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    Analysis device, and analysis apparatus and method using the same
    1.
    发明授权
    Analysis device, and analysis apparatus and method using the same 有权
    分析装置及其分析装置及方法

    公开(公告)号：US08415140B2

    公开(公告)日：2013-04-09

    申请号：US12681493

    申请日：2008-10-03

    申请人： Hiroshi Saiki ,  Takashi Miki ,  Takuya Suzuki

    发明人： Hiroshi Saiki ,  Takashi Miki ,  Takuya Suzuki

    IPC分类号： C12M1/32

    CPC分类号： G01N33/721 ,  G01N33/491 ,  G01N33/545

    摘要： An analysis device includes: a separation cavity 18 for separating a test liquid into a solution component and a solid component by using a centrifugal force; a higher specific gravity component quantitative cavity 23 for holding a portion of the separated solid component which has been transferred; a sample solution overflow cavity 22 arranged between the higher specific gravity component quantitative cavity 23 and the separation cavity 18 and connected to a connecting channel 21 for transporting the sample liquid from the separation cavity 18; and a capillary cavity 19 formed in the separation cavity 18 for temporarily holding a separated solution component (blood plasma) in the separation cavity 18. A blood plasma component 57a remaining in the separation cavity 18 is trapped by the capillary cavity 19.

    摘要翻译： 分析装置包括：分离腔18，用于通过离心力将测试液体分离成溶液成分和固体成分; 用于保持被转移的分离的固体成分的一部分的较高比重分量定量腔23; 布置在较高比重分量定量空腔23和分离腔18之间的样品溶液溢出腔22，并连接到用于从分离腔18输送样品液体的连接通道21; 以及形成在分离腔18中的毛细管腔19，用于在分离腔18中临时保持分离的溶液成分（血浆）。残留在分离腔18中的血浆组分57a被毛细管腔19捕获。

    ANALYSIS DEVICE, AND ANALYSIS APPARATUS AND METHOD USING THE SAME
    2.
    发明申请
    ANALYSIS DEVICE, AND ANALYSIS APPARATUS AND METHOD USING THE SAME 有权
    分析装置，以及分析装置和使用该装置的方法

    公开(公告)号：US20100221741A1

    公开(公告)日：2010-09-02

    申请号：US12681493

    申请日：2008-10-03

    申请人： Hiroshi Saiki ,  Masanori Tanaka ,  Takashi Miki ,  Miho Okano ,  Yoshiyuki Fujii ,  Hirotaka Tanaka ,  Takuya Suzuki

    发明人： Hiroshi Saiki ,  Masanori Tanaka ,  Takashi Miki ,  Miho Okano ,  Yoshiyuki Fujii ,  Hirotaka Tanaka ,  Takuya Suzuki

    IPC分类号： G01N33/53 ,  C12M1/34 ,  C12Q1/02

    CPC分类号： G01N33/721 ,  G01N33/491 ,  G01N33/545

    摘要： An analysis device includes: a separation cavity 18 for separating a test liquid into a solution component and a solid component by using a centrifugal force; a higher specific gravity component quantitative cavity 23 for holding a portion of the separated solid component which has been transferred; a sample solution overflow cavity 22 arranged between the higher specific gravity component quantitative cavity 23 and the separation cavity 18 and connected to a connecting channel 21 for transporting the sample liquid from the separation cavity 18; and a capillary cavity 19 formed in the separation cavity 18 for temporarily holding a separated solution component (blood plasma) in the separation cavity 18. A blood plasma component 57a remaining in the separation cavity 18 is trapped by the capillary cavity 19.

    摘要翻译： 分析装置包括：分离腔18，用于通过离心力将测试液体分离成溶液成分和固体成分; 用于保持被转移的分离的固体成分的一部分的较高比重分量定量腔23; 布置在较高比重分量定量空腔23和分离腔18之间的样品溶液溢出腔22，并连接到用于从分离腔18输送样品液体的连接通道21; 以及形成在分离腔18中的毛细管腔19，用于在分离腔18中临时保持分离的溶液成分（血浆）。留在分离腔18中的血浆组分57a被毛细管腔19捕获。

    High-frequency circuit package and sensor module
    5.
    发明授权
    High-frequency circuit package and sensor module 有权
    高频电路封装和传感器模块

    公开(公告)号：US09070961B2

    公开(公告)日：2015-06-30

    申请号：US13062349

    申请日：2009-09-02

    申请人： Takuya Suzuki

    发明人： Takuya Suzuki

    IPC分类号： H05K1/11 ,  H05K1/14 ,  H01P5/107 ,  H01L23/552 ,  H01L23/58 ,  H01L23/66 ,  H01L25/18 ,  H05K1/02 ,  H01L23/498 ,  H01L23/50 ,  H05K3/34

