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公开(公告)号：US20090321900A1
公开(公告)日：2009-12-31
申请号：US12203524
申请日：2008-09-03
申请人： Hiroshi Yoshida , Tatsuo Ota , Nobutake Taniguchi , Shingo Sudo
发明人： Hiroshi Yoshida , Tatsuo Ota , Nobutake Taniguchi , Shingo Sudo
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/3735 , H01L23/49524 , H01L23/49531 , H01L23/49811 , H01L24/37 , H01L24/40 , H01L24/45 , H01L25/072 , H01L2224/37011 , H01L2224/40225 , H01L2224/45124 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0106 , H01L2924/01068 , H01L2924/01074 , H01L2924/01082 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , H01L2224/48 , H01L2924/00 , H01L2224/37099
摘要： A semiconductor device has a substrate, a semiconductor element, an electrode lead, and a sealing resin portion. The substrate has a main surface on which a circuit pattern is formed. The semiconductor element has first and second surfaces, and is arranged on the substrate such that the first surface faces the main surface. The electrode lead has one end joined to the circuit pattern and the other end joined by soldering to the second surface. The other end has a plurality of portions divided from each other. The sealing resin portion seals the semiconductor element and the electrode lead. Thus, there can be provided a semiconductor device that has relieved thermal stress at a joining portion of the electrode lead, and therefore is less subject to fatigue failure.
摘要翻译： 半导体器件具有衬底，半导体元件，电极引线和密封树脂部分。 基板具有形成有电路图案的主表面。 半导体元件具有第一和第二表面，并且被布置在基板上，使得第一表面面向主表面。 电极引线的一端连接到电路图案，另一端通过焊接连接到第二表面。 另一端具有彼此分开的多个部分。 密封树脂部密封半导体元件和电极引线。 因此，可以提供一种在电极引线的接合部解除热应力的半导体器件，因此不易疲劳破坏。
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公开(公告)号：US07671382B2
公开(公告)日：2010-03-02
申请号：US11462224
申请日：2006-08-03
IPC分类号： H01L41/047
CPC分类号： H01L23/3121 , H01L23/3735 , H01L23/4334 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/84 , H01L25/072 , H01L25/18 , H01L2224/0603 , H01L2224/371 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/40139 , H01L2224/40225 , H01L2224/4103 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/83801 , H01L2224/84801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device which includes a radiating plate, a wiring patterned layer on the radiating plate via an insulating layer, at least one semiconductor chip mounted on the wiring patterned layer. The semiconductor chip has a surface electrode. The semiconductor device further includes a conductive lead plate electrically connected with the surface electrode of the semiconductor chip, and a resin package of thermoplastic resin having anisotropic linear expansion coefficient varying based upon directions. The resin package covers the wiring patterned layer, the semiconductor chip, the conductive lead plate, and at least a portion of the radiating plate. The conductive lead plate extends in a direction which provides the resin package with the maximum linear expansion coefficient. In the semiconductor device so structured, the warpage of the resin package is reduced both in longitudinal and transverse directions.
摘要翻译： 一种半导体器件，其包括散热板，经由绝缘层在所述散热板上的布线图案层，安装在所述布线图案层上的至少一个半导体芯片。 半导体芯片具有表面电极。 半导体装置还包括与半导体芯片的表面电极电连接的导电引线板和具有基于方向变化的各向异性线性膨胀系数的热塑性树脂的树脂封装。 树脂封装覆盖布线图案层，半导体芯片，导电引线板和散热板的至少一部分。 导电引线板沿向树脂封装提供最大线性膨胀系数的方向延伸。 在如此构造的半导体器件中，树脂封装的翘曲在纵向和横向都减小。
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公开(公告)号：US20070138624A1
公开(公告)日：2007-06-21
申请号：US11462224
申请日：2006-08-03
IPC分类号： H01L23/34
CPC分类号： H01L23/3121 , H01L23/3735 , H01L23/4334 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/84 , H01L25/072 , H01L25/18 , H01L2224/0603 , H01L2224/371 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/40139 , H01L2224/40225 , H01L2224/4103 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/83801 , H01L2224/84801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： One of the aspects of the present invention is to provide a semiconductor device, which includes a radiating plate, a wiring patterned layer on the radiating plate via an insulating layer, at least one semiconductor chip mounted on the wiring patterned layer. The semiconductor chip has a surface electrode. The semiconductor device further includes a conductive lead plate electrically connected with the surface electrode of the semiconductor chip, and a resin package of thermoplastic resin having anisotropic linear expansion coefficient varying based upon directions. The resin package covers the wiring patterned layer, the semiconductor chip, the conductive lead plate, and at least a portion of the radiating plate. The conductive lead plate extends in a direction which provides the resin package with the maximum linear expansion coefficient. In the semiconductor device so structured, the warpage of the resin package is reduced both in longitudinal and transverse directions.
