公开(公告)号：US20120299197A1

公开(公告)日：2012-11-29

申请号：US13478613

申请日：2012-05-23

申请人： Heungkyu KWON ,  Kang Joon Lee ,  Jae Wook Yoo ,  Su-Chang Lee

发明人： Heungkyu KWON ,  Kang Joon Lee ,  Jae Wook Yoo ,  Su-Chang Lee

IPC分类号： H01L23/48

CPC分类号： H01L23/49811 ,  H01L23/13 ,  H01L23/16 ,  H01L23/18 ,  H01L23/3157 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/13541 ,  H01L2224/13561 ,  H01L2224/13583 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/13616 ,  H01L2224/13624 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13649 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1366 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/13669 ,  H01L2224/1367 ,  H01L2224/13671 ,  H01L2224/13672 ,  H01L2224/13679 ,  H01L2224/1368 ,  H01L2224/13681 ,  H01L2224/13684 ,  H01L2224/1401 ,  H01L2224/1403 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/14181 ,  H01L2224/14505 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/1712 ,  H01L2224/17181 ,  H01L2224/175 ,  H01L2224/1751 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/206 ,  H01L2924/014 ,  H01L2224/05552

摘要： Semiconductor packages include a first substrate including a central portion and a peripheral portion, at least one first central connection member attached to the central portion of the first substrate, and at least one first peripheral connection member attached to the peripheral portion of the first substrate. The first central connection member includes a first supporter and a first fusion conductive layer surrounding the first supporter.

摘要翻译： 半导体封装包括包括中心部分和周边部分的第一基板，附接到第一基板的中心部分的至少一个第一中心连接部件和附接到第一基板的周边部分的至少一个第一周边连接部件。 第一中心连接构件包括第一支撑件和围绕第一支撑件的第一融合导电层。