公开(公告)号：US20120229997A1

公开(公告)日：2012-09-13

申请号：US13050954

申请日：2011-03-18

申请人： HSIAO-YUN SU ,  YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE

发明人： HSIAO-YUN SU ,  YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE

IPC分类号： H05K7/00

CPC分类号： H05K1/0245 ,  H05K1/0251 ,  H05K2201/09718

摘要： A printed circuit board includes first and second transmission lines connected to a first high speed differential signal control chip, third and fourth transmission lines connected to a second high speed differential signal control chip, and fifth and sixth transmission lines connected to a connector pad. To have the first high speed differential signal control chip communicate with the connector pad, the first transmission line is connected to the fifth transmission line through a first connection component, and the second transmission line is connected to the sixth transmission line through a second connection component. To have the second speed differential signal control chip communicate with the connector pad, the third transmission line is connected to the fifth transmission line through the first connection component, and the fourth transmission line is connected to the sixth transmission line through the second connection component.

摘要翻译： 印刷电路板包括连接到第一高速差分信号控制芯片的第一和第二传输线，连接到第二高速差分信号控制芯片的第三和第四传输线以及连接到连接器焊盘的第五和第六传输线。 为了使第一高速差分信号控制芯片与连接器焊盘通信，第一传输线通过第一连接部件连接到第五传输线，并且第二传输线通过第二连接部件连接到第六传输线 。 为了使第二速度差分信号控制芯片与连接器焊盘通信，第三传输线通过第一连接部件连接到第五传输线，并且第四传输线通过第二连接部件连接到第六传输线。

公开(公告)号：US20110043302A1

公开(公告)日：2011-02-24

申请号：US12646867

申请日：2009-12-23

申请人： SHEN-CHUN LI ,  SHOU-KUO HSU ,  YUNG-CHIEH CHEN ,  HSIAO-YUN SU ,  HSIEN-CHUAN LIANG

发明人： SHEN-CHUN LI ,  SHOU-KUO HSU ,  YUNG-CHIEH CHEN ,  HSIAO-YUN SU ,  HSIEN-CHUAN LIANG

IPC分类号： H03H7/01

CPC分类号： H03H7/0115 ,  H03H7/0153

摘要： Parameters of a radio frequency filter can be changed by changing structure of each component of the filter. Material of each component, diameters of each of magnetic cylinders, density of each of conductive coils, thickness of a dielectric layer, and thickness of an insulation tube can be changed. When any component needs to be replaced, each cover is rotated, with connection partitions moving to two slots of an insulation portion, to detach the filter.

摘要翻译： 可以通过改变滤波器的每个分量的结构来改变射频滤波器的参数。 可以改变每个部件的材料，每个磁性圆筒的直径，每个导电线圈的密度，电介质层的厚度和绝缘管的厚度。 当需要更换任何部件时，每个盖板旋转，连接分隔件移动到绝缘部分的两个槽口，以分离过滤器。

公开(公告)号：US20120125679A1

公开(公告)日：2012-05-24

申请号：US13032653

申请日：2011-02-23

申请人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  PO-CHUAN HSIEH ,  SHOU-KUO HSU ,  SHIN-TING YEN

发明人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  PO-CHUAN HSIEH ,  SHOU-KUO HSU ,  SHIN-TING YEN

IPC分类号： H05K1/11

CPC分类号： H05K1/0251 ,  H05K1/0245 ,  H05K1/116

摘要： A printed circuit board includes an insulating board, a pair of differential vias, and a number of wiring layers. A pair of via holes extends through opposite surfaces of the insulating board. The differential vias correspond to the pair of via holes. Each differential via includes a metal plated barrel and two via capture pads. The plated barrel is plated on the inner surface of the respective via hole, and terminates at each of the two opposite surfaces of the insulating board. The via capture pads are formed on the opposite surfaces of the insulating board around the openings of the via hole, and are electrically connected to the plated barrel. The wiring layers are arranged in the insulating board, and each define a clearance hole surrounding all of the via capture pads.

摘要翻译： 印刷电路板包括绝缘板，一对差动通孔和多个布线层。 一对通孔延伸穿过绝缘板的相对表面。 差分过孔对应于一对通孔。 每个差分通孔包括一个金属电镀桶和两个通孔捕获垫。 电镀桶被镀在相应通孔的内表面上，并且终止于绝缘板的两个相对表面的每一个。 通孔捕获垫形成在绝缘板的围绕通孔的开口的相对表面上，并且电连接到电镀桶。 布线层布置在绝缘板中，并且每个限定围绕所有通孔捕获垫的间隙孔。

公开(公告)号：US20120145448A1

公开(公告)日：2012-06-14

申请号：US13031617

申请日：2011-02-22

申请人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  PO-CHUAN HSIEH ,  SHOU-KUO HSU ,  SHIN-TING YEN ,  DAN-CHEN WU ,  JIA-CHI CHEN

