of the toothpaste it is no longer available as such for providing anti-inflammatory benefits. It is an object of the invention to provide a chalk based toothpaste formulation which does not turn substantially dark due to oxidation of catechins. The present inventors while working with oral care compositions comprising catechins preferably green tea catechins for providing anti-inflammatory benefits, surprisingly found that some selected zinc salts when added in particular quantities do not result in darkening the color of the toothpaste, and also, when stored, are able to deliver green tea catechins.
摘要翻译： 本发明涉及包含儿茶素的口腔护理组合物。 我们已经发现，由于在牙膏的高pH下发生的氧化，儿茶素倾向于使白垩牙膏的颜色变暗。 一旦儿茶素被氧化并使牙膏的颜色变暗，则不再可用于提供抗炎益处。 本发明的一个目的是提供一种基于白垩的牙膏配方，其不会由于儿茶素类的氧化而变黑。 本发明人在使用包含儿茶素的口腔护理组合物时，优选用于提供抗炎益处的绿茶儿茶素令人惊奇地发现，当特定量添加时，某些选择的锌盐不会导致牙膏的颜色变暗，并且当储存时 ，能够提供绿茶儿茶素。
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公开(公告)号：US20110136717A1
公开(公告)日：2011-06-09
申请号：US12797903
申请日：2010-06-10
申请人： Dnyanesh Chandrakant Tamboli , Madhukar Bhaskara Rao , Gautam Banerjee , Keith Randolph Fabregas
发明人： Dnyanesh Chandrakant Tamboli , Madhukar Bhaskara Rao , Gautam Banerjee , Keith Randolph Fabregas
CPC分类号： C11D11/0047 , C11D3/30 , C11D3/378 , C11D7/3209 , G03F7/423 , G03F7/425 , G03F7/426 , H05K3/26
摘要： The present invention is a method of cleaning to removal residue in semiconductor manufacturing processing, comprising contacting a surface to be cleaned with an aqueous formulation having a polymer selected from the group consisting of acrylamido-methyl-propane sulfonate) polymers, acrylic acid-2-acrylamido-2-methylpropane sulfonic acid copolymer and mixtures thereof and a quaternary ammonium hydroxide having greater than 4 carbon atoms or choline hydroxide with a non-acetylinic surfactant.The present invention is also a post-CMP cleaning formulation having the components set forth in the method above.
摘要翻译： 本发明是清洁半导体制造加工中的残留物的方法，包括使待清洗的表面与具有选自丙烯酰胺基 - 甲基 - 丙烷磺酸盐的聚合物的聚合物，丙烯酸-2- 丙烯酰胺基-2-甲基丙磺酸共聚物及其混合物，以及具有大于4个碳原子的氢氧化季铵或氢氧化胆碱与非乙酰基表面活性剂。 本发明也是具有上述方法的组分的后CMP清洗制剂。
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公开(公告)号：US20050205835A1
公开(公告)日：2005-09-22
申请号：US11065080
申请日：2005-02-25
申请人： Dnyanesh Tamboli , Gautam Banerjee
发明人： Dnyanesh Tamboli , Gautam Banerjee
IPC分类号： C11D3/26 , C11D3/20 , C11D3/30 , C11D3/33 , C11D3/34 , C11D7/26 , C11D7/32 , C11D11/00 , C23G5/024 , C23G5/036 , H01L21/02 , H01L21/304 , H01L21/306 , C09K13/00
CPC分类号： H01L21/02074 , C11D3/2086 , C11D3/26 , C11D3/33 , C11D7/265 , C11D7/32 , C11D7/3245 , C11D11/0047
摘要： A post-CMP cleaning composition and method comprising same are disclosed herein. In one aspect, there is provided a composition comprising: water, an organic base, and a plurality of chelating agents comprised of a poly-amino carboxylic acid and a hydroxylcarboxylic acid wherein the pH of the composition ranges from 9.5 to 11.5.
摘要翻译： 本文公开了CMP后清洁组合物及其组合方法。 在一个方面，提供了一种组合物，其包含：水，有机碱和由聚氨基羧酸和羟基羧酸组成的多种螯合剂，其中组合物的pH为9.5至11.5。
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公开(公告)号：US20050076580A1
公开(公告)日：2005-04-14
申请号：US10683553
申请日：2003-10-10
申请人： Dynanesh Tamboli , Stephen Hymes , Gautam Banerjee
发明人： Dynanesh Tamboli , Stephen Hymes , Gautam Banerjee
IPC分类号： B24B37/00 , C09G1/02 , C09K3/14 , C23F3/00 , H01L21/304 , H01L21/321 , B24D3/02
CPC分类号： H01L21/3212 , C09G1/02 , C09K3/1463 , C23F3/00
摘要： An acidic aqueous slurry composition comprising silica abrasive particles, an oxidizer, a quaternary ammonium hydroxide; and acid having a maximum pKa of about 2.5; and water is provided along with its use for polishing.
