公开(公告)号：US20080145567A1

公开(公告)日：2008-06-19

申请号：US11950859

申请日：2007-12-05

申请人： Goichi OHMAE ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

发明人： Goichi OHMAE ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

IPC分类号： B05D3/06

CPC分类号： H05K3/465 ,  B23K26/364 ,  B23K26/389 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/107 ,  H05K2203/0557 ,  H05K2203/108

摘要： A printed circuit board manufacturing method by which the manufacturing time can be shortened and the manufacturing cost can be reduced. A printed circuit board has an insulating layer on its surface. Positions (first positions) of the printed circuit board where lands are disposed are irradiated with a CO2 laser beam (first laser beam) so as to form holes with a depth h from the surface. The printed circuit board is then scanned with an excimer laser beam (second laser beam) through a mask. The beam shape of the excimer laser beam is rectangular. Thus, holes reaching the lands are formed in the positions where the lands are disposed, and grooves for forming lines are formed (second positions). In this case, the holes reaching the lands may be formed by the CO2 laser beam.

摘要翻译： 可以缩短制造时间并且可以降低制造成本的印刷电路板制造方法。 印刷电路板在其表面上具有绝缘层。 用CO 2激光束（第一激光束）照射布置有焊盘的印刷电路板的位置（第一位置），以形成距表面深度为h的孔。 然后用准分子激光束（第二激光束）通过掩模扫描印刷电路板。 准分子激光束的光束形状是矩形的。 因此，在设置焊盘的位置形成到达焊盘的孔，形成用于形成线的槽（第二位置）。 在这种情况下，到达焊盘的孔可以由CO 2激光束形成。

公开(公告)号：US20080283491A1

公开(公告)日：2008-11-20

申请号：US11987980

申请日：2007-12-06

申请人： Kunio Arai ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

发明人： Kunio Arai ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

IPC分类号： H01B13/00

CPC分类号： H05K3/465 ,  B23K26/0604 ,  B23K26/0661 ,  B23K26/0738 ,  B23K26/082 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/35 ,  B23K2101/42 ,  B23K2103/16 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/045 ,  H05K3/107 ,  H05K3/16 ,  H05K3/4661 ,  H05K2201/0166 ,  H05K2201/09563 ,  H05K2203/0557 ,  H05K2203/108 ,  Y10T29/49155

摘要： There is provided a printed circuit board whose peel strength is large and a printed circuit board fabrication method and a printed circuit board machining apparatus that allow a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board comprises steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer.

摘要翻译： 提供了剥离强度大的印刷电路板和允许制造时间和制造成本降低的印刷电路板制造方法和印刷电路板加工装置。 印刷电路板的制造方法包括以下步骤：在其表面由绝缘体制成的印刷电路板的表面上形成抗蚀剂层，形成从抗蚀剂层的表面连接到孔的导体图案 内层和孔以及通过照射激光而不与内层的导体层连接的深度的凹槽，将导电材料填充到孔和凹槽中以形成导体图案并且去除抗蚀剂层以投射 导体图案的部分从绝缘层的表面出来。

公开(公告)号：US4872787A

公开(公告)日：1989-10-10

申请号：US106439

申请日：1987-10-09

申请人： Kunio Arai ,  Hiromi Nishiyama ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

发明人： Kunio Arai ,  Hiromi Nishiyama ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

IPC分类号： B23B47/18 ,  B23B35/00 ,  B23B41/00 ,  B23B47/22 ,  B26F1/16 ,  H05K3/00

CPC分类号： B23B35/005 ,  H05K3/0047 ,  G05B2219/45129 ,  G05B2219/49047 ,  H05K2203/1536 ,  Y10T408/03 ,  Y10T408/23 ,  Y10T408/5623

摘要： In a method of drilling a printed circuit board according to the present invention, an entry feed rate at which a drill is fed into the printed circuit boards during the initial stage of drilling is made slightly smaller than a drilling feed rate at which the drill is fed while it is drilling a hole through the printed circuit boards, so as to enhance the accuracy at which holes are located. One drilling operation includes a plurality of drilling feeds of the drill, and pulled-out positions of the drill which are reached by the drill between adjacent drilling feed rate are set within a range in which the pressure of a pressure foot is effective. This can prevent the stacked printed circuit boards from shifting and increase the accuracy at which the holes are located.