发明人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  PO-CHUAN HSIEH ,  SHOU-KUO HSU ,  SHIN-TING YEN ,  DAN-CHEN WU ,  JIA-CHI CHEN

IPC分类号： H05K1/11

CPC分类号： H05K1/0251 ,  H05K1/0225 ,  H05K1/0295 ,  H05K1/0298 ,  H05K1/113

摘要： A printed circuit board (PCB) with compound via includes a substrate and a pair of through holes passing through the substrate. The substrate includes a signal layer which is the top layer of the substrate, a first reference layer adjacent to the signal layer, and a second reference layer not adjacent to the signal layer. A first and a second pair of pads are mounted on the signal layer. Each of the through holes extends through the first pair of pads such that the through hole and the first pair of pads jointly form a compound via. A first reserved opening is formed on the first reference layer and corresponds to the first and the second pair of pads and the compound via. A second reserved opening is formed on the second reference layer and surrounds the through hole thereon.

摘要翻译： 具有复合通孔的印刷电路板（PCB）包括基板和穿过基板的一对通孔。 衬底包括作为衬底的顶层的信号层，与信号层相邻的第一参考层和不与信号层相邻的第二参考层。 第一和第二对焊盘安装在信号层上。 每个通孔延伸穿过第一对垫，使得通孔和第一对垫共同形成复合通孔。 第一保留开口形成在第一参考层上，并且对应于第一和第二对焊盘和复合通孔。 第二保留开口形成在第二参考层上并围绕其上的通孔。

公开(公告)号：US20110168437A1

公开(公告)日：2011-07-14

申请号：US12693418

申请日：2010-01-25

申请人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  SHOU-KUO HSU

发明人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  SHOU-KUO HSU

IPC分类号： H05K1/16 ,  H05K1/11

CPC分类号： H05K1/0245 ,  H05K1/0231 ,  H05K2201/09236

摘要： A printed circuit board (PCB) includes a positive differential signal line including first and second segments, a negative differential signal line including third and fourth segments, first and second connecting elements soldered on opposite surfaces of the PCB. The first segment and the fourth segment are located in a first straight line which has a first permittivity. The third segment and the second segment are located in a second straight line which has a second permittivity different from the first permittivity. The first connecting element is connected between the first segment and the second segment. The second connecting element is connected between the third segment and the fourth segment.

摘要翻译： 印刷电路板（PCB）包括包括第一和第二段的正差分信号线，包括第三和第四段的负差分信号线，焊接在PCB的相对表面上的第一和第二连接元件。 第一段和第四段位于具有第一介电常数的第一直线中。 第三段和第二段位于具有与第一介电常数不同的第二介电常数的第二直线上。 第一连接元件连接在第一段和第二段之间。 第二连接元件连接在第三段和第四段之间。

公开(公告)号：US20110271025A1

公开(公告)日：2011-11-03

申请号：US12824850

申请日：2010-06-28

申请人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  SHOU-KUO HSU ,  SHEN-CHUN LI ,  HSIEN-CHUAN LIANG ,  SHIN-TING YEN

发明人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  SHOU-KUO HSU ,  SHEN-CHUN LI ,  HSIEN-CHUAN LIANG ,  SHIN-TING YEN

IPC分类号： G06F13/00

CPC分类号： H05K1/113 ,  G06F1/185 ,  H05K1/0251 ,  H05K2201/09409 ,  H05K2201/09727 ,  H05K2201/10159

摘要： A computer motherboard includes a printed circuit board which includes a central processing unit (CPU) socket and a group of memory slots. The group of memory slots includes an in-line type memory slot and a surface mounted device (SMD) type memory slot. The in-line type memory slot includes a number of plated through holes. The SMD type memory slot is set between the in-line type memory slot and the CPU socket. The through holes of the in-line type memory slot are connected to the CPU socket through traces, pads of the SMD type memory slot are connected to corresponding through holes of the in-line type memory slot having the same pin definition.

摘要翻译： 计算机主板包括印刷电路板，其包括中央处理单元（CPU）插座和一组存储器插槽。 该组存储器插槽包括一个在线型存储器插槽和一个表面安装器件（SMD）型存储器插槽。 在线型存储槽包括多个电镀通孔。 SMD型内存插槽设置在串行型内存插槽和CPU插槽之间。 在线式存储插槽的通孔通过走线连接到CPU插座，SMD型存储插槽的焊盘连接到具有相同引脚定义的在线型存储器插槽的相应通孔。

公开(公告)号：US20120147579A1

公开(公告)日：2012-06-14

申请号：US12978527

申请日：2010-12-24

申请人： CHENG-HSIEN LEE ,  YUNG-CHIEH CHEN ,  SHOU-KUO HSU ,  SHIN-TING YEN

发明人： CHENG-HSIEN LEE ,  YUNG-CHIEH CHEN ,  SHOU-KUO HSU ,  SHIN-TING YEN

IPC分类号： H05K7/00

CPC分类号： H05K1/0295 ,  H05K1/0239 ,  H05K1/0245 ,  H05K1/113 ,  H05K2201/10015

摘要： A printed circuit board includes a high-speed differential signal control chip, first to eighth coupling capacitor pads, first to fourth connector pads, a first transmission line, a second transmission line, a third transmission line, a fourth transmission line, first to eighth transmission lines, two ninth transmission lines, first and second vias, and first to fourth sharing pads. The printed circuit board is operable to selectively support multiple connectors.