摘要翻译： 一种酸性含水浆料组合物，其包含二氧化硅磨料颗粒，氧化剂，季铵氢氧化物; 和最大pKa为约2.5的酸; 并提供水以及其用于抛光的用途。
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公开(公告)号：US08883701B2
公开(公告)日：2014-11-11
申请号：US13171252
申请日：2011-06-28
申请人： Dnyanesh Chandrakant Tamboli , Rajkumar Ramamurthi , David Barry Rennie , Madhukar Bhaskara Rao , Gautam Banerjee , Gene Everad Parris
发明人： Dnyanesh Chandrakant Tamboli , Rajkumar Ramamurthi , David Barry Rennie , Madhukar Bhaskara Rao , Gautam Banerjee , Gene Everad Parris
IPC分类号： C11D1/00 , C11D3/04 , C11D3/20 , C11D3/33 , C11D11/00 , B28D5/00 , H01L21/67 , C11D3/30 , H01L21/78
CPC分类号： C11D3/2082 , B28D5/0076 , C11D1/14 , C11D3/044 , C11D3/2075 , C11D3/30 , C11D3/33 , C11D11/0047 , H01L21/02076 , H01L21/67075 , H01L21/78 , H01L2224/0381 , H01L2224/04042 , H01L2224/05624 , H01L2224/05647 , H01L2224/94 , H01L2224/03
摘要： A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.
摘要翻译： 公开了半导体晶圆切片的解决方案。 在通过锯切切割晶片的过程中，溶液抑制污染物残留物或颗粒的粘附，并且减少或消除暴露的金属化区域的腐蚀。 该溶液包含至少一种有机酸和/或其盐; 至少一种表面活性剂和/或至少一种碱; 和去离子水，该组合物的pH等于或大于4.该溶液还可以包含螯合剂，消泡剂或分散剂。
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公开(公告)号：US09328318B2
公开(公告)日：2016-05-03
申请号：US14195285
申请日：2014-03-03
申请人： Dnyanesh Chandrakant Tamboli , Rajkumar Ramamurthi , David Barry Rennie , Madhukar Bhaskara Rao , Gautam Banerjee , Gene Everad Parris
发明人： Dnyanesh Chandrakant Tamboli , Rajkumar Ramamurthi , David Barry Rennie , Madhukar Bhaskara Rao , Gautam Banerjee , Gene Everad Parris
IPC分类号： H01L21/02 , C11D3/20 , B28D5/00 , C11D3/04 , C11D3/30 , C11D3/33 , C11D11/00 , H01L21/67 , C11D1/14 , H01L21/78
CPC分类号： C11D3/2082 , B28D5/0076 , C11D1/14 , C11D3/044 , C11D3/2075 , C11D3/30 , C11D3/33 , C11D11/0047 , H01L21/02076 , H01L21/67075 , H01L21/78 , H01L2224/0381 , H01L2224/04042 , H01L2224/05624 , H01L2224/05647 , H01L2224/94 , H01L2224/03
摘要： A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.
摘要翻译： 公开了半导体晶圆切片的解决方案。 在通过锯切切割晶片的过程中，溶液抑制污染物残留物或颗粒的粘附，并且减少或消除暴露的金属化区域的腐蚀。 该溶液包含至少一种有机酸和/或其盐; 至少一种表面活性剂和/或至少一种碱; 和去离子水，该组合物的pH等于或大于4.该溶液还可以包含螯合剂，消泡剂或分散剂。
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公开(公告)号：US08765653B2
公开(公告)日：2014-07-01
申请号：US12797903
申请日：2010-06-10
申请人： Dnyanesh Chandrakant Tamboli , Madhukar Bhaskara Rao , Gautam Banerjee , Keith Randolph Fabregas
发明人： Dnyanesh Chandrakant Tamboli , Madhukar Bhaskara Rao , Gautam Banerjee , Keith Randolph Fabregas
CPC分类号： C11D11/0047 , C11D3/30 , C11D3/378 , C11D7/3209 , G03F7/423 , G03F7/425 , G03F7/426 , H05K3/26
摘要： The present invention is a method of cleaning to removal residue in semiconductor manufacturing processing, comprising contacting a surface to be cleaned with an aqueous formulation having a polymer selected from the group consisting of acrylamido-methyl-propane sulfonate) polymers, acrylic acid-2-acrylamido-2-methylpropane sulfonic acid copolymer and mixtures thereof and a quaternary ammonium hydroxide having greater than 4 carbon atoms or choline hydroxide with a non-acetylinic surfactant.The present invention is also a post-CMP cleaning formulation having the components set forth in the method above.
摘要翻译： 本发明是清洁半导体制造加工中的残留物的方法，包括使待清洗的表面与具有选自丙烯酰胺基 - 甲基 - 丙烷磺酸盐的聚合物的聚合物，丙烯酸-2- 丙烯酰胺基-2-甲基丙磺酸共聚物及其混合物，以及具有大于4个碳原子的氢氧化季铵或氢氧化胆碱与非乙酰基表面活性剂。 本发明也是具有上述方法的组分的后CMP清洗制剂。
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