摘要翻译： 在根据本发明的钻孔印刷电路板的方法中，钻头在初始阶段期间将钻头送入印刷电路板的入料速率略小于钻头的钻孔进给速率 在通过印刷电路板钻孔时进给，以提高孔所在的精度。 一次钻孔操作包括钻头的多个钻孔进给，并且由钻头在相邻的钻井进给速率之间达到的钻头的拉出位置设定在压脚的压力有效的范围内。 这可以防止堆叠的印刷电路板移动并增加孔所在的精度。

公开(公告)号：US08075788B2

公开(公告)日：2011-12-13

申请号：US11987980

申请日：2007-12-06

申请人： Kunio Arai ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

发明人： Kunio Arai ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

IPC分类号： H05K3/06

CPC分类号： H05K3/465 ,  B23K26/0604 ,  B23K26/0661 ,  B23K26/0738 ,  B23K26/082 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/35 ,  B23K2101/42 ,  B23K2103/16 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/045 ,  H05K3/107 ,  H05K3/16 ,  H05K3/4661 ,  H05K2201/0166 ,  H05K2201/09563 ,  H05K2203/0557 ,  H05K2203/108 ,  Y10T29/49155

摘要： A printed circuit board fabrication method allows a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board includes steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer.

摘要翻译： 印刷电路板制造方法可以减少制造时间和制造成本。 印刷电路板的制造方法包括以下步骤：在表面由绝缘体制成的印刷电路板的表面上形成抗蚀剂层，形成从抗蚀剂层的表面连接到孔的导体图案 内层和孔以及通过照射激光而不与内层的导体层连接的深度的凹槽，将导电材料填充到孔和凹槽中以形成导体图案并且去除抗蚀剂层以投射 导体图案的部分从绝缘层的表面出来。

公开(公告)号：US5066171A

公开(公告)日：1991-11-19

申请号：US324769

申请日：1989-03-17

申请人： Kunio Arai ,  Hiromi Nishiyama ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

发明人： Kunio Arai ,  Hiromi Nishiyama ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

IPC分类号： B23B47/18 ,  B23B35/00 ,  B23B41/00 ,  B23B47/22 ,  B26F1/16 ,  H05K3/00

CPC分类号： B23B35/005 ,  H05K3/0047 ,  G05B2219/45129 ,  G05B2219/49047 ,  H05K2203/1536 ,  Y10T408/03 ,  Y10T408/23 ,  Y10T408/5623

摘要： In a method of and an apparatus for drilling a hole in a workpiece, a pressure foot associated with a drill is moved into contact with the workpiece, and a drill bit associated with the drill is moved from a drill-starting position into the workpiece, toward the drill-starting position and again into the workpiece while maintaining the pressure foot in constant contact with the workpiece. The drill is reciprocally fed by a plurality of times under the pressure of the pressure foot acting upon the printed circuit board. In either of the method and the apparatus, a hole with a high aspect ratio can be formed in a workpiece made from a thin, flexible material.

公开(公告)号：US4997319A

公开(公告)日：1991-03-05

申请号：US394659

申请日：1989-08-16

申请人： Kunio Arai ,  Hiromi Nishiyama ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

发明人： Kunio Arai ,  Hiromi Nishiyama ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

IPC分类号： B23B47/18 ,  B23B35/00 ,  B23B41/00 ,  B23B47/22 ,  B26F1/16 ,  H05K3/00

CPC分类号： B23B35/005 ,  H05K3/0047 ,  G05B2219/45129 ,  G05B2219/49047 ,  H05K2203/1536 ,  Y10T408/03 ,  Y10T408/23 ,  Y10T408/5623

摘要： An apparatus for drilling a hole in a workpiece such as, for example, a printed circuit board wherein a pressure foot, associated with a drill, is moved into a position to exert a pressure on the workpiece. A drill bit associated with the drill is moved with respect to the workpiece, and an arrangement is provided for controlling the operations of the pressure foot and the drill bit in such a manner so as to move the drill bit from a drill starting position into the workpiece, then toward the drill starting position and again into the workpiece while maintaining the pressure exerted on the workpiece by the pressure foot.

