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公开(公告)号：US20160240509A1
公开(公告)日：2016-08-18
申请号：US15135364
申请日：2016-04-21
发明人： Heungkyu KWON , Kang Joon LEE , JaeWook YOO , Su-Chang LEE
IPC分类号： H01L25/065 , H01L23/31 , H01L23/00
CPC分类号： H01L23/49811 , H01L23/13 , H01L23/16 , H01L23/18 , H01L23/3157 , H01L23/488 , H01L23/49816 , H01L23/49838 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/0557 , H01L2224/13025 , H01L2224/131 , H01L2224/1319 , H01L2224/13541 , H01L2224/13561 , H01L2224/13583 , H01L2224/13609 , H01L2224/13611 , H01L2224/13616 , H01L2224/13624 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13649 , H01L2224/13655 , H01L2224/13657 , H01L2224/1366 , H01L2224/13664 , H01L2224/13666 , H01L2224/13669 , H01L2224/1367 , H01L2224/13671 , H01L2224/13672 , H01L2224/13679 , H01L2224/1368 , H01L2224/13681 , H01L2224/13684 , H01L2224/1401 , H01L2224/1403 , H01L2224/14135 , H01L2224/14136 , H01L2224/14181 , H01L2224/14505 , H01L2224/16146 , H01L2224/16225 , H01L2224/1703 , H01L2224/1712 , H01L2224/17181 , H01L2224/175 , H01L2224/1751 , H01L2224/2919 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2225/06565 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082 , H01L2924/00014 , H01L2924/15153 , H01L2924/15156 , H01L2924/15311 , H01L2924/15321 , H01L2924/15787 , H01L2924/18161 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2924/0665 , H01L2924/206 , H01L2924/014 , H01L2224/05552
摘要： Semiconductor packages include a first substrate including a central portion and a peripheral portion, at least one first central connection member attached to the central portion of the first substrate, and at least one first peripheral connection member attached to the peripheral portion of the first substrate. The first central connection member includes a first supporter and a first fusion conductive layer surrounding the first supporter.
摘要翻译： 半导体封装包括包括中心部分和周边部分的第一基板，附接到第一基板的中心部分的至少一个第一中心连接部件和附接到第一基板的周边部分的至少一个第一周边连接部件。 第一中心连接构件包括第一支撑件和围绕第一支撑件的第一融合导电层。
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公开(公告)号：US09698088B2
公开(公告)日：2017-07-04
申请号：US15135364
申请日：2016-04-21
发明人： Heungkyu Kwon , Kang Joon Lee , JaeWook Yoo , Su-Chang Lee
IPC分类号： H01L23/498 , H01L23/488 , H01L23/16 , H01L23/18 , H01L25/065 , H01L25/10 , H01L23/00 , H01L23/31 , H01L23/13
CPC分类号： H01L23/49811 , H01L23/13 , H01L23/16 , H01L23/18 , H01L23/3157 , H01L23/488 , H01L23/49816 , H01L23/49838 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/0557 , H01L2224/13025 , H01L2224/131 , H01L2224/1319 , H01L2224/13541 , H01L2224/13561 , H01L2224/13583 , H01L2224/13609 , H01L2224/13611 , H01L2224/13616 , H01L2224/13624 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13649 , H01L2224/13655 , H01L2224/13657 , H01L2224/1366 , H01L2224/13664 , H01L2224/13666 , H01L2224/13669 , H01L2224/1367 , H01L2224/13671 , H01L2224/13672 , H01L2224/13679 , H01L2224/1368 , H01L2224/13681 , H01L2224/13684 , H01L2224/1401 , H01L2224/1403 , H01L2224/14135 , H01L2224/14136 , H01L2224/14181 , H01L2224/14505 , H01L2224/16146 , H01L2224/16225 , H01L2224/1703 , H01L2224/1712 , H01L2224/17181 , H01L2224/175 , H01L2224/1751 , H01L2224/2919 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2225/06565 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082 , H01L2924/00014 , H01L2924/15153 , H01L2924/15156 , H01L2924/15311 , H01L2924/15321 , H01L2924/15787 , H01L2924/18161 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2924/0665 , H01L2924/206 , H01L2924/014 , H01L2224/05552
摘要： Semiconductor packages include a first substrate including a central portion and a peripheral portion, at least one first central connection member attached to the central portion of the first substrate, and at least one first peripheral connection member attached to the peripheral portion of the first substrate. The first central connection member includes a first supporter and a first fusion conductive layer surrounding the first supporter.
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公开(公告)号：US20120299197A1
公开(公告)日：2012-11-29
申请号：US13478613
申请日：2012-05-23
申请人： Heungkyu KWON , Kang Joon Lee , Jae Wook Yoo , Su-Chang Lee
发明人： Heungkyu KWON , Kang Joon Lee , Jae Wook Yoo , Su-Chang Lee
IPC分类号： H01L23/48
CPC分类号： H01L23/49811 , H01L23/13 , H01L23/16 , H01L23/18 , H01L23/3157 , H01L23/488 , H01L23/49816 , H01L23/49838 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/0557 , H01L2224/13025 , H01L2224/131 , H01L2224/1319 , H01L2224/13541 , H01L2224/13561 , H01L2224/13583 , H01L2224/13609 , H01L2224/13611 , H01L2224/13616 , H01L2224/13624 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13649 , H01L2224/13655 , H01L2224/13657 , H01L2224/1366 , H01L2224/13664 , H01L2224/13666 , H01L2224/13669 , H01L2224/1367 , H01L2224/13671 , H01L2224/13672 , H01L2224/13679 , H01L2224/1368 , H01L2224/13681 , H01L2224/13684 , H01L2224/1401 , H01L2224/1403 , H01L2224/14135 , H01L2224/14136 , H01L2224/14181 , H01L2224/14505 , H01L2224/16146 , H01L2224/16225 , H01L2224/1703 , H01L2224/1712 , H01L2224/17181 , H01L2224/175 , H01L2224/1751 , H01L2224/2919 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2225/06565 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082 , H01L2924/00014 , H01L2924/15153 , H01L2924/15156 , H01L2924/15311 , H01L2924/15321 , H01L2924/15787 , H01L2924/18161 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2924/0665 , H01L2924/206 , H01L2924/014 , H01L2224/05552
摘要： Semiconductor packages include a first substrate including a central portion and a peripheral portion, at least one first central connection member attached to the central portion of the first substrate, and at least one first peripheral connection member attached to the peripheral portion of the first substrate. The first central connection member includes a first supporter and a first fusion conductive layer surrounding the first supporter.