摘要翻译： 印刷电路板包括高速差分信号控制芯片，第一至第八耦合电容器焊盘，第一至第四连接器焊盘，第一传输线，第二传输线，第三传输线，第四传输线，第一至第八 传输线，两个第九传输线，第一和第二通孔以及第一至第四共享焊盘。 印刷电路板可操作以选择性地支撑多个连接器。

公开(公告)号：US20110114379A1

公开(公告)日：2011-05-19

申请号：US12633653

申请日：2009-12-08

申请人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  SHOU-KUO HSU ,  SHEN-CHUN LI ,  HSIEN-CHUAN LIANG ,  SHIN-TING YEN

发明人： YUNG-CHIEH CHEN ,  CHENG-HSIEN LEE ,  SHOU-KUO HSU ,  SHEN-CHUN LI ,  HSIEN-CHUAN LIANG ,  SHIN-TING YEN

IPC分类号： H01R12/00

CPC分类号： H05K1/0295 ,  H05K1/0239 ,  H05K1/0245 ,  H05K1/029 ,  H05K3/222 ,  H05K2201/09481 ,  H05K2201/09636 ,  H05K2201/10015 ,  H05K2201/10189 ,  H05K2201/10636 ,  Y02P70/611

摘要： A printed circuit board can support different connectors by selectively setting connection components on the printed circuit board without changing wiring of transmission lines or making new vias in the printed circuit board.

摘要翻译： 印刷电路板可以通过选择性地设置印刷电路板上的连接部件来支持不同的连接器，而不改变传输线的接线或在印刷电路板中形成新的通孔。

公开(公告)号：US20120140426A1

公开(公告)日：2012-06-07

申请号：US12978599

申请日：2010-12-26

申请人： DUEN-YI HO ,  YUNG-CHIEH CHEN

发明人： DUEN-YI HO ,  YUNG-CHIEH CHEN

IPC分类号： H05K7/06

CPC分类号： H05K1/0243 ,  G06K19/077 ,  G11C5/025 ,  G11C5/04 ,  G11C5/063 ,  H05K1/181 ,  H05K2201/09227 ,  H05K2201/10159

摘要： A printed circuit board includes a top layer. A memory controller, a first dual-channel architecture, and a second dual-channel architecture are located on the top layer. A distance between the memory modules of the first dual-channel architecture and the memory controller is equal to a distance between the memory modules of the second dual-channel architecture and the memory controller.

摘要翻译： 印刷电路板包括顶层。 存储器控制器，第一双通道架构和第二双通道架构位于顶层上。 第一双通道架构的存储器模块与存储器控制器之间的距离等于第二双通道架构的存储器模块与存储器控制器之间的距离。

公开(公告)号：US20120138344A1

公开(公告)日：2012-06-07

申请号：US12965832

申请日：2010-12-11

申请人： YING-TSO LAI ,  YUNG-CHIEH CHEN ,  JIA-CHI CHEN

发明人： YING-TSO LAI ,  YUNG-CHIEH CHEN ,  JIA-CHI CHEN

IPC分类号： H05K1/03

CPC分类号： H05K1/0245 ,  H05K1/0366 ,  H05K2201/029

摘要： A printed circuit board is constructed from various woven fiberglass fabrics, strengthened and bound together with epoxy resin, and includes a signal layer. The signal layer includes a positive differential signal line and a negative differential signal line laid out in parallel following a zig-zag pattern. A first distance and a second distance is designed at a ratio of 1:7. The first distance is a perpendicular distance between a highest point of the negative differential signal line and a reference line formed by connecting all lowest points of the negative differential signal line. The second distance is a perpendicular distance between a lowest point and an adjacent highest point of the negative differential signal line along the direction of the reference line.

摘要翻译： 印刷电路板由各种编织玻璃纤维织物构成，与环氧树脂一起加强并结合在一起，并包括信号层。 该信号层包括一个正的差分信号线和一个负的差分信号线并行地排列成Z字形图案。 以1：7的比例设计第一距离和第二距离。 第一距离是负差分信号线的最高点与通过连接负差分信号线的所有最低点形成的参考线之间的垂直距离。 第二距离是沿着参考线的方向的负差分信号线的最低点和相邻最高点之间的垂直距离。