公开(公告)号：US4658494A

公开(公告)日：1987-04-21

申请号：US867553

申请日：1986-05-28

申请人： Tamio Ohtani ,  Yasuhiko Kanaya ,  Hiroshi Aoyama ,  Nobuyasu Nonaka

发明人： Tamio Ohtani ,  Yasuhiko Kanaya ,  Hiroshi Aoyama ,  Nobuyasu Nonaka

IPC分类号： B23Q3/155 ,  B23Q3/157 ,  B23Q17/00 ,  B23Q17/22 ,  G05B19/18 ,  G05B19/404 ,  H05K3/00

CPC分类号： B23Q3/15706 ,  B23Q17/006 ,  B23Q17/2233 ,  B23Q3/15526 ,  B23Q3/15713 ,  G05B19/182 ,  G05B19/404 ,  G05B2219/45035 ,  G05B2219/50185 ,  G05B2219/50253 ,  G05B2219/50291 ,  H05K3/0044 ,  H05K3/0047 ,  Y10T408/08 ,  Y10T408/14 ,  Y10T408/16 ,  Y10T408/21 ,  Y10T483/136 ,  Y10T483/1783 ,  Y10T483/1818

摘要： An apparatus for forming openings in printed circuit boards includes a work table for supporting the printed circuit boards, and at least one drilling unit movable relative to the work table. The apparatus uses drills each having a shank, a collar fitted around the shank at a predetermined position. For holding these drills, at least one first tool holding device is provided on the work table, and at least one second tool holding device of a magazine type for containing the drills parallel to each other is removably mounted above the work table. At least one transferring device is provided to operate to push a desired drill out of the second tool holding device of the magazine type, hold the pushed-out drill and transfer the same to a position where it is aligned with the drilling unit.

摘要翻译： 一种用于在印刷电路板中形成开口的装置包括用于支撑印刷电路板的工作台以及可相对于工作台移动的至少一个钻孔单元。 该装置使用每个具有柄的钻孔，在预定位置处装配在柄上的套环。 为了保持这些钻头，在工作台上设置至少一个第一工具保持装置，并且用于容纳彼此平行的钻头的储料盒类型的至少一个第二工具保持装置可拆卸地安装在工作台的上方。 提供至少一个传送装置用于操作以将期望的钻子推出钉仓类型的第二工具保持装置，保持推出钻头并将其传送到与钻孔单元对准的位置。

公开(公告)号：US5011345A

公开(公告)日：1991-04-30

申请号：US446588

申请日：1989-12-06

申请人： Masao Nishigai ,  Tamio Otani ,  Yasuhiko Kanaya ,  Tetsuo Murakami

发明人： Masao Nishigai ,  Tamio Otani ,  Yasuhiko Kanaya ,  Tetsuo Murakami

IPC分类号： B23Q15/12 ,  B23B47/24 ,  B23C3/00 ,  B23Q15/00 ,  B23Q17/09 ,  B23Q35/12 ,  G05B19/18 ,  G05B19/404 ,  H05K3/00

CPC分类号： B23Q35/12 ,  G05B2219/37285 ,  G05B2219/45035 ,  H05K3/0044 ,  Y10T409/30112 ,  Y10T409/303808 ,  Y10T409/30392

摘要： A method of machining the contour of a printed circuit board by effecting a relative feed movement between a rotating tool and the other periphery of the printed circuit board. The electrical current value of a drive motor for driving a spindle to which the tool is attached is detected and an operation is conducted for changing the machining condition in such a manner as to reduce the electrical current value of the spindle drive motor and, at the same time, for changing also tool diameter compensation amount to a value corresponding to the machining condition after the change, at every time the detected electrical current value has reached a predetermined current value immediately before tool breakage and repeatedly by a predetermined number of times.