摘要翻译： 本发明的一个方面是提供一种半导体器件，其包括散热板，经由绝缘层在散热板上的布线图案层，安装在布线图案层上的至少一个半导体芯片。 半导体芯片具有表面电极。 半导体器件还包括与半导体芯片的表面电极电连接的导电引线板和具有基于方向变化的各向异性线性膨胀系数的热塑性树脂的树脂封装。 树脂封装覆盖布线图案层，半导体芯片，导电引线板和散热板的至少一部分。 导电引线板沿向树脂封装提供最大线性膨胀系数的方向延伸。 在如此构造的半导体器件中，树脂封装的翘曲在纵向和横向都减小。
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公开(公告)号：US07768118B2
公开(公告)日：2010-08-03
申请号：US12203524
申请日：2008-09-03
申请人： Hiroshi Yoshida , Tatsuo Ota , Nobutake Taniguchi , Shingo Sudo
发明人： Hiroshi Yoshida , Tatsuo Ota , Nobutake Taniguchi , Shingo Sudo
IPC分类号： H01L23/52 , H01L23/48 , H01L23/495
CPC分类号： H01L23/3107 , H01L23/3735 , H01L23/49524 , H01L23/49531 , H01L23/49811 , H01L24/37 , H01L24/40 , H01L24/45 , H01L25/072 , H01L2224/37011 , H01L2224/40225 , H01L2224/45124 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0106 , H01L2924/01068 , H01L2924/01074 , H01L2924/01082 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , H01L2224/48 , H01L2924/00 , H01L2224/37099
摘要： A semiconductor device has a substrate, a semiconductor element, an electrode lead, and a sealing resin portion. The substrate has a main surface on which a circuit pattern is formed. The semiconductor element has first and second surfaces, and is arranged on the substrate such that the first surface faces the main surface. The electrode lead has one end joined to the circuit pattern and the other end joined by soldering to the second surface. The other end has a plurality of portions divided from each other. The sealing resin portion seals the semiconductor element and the electrode lead. Thus, there can be provided a semiconductor device that has relieved thermal stress at a joining portion of the electrode lead, and therefore is less subject to fatigue failure.
摘要翻译： 半导体器件具有衬底，半导体元件，电极引线和密封树脂部分。 基板具有形成有电路图案的主表面。 半导体元件具有第一和第二表面，并且被布置在基板上，使得第一表面面向主表面。 电极引线的一端连接到电路图案，另一端通过焊接连接到第二表面。 另一端具有彼此分开的多个部分。 密封树脂部密封半导体元件和电极引线。 因此，可以提供一种在电极引线的接合部解除热应力的半导体器件，因此不易疲劳破坏。
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公开(公告)号：US08236666B2
公开(公告)日：2012-08-07
申请号：US12664751
申请日：2007-12-05
申请人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Takashi Nishimura , Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Nobutake Taniguchi , Hiroshi Yoshida
发明人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Takashi Nishimura , Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Nobutake Taniguchi , Hiroshi Yoshida
CPC分类号： H01L23/3737 , H01L23/16 , H01L23/3121 , H01L23/3735 , H01L23/5386 , H01L23/562 , H01L2224/48091 , H01L2924/09701 , H01L2924/19107 , H05K1/056 , H05K3/041 , H05K3/202 , H05K3/44 , H05K2201/0209 , H05K2201/09745 , H05K2201/09881 , H01L2924/00014
摘要： Provided is a semiconductor device including: a base plate; a thermally conductive resin layer formed on an upper surface of the base plate; an integrated layer which is formed on an upper surface of the thermally conductive resin layer, and includes an electrode and an insulating resin layer covering all side surfaces of the electrode; and a semiconductor element formed on an upper surface of the electrode, in which the integrated layer is thermocompression bonded to the base plate through the thermally conductive resin layer. This semiconductor device excels in insulating properties and reliability.
