公开(公告)号：US5018051A

公开(公告)日：1991-05-21

申请号：US291252

申请日：1988-12-28

申请人： Hiroshi Yamada ,  Masayuki Ohuchi ,  Masayuki Saito ,  Akinori Hongu

发明人： Hiroshi Yamada ,  Masayuki Ohuchi ,  Masayuki Saito ,  Akinori Hongu

IPC分类号： H05K1/02 ,  B42D15/10 ,  G06K19/077 ,  H01L23/538 ,  H05K1/18

CPC分类号： H01L23/5388 ,  G06K19/07743 ,  G06K19/07745 ,  H05K1/185 ,  H01L2224/24227 ,  H01L2924/15153 ,  H01L2924/15165

摘要： An IC card is disclosed which comprises a card-shaped main substrate having a surface on which recess portions are formed and an edge portion having a connector layer with an external connector terminal pattern formed thereon, circuit modules embedded in the recess portions in main substrate, each module having electronic components including IC chips, a chip capacitor and a thin D.C. battery unit, and a double-layered wiring structure for providing electric connection between the electronic components and the connector terminal pattern. The double-layered wiring structure comprises a first wiring layer formed on the main substrate to cover the circuit modules and a second wiring layer formed insulatively above the former wiring layer. The first wiring layer has a first wiring pattern that extends in a first direction of the main substrate to be coupled to the electronic components. The second wiring layer has a second wiring pattern that extends in a second direction of the main substrate to be coupled to the first wiring pattern and the connector terminal pattern.

摘要翻译： 公开了一种IC卡，其包括具有形成有凹部的表面的卡形主基板和具有形成在其上的外部连接器端子图案的连接器层的边缘部分，嵌入主基板的凹部中的电路模块， 每个模块具有包括IC芯片，片状电容器和薄DC电池单元的电子部件，以及用于在电子部件和连接器端子图案之间提供电连接的双层布线结构。 双层布线结构包括形成在主基板上以覆盖电路模块的第一布线层和绝缘地形成在前布线层上方的第二布线层。 第一布线层具有在主基板的第一方向上延伸以耦合到电子部件的第一布线图案。 第二布线层具有在主基板的第二方向上延伸以与第一布线图案和连接器端子图案耦合的第二布线图案。

公开(公告)号：US4694138A

公开(公告)日：1987-09-15

申请号：US677017

申请日：1984-11-30

申请人： Hirosi Oodaira ,  Haruko Suzuki ,  Masayuki Saito ,  Masayuki Ohuchi

发明人： Hirosi Oodaira ,  Haruko Suzuki ,  Masayuki Saito ,  Masayuki Ohuchi

IPC分类号： H01L21/48 ,  H01L23/538 ,  H05K1/09 ,  H05K3/10 ,  B23K26/00

CPC分类号： H05K3/105 ,  H01L21/4867 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19043 ,  H05K1/095 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/121 ,  Y10T29/49155

摘要： A conductor path is formed by providing an insulating substrate having a surface region which is formed of an insulating composition. The insulating composition contains an organic polymeric material and at least one metal source. The metal source is a metallic powder and/or an organic compound chemically combining a metal or metals. The surface region of the substrate is selectively heated along a predetermined pattern, thereby decomposing and evaporating the organic polymeric material at the heated portion and welding the metal in the heated portion so as to form a conductor path formed of the metal.

摘要翻译： 通过提供具有由绝缘组合物形成的表面区域的绝缘基板形成导体路径。 绝缘组合物含有有机聚合材料和至少一种金属源。 金属源是化学结合金属或金属的金属粉末和/或有机化合物。 衬底的表面区域沿着预定图案被选择性地加热，从而在加热部分分解和蒸发有机聚合物材料，并将金属焊接在加热部分中，以形成由金属形成的导体路径。

公开(公告)号：US4751126A

公开(公告)日：1988-06-14

申请号：US881569

申请日：1986-07-02

申请人： Hirosi Oodaira ,  Yoshikatsu Fukumoto ,  Shuji Hiranuma ,  Masayuki Ohuchi ,  Tamio Saito

发明人： Hirosi Oodaira ,  Yoshikatsu Fukumoto ,  Shuji Hiranuma ,  Masayuki Ohuchi ,  Tamio Saito

IPC分类号： H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K1/18 ,  H05K3/00 ,  H05K3/12 ,  H05K3/22 ,  H05K3/28 ,  H05K3/40 ,  H05K3/46 ,  B05D5/10 ,  B32B31/00