摘要翻译： 半导体封装包括包括中心部分和周边部分的第一基板，附接到第一基板的中心部分的至少一个第一中心连接部件和附接到第一基板的周边部分的至少一个第一周边连接部件。 第一中心连接构件包括第一支撑件和围绕第一支撑件的第一融合导电层。
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公开(公告)号：US5251806A
公开(公告)日：1993-10-12
申请号：US870647
申请日：1992-04-16
申请人： Birendra N. Agarwala , Aziz M. Ahsan , Arthur Bross , Mark F. Chadurjian , Nicholas G. Koopman , Li-Chung Lee , Karl J. Puttlitz , Sudipta K. Ray , James G. Ryan , Joseph G. Schaefer , Kamalesh K. Srivastava , Paul A. Totta , Erick G. Walton , Adolf E. Wirsing
发明人： Birendra N. Agarwala , Aziz M. Ahsan , Arthur Bross , Mark F. Chadurjian , Nicholas G. Koopman , Li-Chung Lee , Karl J. Puttlitz , Sudipta K. Ray , James G. Ryan , Joseph G. Schaefer , Kamalesh K. Srivastava , Paul A. Totta , Erick G. Walton , Adolf E. Wirsing
IPC分类号： H01L21/60 , H01L23/485 , H05K3/34 , H01L21/283
CPC分类号： H01L24/12 , H01L24/11 , H01L2224/11901 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/1357 , H01L2224/13582 , H01L2224/13583 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/1366 , H01L2224/13664 , H01L2224/13666 , H01L2224/13669 , H01L2224/1367 , H01L2224/13671 , H01L2224/13672 , H01L2224/13676 , H01L2224/13679 , H01L2224/1368 , H01L2224/13681 , H01L2224/13684 , H01L24/16 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01046 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/15787 , H05K3/3431 , H05K3/3457
摘要： The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.
摘要翻译： 本发明一般涉及新的互连及其制造方法，更具体地说，涉及一种细长的焊料互连及其制造方法。 在电子载体上，形成焊盘，在其上沉积焊料块并用金属层封盖，从而形成细长的焊料互连。 现在可以通过在已经被金属层覆盖的第一焊料块上形成第二焊料块来形成另外细长的焊料互连。 可以通过用金属覆盖层封盖前述焊料块和/或最后的焊料块来形成附加的细长焊料互连。 或者，封装层可以是形成在焊料块的侧壁上的侧壁间隔物的形式。
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公开(公告)号：US5130779A
公开(公告)日：1992-07-14
申请号：US540256
申请日：1990-06-19
申请人： Birendra N. Agarwala , Aziz M. Ahsan , Arthur Bross , Mark F. Chadurjian , Nicholas G. Koopman , Li-Chung Lee , Karl J. Puttlitz , Sudipta K. Ray , James G. Ryan , Joseph G. Schaefer , Kamalesh K. Srivastava , Paul A. Totta , Erick G. Walton , Adolf E. Wirsing
发明人： Birendra N. Agarwala , Aziz M. Ahsan , Arthur Bross , Mark F. Chadurjian , Nicholas G. Koopman , Li-Chung Lee , Karl J. Puttlitz , Sudipta K. Ray , James G. Ryan , Joseph G. Schaefer , Kamalesh K. Srivastava , Paul A. Totta , Erick G. Walton , Adolf E. Wirsing
IPC分类号： H01L21/60 , H01L23/485 , H05K3/34
CPC分类号： H01L24/13 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/13082 , H01L2224/131 , H01L2224/1357 , H01L2224/13582 , H01L2224/13583 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/1366 , H01L2224/13664 , H01L2224/13666 , H01L2224/13669 , H01L2224/1367 , H01L2224/13671 , H01L2224/13672 , H01L2224/13676 , H01L2224/13679 , H01L2224/1368 , H01L2224/13681 , H01L2224/13684 , H01L2224/81801 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01046 , H01L2924/0105 , H01L2924/01051 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/15787 , H05K3/3431 , H05K3/3457
摘要： The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.
摘要翻译： 本发明一般涉及新的互连及其制造方法，更具体地说，涉及一种细长的焊料互连及其制造方法。 在电子载体上，形成焊盘，在其上沉积焊料块并用金属层封盖，从而形成细长的焊料互连。 现在可以通过在已经被金属层覆盖的第一焊料块上形成第二焊料块来形成另外细长的焊料互连。 可以通过用金属覆盖层封盖前述焊料块和/或最后的焊料块来形成附加的细长焊料互连。 或者，封装层可以是形成在焊料块的侧壁上的侧壁间隔物的形式。
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