    CPC分类号： H05K1/0218 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/18 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2924/15321 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/3011 ,  H01P3/081 ,  H01P5/107 ,  H01Q9/04 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/09618 ,  H05K2201/10151 ,  H05K2201/10734

    摘要： Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate (20) is disposed, on an underside surface layer of which are disposed high-frequency circuits (21 and 22) and is formed a first grounding conductor that has same electric potential as grounding conductors of the high-frequency circuits and that surrounds the high-frequency circuits. A mother control substrate (3) is disposed, on which the high-frequency circuit mounting substrate (20) is mounted in such a way that the high-frequency circuits are sandwiched therebetween and on which a second grounding conductor is formed in a region facing the high-frequency circuits. Plural first lands are formed on the first grounding conductor of the high-frequency circuit mounting substrate (20) to surround the high-frequency circuits. Plural second lands are formed that are electrically connected to the second grounding conductor at positions on a surface layer of the mother control substrate (3) which face the first lands. Plural solder balls (30G2) are disposed for connecting the first lands and the second lands. The high-frequency circuits are housed in pseudo shielding cavities surrounded by the solder balls (30G2), the grounding conductors of the high-frequency circuits, and the first and second grounding conductors.

    摘要翻译： 使用不使用任何盖子的简单且便宜的配置来实现高频电路的屏蔽。 高频电路安装基板（20）设置在其下表面层上，设置有高频电路（21和22），并形成与第一接地导体相同的电位的第一接地导体， 频率电路，并且围绕高频电路。 设置母控制基板（3），其上安装有高频电路安装基板（20），使得高频电路夹在其间并在其上形成有第二接地导体的区域 高频电路。 多个第一焊盘形成在高频电路安装基板（20）的第一接地导体上，以围绕高频电路。 形成在母板控制基板（3）的面对第一焊盘的位置处与第二接地导体电连接的多个第二焊盘。 多个焊球（30G2）被设置用于连接第一焊盘和第二焊盘。 高频电路容纳在由焊球（30G2），高频电路的接地导体以及第一和第二接地导体包围的伪屏蔽腔中。

    Waveguide connection between a multilayer waveguide substrate and a metal waveguide substrate including a choke structure in the multilayer waveguide
    6.
    发明授权
    Waveguide connection between a multilayer waveguide substrate and a metal waveguide substrate including a choke structure in the multilayer waveguide 有权
    在多层波导基板和包括多层波导中的扼流结构的金属波导基板之间的波导连接

    公开(公告)号：US07994881B2

    公开(公告)日：2011-08-09

    申请号：US12307755

    申请日：2007-10-30

    申请人： Takuya Suzuki

    发明人： Takuya Suzuki

    IPC分类号： H01P1/04

    CPC分类号： H01P1/042 ,  H01P3/121

    摘要： A rectangular conductor pattern is formed around a first waveguide on a multilayer dielectric substrate facing a metal substrate, with an end at about λ/4 away from a long side edge of the first waveguide, where λ is a free-space wavelength of a signal wave. A conductor opening is formed between the end of the conduction pattern and the long side edge of the first waveguide, with a length longer than a long side of the first waveguide and shorter than about λ. A closed-ended dielectric transmission path is formed in the multilayer dielectric substrate in the layer direction, with a length of about λg/4, where λg is an in-substrate effective wavelength of the signal wave.

    摘要翻译： 在面向金属基板的多层电介质基板上的第一波导周围形成矩形导体图案，其端部距离第一波导的长边缘大约λ/ 4，其中λ是信号的自由空间波长 波。 导体开口形成在导电图案的端部和第一波导的长边缘之间，其长度比第一波导的长边长并且短于约λ。 在多层电介质基板中沿层方向形成封闭电介质传输路径，长度约为λg/ 4，其中λg为信号波的衬底内有效波长。

    HIGH-FREQUENCY CIRCUIT PACKAGE AND SENSOR MODULE
    7.
    发明申请
    HIGH-FREQUENCY CIRCUIT PACKAGE AND SENSOR MODULE 有权
    高频电路封装和传感器模块

    公开(公告)号：US20110163919A1

    公开(公告)日：2011-07-07

    申请号：US13062349

    申请日：2009-09-02

    申请人： Takuya Suzuki

    发明人： Takuya Suzuki

    IPC分类号： H05K9/00 ,  H01Q1/38

    CPC分类号： H05K1/0218 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/18 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2924/15321 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/3011 ,  H01P3/081 ,  H01P5/107 ,  H01Q9/04 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0237 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/09618 ,  H05K2201/10151 ,  H05K2201/10734