摘要翻译： 通过在旋转工具和印刷电路板的另一个周边之间进行相对进给运动来加工印刷电路板的轮廓的方法。 检测用于驱动安装有工具的主轴的驱动电动机的电流值，并且进行用于改变加工条件的操作，以减小主轴驱动电动机的电流值，并且在 同时，在每次检测到的电流值已经达到工具断开之前的预定电流值并重复预定次数时，也将刀具直径补偿量也改变为与改变之后的加工条件相对应的值。

公开(公告)号：US07488676B2

公开(公告)日：2009-02-10

申请号：US11297358

申请日：2005-12-09

申请人： Yasuhiko Kanaya ,  Akira Irie ,  Katsuhiro Nagasawa ,  Toru Yuki

发明人： Yasuhiko Kanaya ,  Akira Irie ,  Katsuhiro Nagasawa ,  Toru Yuki

IPC分类号： H01L21/4763

CPC分类号： H05K3/429 ,  H05K1/0268 ,  H05K3/0047 ,  H05K2201/092 ,  H05K2201/09718 ,  H05K2201/09845 ,  H05K2203/0207 ,  H05K2203/0242 ,  H05K2203/163 ,  H05K2203/175 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A manufacturing method of a multi-layered circuit board allows electronic parts to be mounted adequately and will not hamper performance of the electronic parts. A power terminal (pin) of an electronic part to be mounted on a surface of the multi-layered circuit board is inserted into a plated through hole to connect with a first conductive layer. A detecting section having a detecting hole which is formed coaxially with the through hole and whose diameter is larger than the through hole is provided on a second conductive layer on the back of the first conductive layer. A hole having a large diameter is formed by a tool along the through hole from the back while applying voltage between the second conductive layer and the tool. The depth of the hole is set based on the tool electrically conducting with the detecting hole. Unnecessary plate of the through hole may be removed by the large hole.

摘要翻译： 多层电路板的制造方法允许电子部件被充分地安装，并且不会妨碍电子部件的性能。 要安装在多层电路板的表面上的电子部件的电源端子（销）插入到电镀通孔中以与第一导电层连接。 在第一导电层的背面的第二导电层上设置有具有与通孔同轴并且其直径大于通孔的检测孔的检测部。 在第二导电层和工具之间施加电压时，具有大直径的孔由工具沿着通孔从背面形成。 基于与检测孔导电的工具设定孔的深度。 通孔的不必要的板可以被大孔除去。

公开(公告)号：US5109584A

公开(公告)日：1992-05-05

申请号：US553460

申请日：1990-07-17

申请人： Akira Irie ,  Yasuhiko Kanaya ,  Tamio Ohtani

发明人： Akira Irie ,  Yasuhiko Kanaya ,  Tamio Ohtani

IPC分类号： H05K3/00 ,  H05K13/00

CPC分类号： H05K3/0044 ,  H05K13/0061 ,  Y10T29/5196 ,  Y10T408/47 ,  Y10T408/52

摘要： An apparatus and method for supplying a printed circuit board to a printed circuit board drilling machine and for returning the printed circuit board after the drilling. A stocker stores a plurality of printed circuit boards in a tilted state, and a plurality of conveyor rollers provides a conveying path for the printed circuit boards. A conveyor device which includes conveyor rollers provides a conveying path connected to the first mentioned conveying path. The arrival of the printed circuit board is detected at a predetermined position, and the printed circuit board is then decelerated by braking in response to a signal from the detection. A device is provided on the printed circuit board drilling machine for delivering the printed circuit board to the printed circuit board drilling machine. A base plate can be provided with a pair of locating pins for being anchored to the drilling machine table and has the printed circuit board mounted thereon so that the drilling machine can handle one pattern and number of location pins regardless of the number and pattern of fixing pins on the printed circuit board.

摘要翻译： 一种用于将印刷电路板供应到印刷电路板钻孔机并在钻孔之后使印刷电路板返回的装置和方法。 储存器以倾斜状态存储多个印刷电路板，并且多个输送辊提供用于印刷电路板的输送路径。 包括输送辊的输送装置提供连接到第一个输送路径的输送路径。 在预定位置检测印刷电路板的到来，然后响应于来自检测的信号通过制动来减速印刷电路板。 在印刷电路板钻孔机上设置有用于将印刷电路板输送到印刷电路板钻孔机的装置。 基板可以设置有一对定位销，用于锚定到钻床台上，并且其上安装有印刷电路板，使得钻孔机可以处理一个图案和数量的定位销，而不管固定的数量和图案如何 印刷电路板上的引脚。