CPC分类号： H05K1/186 ,  H05K3/281 ,  H05K3/4084 ,  H05K3/4614 ,  H05K3/4632 ,  H05K1/095 ,  H05K2201/0129 ,  H05K2201/091 ,  H05K2203/063 ,  H05K2203/1572 ,  H05K2203/302 ,  H05K3/0014 ,  H05K3/4007 ,  Y10S428/901 ,  Y10T156/1056 ,  Y10T156/109 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49167 ,  Y10T428/24339 ,  Y10T428/24347

摘要： A circuit board is prepared such that at least two resin substrates are laminated and bonded by thermocompression, a circuit pattern made of a resin composition containing a conductor material is formed on at least one of opposing surfaces of the substrates, a region of the substrate which corresponds to a specific portion of the circuit pattern is recessed, the specific portion of the circuit projects into the recess in accordance with plastic deformation of the substrates and the circuit pattern which is caused by thermocompression bonding, and the specific portion of the circuit pattern constitutes an exposed portion. Multilayer or three-dimensional wiring can be easily achieved in the circuit board.

摘要翻译： 制备电路板，使得至少两个树脂基板通过热压进行层压和接合，在基板的相对表面的至少一个表面上形成由包含导体材料的树脂组合物制成的电路图案，基板的区域 对应于电路图案的特定部分凹陷，电路的特定部分根据基板的塑性变形和由热压接而引起的电路图案突出到凹部中，并且电路图案的特定部分构成 曝光部分。 电路板可以容易地实现多层或三维布线。

公开(公告)号：US4931853A

公开(公告)日：1990-06-05

申请号：US403772

申请日：1989-09-06

申请人： Masayuki Ohuchi ,  Hirosi Oodaira ,  Kenichi Yoshida

发明人： Masayuki Ohuchi ,  Hirosi Oodaira ,  Kenichi Yoshida

IPC分类号： B42D15/02 ,  B42D15/10 ,  G06K19/077 ,  H01L21/00 ,  H01L21/60 ,  H01L21/603

CPC分类号： H01L24/96 ,  G06K19/07745 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/4913

摘要： An IC card comprises a thermoplastic resin core sheet and an IC chip bearing a conductive projection formed on an electrode of the IC chip, the IC chip being embedded in the core sheet in such a manner that the exposed top surface of the conductive projection is made flush with the main surface of the core sheet. A conductive layer pattern formed on the main surface of the core sheet is extended for contact with the exposed top surface.

摘要翻译： IC卡包括热塑性树脂芯片和IC芯片，该IC芯片在IC芯片的电极上形成有导电突起，IC芯片以这样的方式嵌入在芯片中，使得暴露的导电突起的顶表面被制成 与芯片的主表面齐平。 形成在芯片的主表面上的导电层图案被延伸以与暴露的顶表面接触。

公开(公告)号：US4635356A

公开(公告)日：1987-01-13

申请号：US765800

申请日：1985-08-15

申请人： Masayuki Ohuchi ,  Hirosi Oodaira ,  Kenichi Yoshida

发明人： Masayuki Ohuchi ,  Hirosi Oodaira ,  Kenichi Yoshida

IPC分类号： H05K1/09 ,  H05K1/18 ,  H05K3/28 ,  H05K13/00 ,  H05K3/30

CPC分类号： H01L24/96 ,  H01L24/18 ,  H01L24/82 ,  H05K1/185 ,  H05K3/284 ,  H01L2224/18 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/095 ,  H05K2201/0108 ,  H05K2201/09118 ,  H05K2203/016 ,  H05K2203/1316 ,  H05K2203/1469 ,  H05K3/403 ,  H05K3/4611 ,  Y10T29/49146

摘要： Terminal-equipped electronic elements, such as chip resistors and chip diodes, are arranged such that one surface of each terminal contacts one surface of a support board, the support board being placed to face a flat plate through a spacer. An electrically insulative liquid synthetic resin is injected between the support board and the flat board and cured to form a synthetic resin layer burying the electronic elements. The support board, flat board and spacer are peeled from the electronic elements and the synthetic resin layer to expose one surface of the terminal of each electronic element on one surface of the synthetic resin layer. A conductive pattern is formed on the synthetic resin layer by screen printing to connect the terminals of the electronic elements.

