Method of fabrication of a support structure for a semiconductor device
    1.
    发明申请
    Method of fabrication of a support structure for a semiconductor device 有权
    制造半导体器件的支撑结构的方法

    公开(公告)号:US20050014349A1

    公开(公告)日:2005-01-20

    申请号:US10735695

    申请日:2003-12-16

    摘要: A method of fabricating a semiconductor device is described. In this method, a starting substrate of sufficient thickness is selected that has the required defect density levels, which may result in an undesirable doping level. Then a semiconductor layer having a desired doping level is formed on the starting substrate. The resulting semiconductor layer has the required defect density and doping levels for the final product application. After active components, electrical conductors, and any other needed structures are formed on the semiconductor layer, the starting substrate is removed leaving a desired thickness of the semiconductor layer. In a VECSEL application, the active components can be a gain cavity, where the semiconductor layer has the necessary defect density and doping levels to maximize wall plug efficiency (WPE). In one embodiment, the doping of the semiconductor layer is not uniform. For example, a majority of the layer is doped at a low level and the remainder is doped at a much higher level. This can result in improved WPE at particular thicknesses for the higher doped material.

    摘要翻译: 描述制造半导体器件的方法。 在该方法中,选择具有所需缺陷密度水平的足够厚度的起始衬底,这可能导致不期望的掺杂水平。 然后在起始衬底上形成具有期望的掺杂水平的半导体层。 所得到的半导体层具有所需的缺陷密度和最终产品应用的掺杂水平。 在有源部件之后,在半导体层上形成电导体和任何其它需要的结构,去除起始衬底,留出半导体层的所需厚度。 在VECSEL应用中,有源部件可以是增益腔,其中半导体层具有必要的缺陷密度和掺杂水平以最大化壁插拔效率(WPE)。 在一个实施例中,半导体层的掺杂不均匀。 例如,该层的大部分以低电平掺杂,其余部分以更高的水平掺杂。 这可以导致用于较高掺杂材料的特定厚度的改进的WPE。

    Method of fabrication of a support structure for a semiconductor device
    2.
    发明授权
    Method of fabrication of a support structure for a semiconductor device 有权
    制造半导体器件的支撑结构的方法

    公开(公告)号:US07189589B2

    公开(公告)日:2007-03-13

    申请号:US10735695

    申请日:2003-12-16

    IPC分类号: H01L21/00

    摘要: A method of fabricating a semiconductor device is described. In this method, a starting substrate of sufficient thickness is selected that has the required defect density levels, which may result in an undesirable doping level. Then a semiconductor layer having a desired doping level is formed on the starting substrate. The resulting semiconductor layer has the required defect density and doping levels for the final product application. After active components, electrical conductors, and any other needed structures are formed on the semiconductor layer, the starting substrate is removed leaving a desired thickness of the semiconductor layer. In a VECSEL application, the active components can be a gain cavity, where the semiconductor layer has the necessary defect density and doping levels to maximize wall plug efficiency (WPE). In one embodiment, the doping of the semiconductor layer is not uniform. For example, a majority of the layer is doped at a low level and the remainder is doped at a much higher level. This can result in improved WPE at particular thicknesses for the higher doped material.

    摘要翻译: 描述制造半导体器件的方法。 在该方法中,选择具有所需缺陷密度水平的足够厚度的起始衬底,这可能导致不期望的掺杂水平。 然后在起始衬底上形成具有期望的掺杂水平的半导体层。 所得到的半导体层具有所需的缺陷密度和最终产品应用的掺杂水平。 在有源部件之后,在半导体层上形成电导体和任何其它需要的结构,去除起始衬底,留出半导体层的所需厚度。 在VECSEL应用中,有源部件可以是增益腔,其中半导体层具有必要的缺陷密度和掺杂水平以最大化壁插拔效率(WPE)。 在一个实施例中,半导体层的掺杂不均匀。 例如,该层的大部分以低电平掺杂,其余部分以高得多的水平掺杂。 这可以导致用于较高掺杂材料的特定厚度的改进的WPE。

    InGaN diode-laser pumped II-VI semiconductor lasers
    4.
    发明申请
    InGaN diode-laser pumped II-VI semiconductor lasers 有权
    InGaN二极管激光泵浦II-VI半导体激光器

    公开(公告)号:US20050276301A1

    公开(公告)日:2005-12-15

    申请号:US10866907

    申请日:2004-06-14

    摘要: A semiconductor laser includes a multilayer semiconductor laser heterostructure including at least one active layer of a II-VI semiconductor material and is optically pumped by one or more indium gallium nitride (InGaN) diode-lasers. Group II elements in the II-VI semiconductor material are zinc, cadmium, magnesium, beryllium, strontium, and barium. Group VI elements in the II-VI semiconductor material are Sulfur, Selenium, and Tellurium. In one example of the laser an edge emitting heterostructure includes two active layers of zinc cadmium selenide, two waveguide layers of zinc magnesium sulfoselenide, and two cladding layers, also of zinc magnesium sulfoselenide. Proportions of elements in the cladding layer material and the waveguide layer material are selected such that the waveguide layer material has a higher bandgap than the material of the waveguide layers. In another example, a two dimensional array of InGaN diode-lasers is arranged to optically pump a one dimensional array of II-VI edge-emitting heterostructure lasers.

