Abstract:
Uncured epoxy resin for use in making prepreg for aerospace applications. The resin includes an epoxy resin component comprising difunctional epoxy resin, trifunctional epoxy resin and/or tetrafunctional epoxy resin and a sufficient amount of [3-(4-aminobenzoyl) oxyphenyl]4-aminobenzoate (3-ABOAB), as a curing agent, such that the uncured resin can be stored at room temperature of at least 6 weeks and wherein the uncured resin can be fully cured in no more than 2 hours at a temperature of between 175° C. and 185° C.
Abstract:
Amino benzoates have been found to be useful curing agents for epoxy resins particularly para amino benzoates containing at least two primary amine groups and at least two carboxyl moieties, the amino benzoates are particularly useful as curatives in prepregs.
Abstract:
Amino benzoates have been found to be useful curing agents for epoxy resins particularly para amino benzoates containing at least two primary amine groups and at least two carboxyl moieties, the amino benzoates are particularly useful as curatives in prepregs.
Abstract:
Uncured epoxy resin for use in making prepreg for aerospace applications. The resin includes an epoxy resin component comprising difunctional epoxy resin, trifunctional epoxy resin and/or tetrafunctional epoxy resin and a sufficient amount of [3-(4-aminobenzoyl) oxyphenyl] 4-aminobenzoate (3-ABOAB), as a curing agent, such that the uncured resin can be stored at room temperature of at least 6 weeks and wherein the uncured resin can be fully cured in no more than 2 hours at a temperature of between 175° C. and 185° C.
Abstract:
A prepreg comprising a fibre reinforced curable resin, the curable resin being composed of 25 to 35 weight percent tetrafunctional epoxy resin based on the total weight of the curable resin; 18 to 28 weight percent difunctional epoxy resin; 4 to 18 weight percent polyether sulfone; 2 to 10 weight percent polyamide 12 particles; 2 to 10 weight percent polyamide 11 particles; 1 to 8 weight percent potato shaped graphite particles; and 17.4 to 27.4 weight percent of a curing agent for said curable resin.
Abstract:
A composite material, the composite material comprising at least one prepreg, said prepreg comprising at least one polymeric resin and at least one fibrous reinforcement; and conducting particles dispersed in the polymeric resin.
Abstract:
Liquid alkoxy-substituted methylene bis anilines have been found to be useful curing agents for epoxy resins and have also been found to be more readily formulated with epoxy resins, the substituents on the aromatic groups of the methylene bis anilines include an alkoxy group and/or the mixtures of materials are selected in order to obtain the liquid products.
Abstract:
A resin material is provided which comprises at least one thermoset resin, carbon conductive additive material, and at least one thermoplastic polymer resin. The thermoplastic polymer resin dissolves in the thermoset polymer resin and phase separates upon cure. There is also provided a method of making the resin material, and additionally a composite material that comprising said resin material in combination with a fibrous reinforcement. The resin material and composite material may each be used in an uncured or cured form, and may find particular use as a prepreg material.
Abstract:
A resin composition for producing a composite, wherein the composition comprises (a) resin component comprising a glycidyl bisphenol Z epoxy resin, and (b) a curing agent.
Abstract:
A prepreg comprising a single structural layer of electrically conductive unidirectional fibres and a first outer layer of curable resin substantially free of structural fibres, and optionally a second outer layer of curable resin substantially free of structural fibres, the sum of the thicknesses of the first and second outer resin layers at a given point having an average of at least 10 micrometres and varying over at least the range of from 50% to 120% of the average value, and wherein the first outer layer comprises electrically conductive particles.