摘要翻译： 端子配备的电子元件如片状电阻器和芯片二极管被布置成使得每个端子的一个表面接触支撑板的一个表面，支撑板通过间隔件放置成面对平板。 将电绝缘液体合成树脂注入支撑板和平板之间并固化以形成埋入电子元件的合成树脂层。 从电子元件和合成树脂层剥离支撑板，平板和间隔件，以在合成树脂层的一个表面上露出每个电子元件的端子的一个表面。 通过丝网印刷在合成树脂层上形成导电图案，以连接电子元件的端子。

公开(公告)号：US4754319A

公开(公告)日：1988-06-28

申请号：US97338

申请日：1987-09-11

申请人： Tamio Saito ,  Masayuki Ohuchi ,  Hirosi Oodaira ,  Yoshikatsu Fukumoto ,  Shuji Hiranuma ,  Ko Kishida ,  Takanori Kisaka

发明人： Tamio Saito ,  Masayuki Ohuchi ,  Hirosi Oodaira ,  Yoshikatsu Fukumoto ,  Shuji Hiranuma ,  Ko Kishida ,  Takanori Kisaka

IPC分类号： H01L27/00 ,  B32B37/18 ,  B42D15/10 ,  G06K19/077 ,  H01L23/00 ,  H01L23/28 ,  G06K19/06 ,  H01L23/06

CPC分类号： B32B37/185 ,  G06K19/07743 ,  G06K19/07745 ,  H01L2924/0002

摘要： In an IC card according to the present invention, a base sheet formed of thermoplastic material is sandwiched between a substrate sheet and a dummy sheet both formed of nonplastic material lower in thermoplasticity than the base sheet. The substrate sheet is fitted with at least one IC chip and input/output terminals electrically connected to the IC chip. First and second cover sheets formed of thermoplastic material are put individually on the outer surfaces of the substrate sheet and the dummy sheet. The cover sheet on the substrate sheet is formed with apertures through which the input/output terminals are exposed to the outside.

摘要翻译： 在根据本发明的IC卡中，由热塑性材料形成的基片夹在基片和虚拟片之间，所述基片和虚拟片由热塑性低于基片的非塑性材料形成。 该基板安装有至少一个IC芯片和与IC芯片电连接的输入/输出端子。 由热塑性材料形成的第一和第二覆盖片分别放置在基片和假片的外表面上。 基板上的盖板形成有孔，通过该孔将输入/输出端子暴露于外部。

公开(公告)号：US5049980A

公开(公告)日：1991-09-17

申请号：US181526

申请日：1988-04-14

申请人： Tamio Saito ,  Masayuki Ohuchi ,  Akira Niitsuma

发明人： Tamio Saito ,  Masayuki Ohuchi ,  Akira Niitsuma

IPC分类号： H01L23/52 ,  H01L21/48 ,  H01L21/768 ,  H01L23/13 ,  H01L23/14 ,  H01L23/498 ,  H01L23/522 ,  H01L23/538

CPC分类号： H01L24/96 ,  H01L21/4867 ,  H01L23/13 ,  H01L23/145 ,  H01L23/49883 ,  H01L23/538 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/92 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/14

摘要： Plural semiconductor elements are buried into an insulating substrate, and top surfaces of semiconductor elements and the substrate are in a same plane. A photosensitive dry film is covered on surfaces of the substrate and semiconductor elements. The photosensitive dry film has openings corresponding to electrodes of semiconductor elements, and conductors are filled in openings of the photosensitive dry film. The device has the multi-layer wiring construction without damaging to semiconductor elements arranged on the substrate.

摘要翻译： 多个半导体元件被埋入绝缘基板中，并且半导体元件和基板的顶表面在同一平面内。 感光性干膜被覆盖在基板和半导体元件的表面上。 感光性干膜具有与半导体元件的电极对应的开口，导体填充在感光性干膜的开口部中。 该器件具有多层布线结构，而不会损坏布置在基板上的半导体元件。

公开(公告)号：US4997791A

公开(公告)日：1991-03-05

申请号：US508649

申请日：1990-04-13

申请人： Masayuki Ohuchi ,  Hirosi Oodaira ,  Kenichi Yoshida

发明人： Masayuki Ohuchi ,  Hirosi Oodaira ,  Kenichi Yoshida

IPC分类号： B42D15/02 ,  B42D15/10 ,  G06K19/077 ,  H01L21/00 ,  H01L21/60 ,  H01L21/603

CPC分类号： H01L24/96 ,  G06K19/07745 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/4913

摘要： An IC card comprises a thermoplastic resin core sheet and an IC chip bearing a conductive projection formed on an electrode of the IC chip, the IC chip being embedded in the core sheet in such a manner that the exposed top surface of the conductive projection is made flush with the main surface of the core sheet. A conductive layer pattern formed on the main surface of the core sheet is extended for contact with the exposed top surface.