    摘要： Shielding of high-frequency circuits is achieved using a simple and inexpensive configuration not using any lid. A high-frequency circuit mounting substrate (20) is disposed, on an underside surface layer of which are disposed high-frequency circuits (21 and 22) and is formed a first grounding conductor that has same electric potential as grounding conductors of the high-frequency circuits and that surrounds the high-frequency circuits. A mother control substrate (3) is disposed, on which the high-frequency circuit mounting substrate (20) is mounted in such a way that the high-frequency circuits are sandwiched therebetween and on which a second grounding conductor is formed in a region facing the high-frequency circuits. Plural first lands are formed on the first grounding conductor of the high-frequency circuit mounting substrate (20) to surround the high-frequency circuits. Plural second lands are formed that are electrically connected to the second grounding conductor at positions on a surface layer of the mother control substrate (3) which face the first lands. Plural solder balls (30G2) are disposed for connecting the first lands and the second lands. The high-frequency circuits are housed in pseudo shielding cavities surrounded by the solder balls (30G2), the grounding conductors of the high-frequency circuits, and the first and second grounding conductors.

    摘要翻译： 使用不使用任何盖子的简单且便宜的配置来实现高频电路的屏蔽。 高频电路安装基板（20）设置在其下表面层上，设置有高频电路（21和22），并形成与第一接地导体相同的电位的第一接地导体， 频率电路，并且围绕高频电路。 设置母控制基板（3），其上安装有高频电路安装基板（20），使得高频电路夹在其间并在其上形成有第二接地导体的区域 高频电路。 多个第一焊盘形成在高频电路安装基板（20）的第一接地导体上，以围绕高频电路。 形成在母板控制基板（3）的面对第一焊盘的位置处与第二接地导体电连接的多个第二焊盘。 多个焊球（30G2）被设置用于连接第一焊盘和第二焊盘。 高频电路容纳在由焊球（30G2），高频电路的接地导体以及第一和第二接地导体包围的伪屏蔽腔中。

    Battery driven video reproduction apparatus
    8.
    发明授权
    Battery driven video reproduction apparatus 有权
    电池驱动视频再现设备

    公开(公告)号：US07725009B2

    公开(公告)日：2010-05-25

    申请号：US11176777

    申请日：2005-07-07

    申请人： Takuya Suzuki

    发明人： Takuya Suzuki

    IPC分类号： H04N5/00

    CPC分类号： H04N21/462 ,  H04N5/57 ,  H04N5/63 ,  H04N5/85 ,  H04N21/4325 ,  H04N21/4424

    摘要： A video reproduction apparatus detects the remaining time of a movie being reproduced and a battery's availability and calculates therefrom power available before reproducing the movie ends, and uses the power as calculated and a table representing a relationship between the liquid crystal display device's screen brightness and power consumption to calculate and set the liquid crystal display device's screen brightness to prevent the battery from running out while the movie is being reproduced.

    摘要翻译： 视频再现装置检测正在再现的电影的剩余时间和电池的可用性，并且从其计算再现电影结束之前的可用电力，并且使用所计算的电力和表示液晶显示装置的屏幕亮度和功率之间的关系的表 消耗来计算和设置液晶显示设备的屏幕亮度，以防止在电影被再现时电池电量耗尽。

    SEMICONDUCTOR CHIP AND RADIO FREQUENCY CIRCUIT
    9.
    发明申请
    SEMICONDUCTOR CHIP AND RADIO FREQUENCY CIRCUIT 有权
    半导体芯片和无线电频率电路

    公开(公告)号：US20100117711A1

    公开(公告)日：2010-05-13

    申请号：US12527877

    申请日：2007-11-15

    申请人： Takuya Suzuki ,  Kenji Kawakami ,  Ko Kanaya ,  Yoichi Kitamura

    发明人： Takuya Suzuki ,  Kenji Kawakami ,  Ko Kanaya ,  Yoichi Kitamura

    IPC分类号： G06F7/44 ,  H01L23/48

    CPC分类号： H03D7/02 ,  H01L23/66 ,  H01L2223/6644 ,  H01L2924/0002 ,  H01L2924/3011 ,  H03D9/0633 ,  H01L2924/00

    摘要： A two-terminal semiconductor device is formed on a semiconductor substrate. Two wiring patterns are respectively connected to terminals of the semiconductor device, and two electrode pads are respectively connected to the wiring patterns for connecting a signal input/output circuit formed on a separate substrate. Two parallel wiring patterns are respectively connected to the wiring patterns, and two reactance-circuit connection electrode pads are respectively connected to the parallel wiring patterns for electrically connecting a reactance circuit formed on the separate substrate separately from the signal input/output circuit.

    摘要翻译： 在半导体衬底上形成二端子半导体器件。 两个布线图案分别连接到半导体器件的端子，并且两个电极焊盘分别连接到用于连接形成在单独基板上的信号输入/输出电路的布线图案。 两个平行布线图案分别连接到布线图案，并且两个电抗电路连接电极焊盘分别连接到并行布线图案，用于将形成在单独基板上的电抗电路与信号输入/输出电路分开地电连接。