    摘要翻译: 半导体激光器包括包含至少一个II-VI半导体材料的有源层的多层半导体激光异质结构,并被一个或多个铟镓氮(InGaN)二极管激光器光泵浦。 II-VI族半导体材料中的II族元素是锌,镉,镁,铍,锶和钡。 II-VI族半导体材料中的VI族元素是硫,硒和碲。 在激光器的一个实例中,边缘发射异质结构包括两个硒化锌镉活性层,两个磺酸锌镁纳米波导层和两个包层,也是锌硫酸镁镁。 选择包层材料和波导层材料中的元素的比例使得波导层材料具有比波导层的材料更高的带隙。 在另一个示例中,布置InGaN二极管激光器的二维阵列以光学泵浦II-VI边缘发射异质结构激光器的一维阵列。

    Method of zinc oxide film grown on the epitaxial lateral overgrowth gallium nitride template
    5.
    发明授权
    Method of zinc oxide film grown on the epitaxial lateral overgrowth gallium nitride template 有权
    在外延横向过度生长的氮化镓模板上生长的氧化锌膜的方法

    公开(公告)号:US08257999B2

    公开(公告)日:2012-09-04

    申请号:US13112315

    申请日:2011-05-20

    IPC分类号: H01L21/00 H01L29/12

    摘要: A growth method is proposed for high quality zinc oxide comprising the following steps: (1) growing a gallium nitride layer on a sapphire substrate around a temperature of 1000° C.; (2) patterning a SiO2 mask into stripes oriented in the gallium nitride or direction; (3) growing epitaxial lateral overgrowth of (ELO) gallium nitride layers by controlling the facet planes via choosing the growth temperature and the reactor; (4) depositing zinc oxide films on facets ELO gallium nitride templates by chemical vapor deposition (CVD). Zinc oxide crystal of high quality with a reduced number of crystal defects can be grown on a gallium nitride template. This method can be used to fabricate zinc oxide films with low dislocation density lower than 104/cm−2, which will find important applications in future electronic and optoelectronic devices.

    摘要翻译: 提出了一种高质量氧化锌的生长方法,包括以下步骤:(1)在1000℃的温度下在蓝宝石衬底上生长氮化镓层; (2)将SiO 2掩模图案化成在氮化镓<100>或<1120>方向上取向的条纹; (3)通过选择生长温度和反应器控制小平面,生长(ELO)氮化镓层的外延横向过度生长; (4)通过化学气相沉积(CVD)在小面ELO氮化镓模板上沉积氧化锌膜。 可以在氮化镓模板上生长具有减少的晶体缺陷数量的高质量的氧化锌晶体。 该方法可用于制备位错密度低于104 / cm-2的氧化锌薄膜,这将在未来的电子和光电子器件中找到重要应用。

    Method of zinc oxide film grown on the epitaxial lateral overgrowth gallium nitride template
    6.
    发明授权
    Method of zinc oxide film grown on the epitaxial lateral overgrowth gallium nitride template 有权
    在外延横向过度生长的氮化镓模板上生长的氧化锌膜的方法

    公开(公告)号:US07951639B2

    公开(公告)日:2011-05-31

    申请号:US12288977

    申请日:2008-10-24

    IPC分类号: H01L21/00 H01L29/12

    摘要: A growth method is proposed for high quality zinc oxide comprising the following steps: (1) growing a gallium nitride layer on a sapphire substrate around a temperature of 1000° C.; (2) patterning a SiO2 mask into stripes oriented in the gallium nitride or direction; (3) growing epitaxial lateral overgrowth of (ELO) gallium nitride layers by controlling the facet planes via choosing the growth temperature and the reactor; (4) depositing zinc oxide films on facets ELO gallium nitride templates by chemical vapor deposition (CVD). Zinc oxide crystal of high quality with a reduced number of crystal defects can be grown on a gallium nitride template. This method can be used to fabricate zinc oxide films with low dislocation density lower than 104/cm−2, which will find important applications in future electronic and optoelectronic devices.

    摘要翻译: 提出了一种高质量氧化锌的生长方法,包括以下步骤:(1)在1000℃的温度下在蓝宝石衬底上生长氮化镓层; (2)将SiO 2掩模图案化成在氮化镓<100>或<1120>方向上取向的条纹; (3)通过选择生长温度和反应器控制小平面,生长(ELO)氮化镓层的外延横向过度生长; (4)通过化学气相沉积(CVD)在小面ELO氮化镓模板上沉积氧化锌膜。 可以在氮化镓模板上生长具有减少的晶体缺陷数量的高质量的氧化锌晶体。 该方法可用于制备位错密度低于104 / cm-2的氧化锌薄膜,这将在未来的电子和光电子器件中找到重要应用。

    METHOD OF ZINC OXIDE FILM GROWN ON THE EPITAXIAL LATERAL OVERGROWTH GALLIUM NITRIDE TEMPLATE
    8.
    发明申请
    METHOD OF ZINC OXIDE FILM GROWN ON THE EPITAXIAL LATERAL OVERGROWTH GALLIUM NITRIDE TEMPLATE 有权
    在外源性侧向氮化镓模板上形成的氧化锌膜的方法

    公开(公告)号:US20120018699A1

    公开(公告)日:2012-01-26

    申请号:US13112315

    申请日:2011-05-20

    摘要: A growth method is proposed for high quality zinc oxide comprising the following steps: (1) growing a gallium nitride layer on a sapphire substrate around a temperature of 1000° C.; (2) patterning a SiO2 mask into stripes oriented in the gallium nitride or direction; (3) growing epitaxial lateral overgrowth of (ELO) gallium nitride layers by controlling the facet planes via choosing the growth temperature and the reactor; (4) depositing zinc oxide films on facets ELO gallium nitride templates by chemical vapor deposition (CVD). Zinc oxide crystal of high quality with a reduced number of crystal defects can be grown on a gallium nitride template. This method can be used to fabricate zinc oxide films with low dislocation density lower than 104/cm−2, which will find important applications in future electronic and optoelectronic devices.

    摘要翻译: 提出了一种高质量氧化锌的生长方法,包括以下步骤:(1)在1000℃的温度下在蓝宝石衬底上生长氮化镓层; (2)将SiO 2掩模图案化成在氮化镓<100>或<1120>方向上取向的条纹; (3)通过选择生长温度和反应器控制小平面,生长(ELO)氮化镓层的外延横向过度生长; (4)通过化学气相沉积(CVD)在小面ELO氮化镓模板上沉积氧化锌膜。 可以在氮化镓模板上生长具有减少的晶体缺陷数量的高质量的氧化锌晶体。 该方法可用于制备位错密度低于104 / cm-2的氧化锌薄膜,这将在未来的电子和光电子器件中找到重要应用。

    Method of zinc oxide film grown on the epitaxial lateral overgrowth gallium nitride template
    9.
    发明申请
    Method of zinc oxide film grown on the epitaxial lateral overgrowth gallium nitride template 有权
    在外延横向过度生长的氮化镓模板上生长的氧化锌膜的方法

    公开(公告)号:US20100102307A1

    公开(公告)日:2010-04-29

    申请号:US12288977

    申请日:2008-10-24

    IPC分类号: H01L29/10 H01L21/00

    摘要: A growth method is proposed for high quality zinc oxide comprising the following steps: (1) growing a gallium nitride layer on a sapphire substrate around a temperature of 1000° C.; (2) patterning a SiO2 mask into stripes oriented in the gallium nitride or direction; (3) growing epitaxial lateral overgrowth of (ELO) gallium nitride layers by controlling the facet planes via choosing the growth temperature and the reactor; (4) depositing zinc oxide films on facets ELO gallium nitride templates by chemical vapor deposition (CVD). Zinc oxide crystal of high quality with a reduced number of crystal defects can be grown on a gallium nitride template. This method can be used to fabricate zinc oxide films with low dislocation density lower than 104/cm−2, which will find important applications in future electronic and optoelectronic devices.

    摘要翻译: 提出了一种高质量氧化锌的生长方法,包括以下步骤:(1)在1000℃的温度下在蓝宝石衬底上生长氮化镓层; (2)将SiO 2掩模图案化成在氮化镓<100>或<1120>方向上取向的条纹; (3)通过选择生长温度和反应器控制小平面,生长(ELO)氮化镓层的外延横向过度生长; (4)通过化学气相沉积(CVD)在小面ELO氮化镓模板上沉积氧化锌膜。 可以在氮化镓模板上生长具有减少的晶体缺陷数量的高质量的氧化锌晶体。 该方法可用于制备位错密度低于104 / cm-2的氧化锌薄膜,这将在未来的电子和光电子器件中找到重要应用。

    Semiconductor-laser pumped Ti:sapphire laser
    10.
    发明申请
    Semiconductor-laser pumped Ti:sapphire laser 审中-公开
    半导体激光器泵浦Ti:蓝宝石激光器

    公开(公告)号:US20090003402A1

    公开(公告)日:2009-01-01

    申请号:US11824438

    申请日:2007-06-29

    IPC分类号: H01S3/0941 H01S3/091

    摘要: A laser includes a Ti:sapphire gain-element that is optically pumped by radiation from a semiconductor laser device. In one example the semiconductor laser device is an InGaN diode-laser array and the gain-element is optically pumped by radiation emitted by that array. In another example, the semiconductor laser device is an optically pumped semiconductor laser (OPS-laser) optically pumped by radiation from an InGaN diode-laser array. In a further example the semiconductor device is an intracavity frequency-doubled OPS laser.

    摘要翻译: 激光器包括通过来自半导体激光器件的辐射光泵浦的Ti:蓝宝石增益元件。 在一个示例中,半导体激光器件是InGaN二极管激光器阵列,并且增益元件被该阵列发射的辐射光泵浦。 在另一示例中,半导体激光器件是通过来自InGaN二极管激光器阵列的辐射而被光泵浦的光泵浦半导体激光器(OPS激光器)。 在另一示例中,半导体器件是腔内倍频OPS激光器。