摘要翻译： 提供一种半导体器件，包括：基板; 形成在所述基板的上表面上的导热树脂层; 形成在导热性树脂层的上表面的整体层，具有覆盖电极的所有侧面的电极和绝缘性树脂层; 以及形成在所述电极的上表面上的半导体元件，其中所述一体层通过所述导热树脂层热压接合到所述基板。 该半导体器件的绝缘性和可靠性优异。
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公开(公告)号：US20100201002A1
公开(公告)日：2010-08-12
申请号：US12664751
申请日：2007-12-05
申请人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Takashi Nishimura , Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Nobutake Taniguchi , Hiroshi Yoshida
发明人： Seiki Hiramatsu , Kei Yamamoto , Atsuko Fujino , Takashi Nishimura , Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Nobutake Taniguchi , Hiroshi Yoshida
CPC分类号： H01L23/3737 , H01L23/16 , H01L23/3121 , H01L23/3735 , H01L23/5386 , H01L23/562 , H01L2224/48091 , H01L2924/09701 , H01L2924/19107 , H05K1/056 , H05K3/041 , H05K3/202 , H05K3/44 , H05K2201/0209 , H05K2201/09745 , H05K2201/09881 , H01L2924/00014
摘要： Provided is a semiconductor device including: a base plate; a thermally conductive resin layer formed on an upper surface of the base plate; an integrated layer which is formed on an upper surface of the thermally conductive resin layer, and includes an electrode and an insulating resin layer covering all side surfaces of the electrode; and a semiconductor element formed on an upper surface of the electrode, in which the integrated layer is thermocompression bonded to the base plate through the thermally conductive resin layer. This semiconductor device excels in insulating properties and reliability.
摘要翻译： 提供一种半导体器件，包括：基板; 形成在所述基板的上表面上的导热树脂层; 形成在导热性树脂层的上表面的整体层，具有覆盖电极的所有侧面的电极和绝缘性树脂层; 以及形成在所述电极的上表面上的半导体元件，其中所述一体层通过所述导热树脂层热压接合到所述基板。 该半导体器件的绝缘性和可靠性优异。
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公开(公告)号：US20060193091A1
公开(公告)日：2006-08-31
申请号：US11336991
申请日：2006-01-23
IPC分类号： H02H7/08
CPC分类号： H03K17/0828 , H01L2924/0002 , H03K17/127 , H03K17/18 , H01L2924/00
摘要： A power semiconductor apparatus is provided with power controlling semiconductor modules connected in parallel to each other. Each power controlling semiconductor module controls driving of a power semiconductor device. The power semiconductor apparatus includes a transmission circuit and a reception circuit provided in one and another power controlling semiconductor modules, respectively. The transmission circuit transmits a predetermined communication signal to another power controlling semiconductor module based on a predetermined activation signal generated by one power controlling semiconductor module. The reception circuit receives the transmitted communication signal, and controls driving control operation of another power controlling semiconductor module based on the received communication signal.
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公开(公告)号：US5086745A
公开(公告)日：1992-02-11
申请号：US550765
申请日：1990-07-10
CPC分类号： G01P5/12 , F02D41/187 , G01F1/692 , G01F1/6965
摘要： A method of processing a signal of a thermal flow-rate sensor, provides a temperature monitor for monitoring a temperature at a representative point on a substrate support member; obtains the temperature at the representative point corresponding to the flow rate by use of the temperature monitor; and corrects an output of the sensor in accordance with a value corresponding to the temperature as well as a value corresponding to the temperature at the representative point when the flow rate is in a steady state.
摘要翻译： 一种处理热流量传感器的信号的方法，提供用于监测基板支撑构件上的代表点的温度的温度监视器; 通过使用温度监测器获得对应于流量的代表点的温度; 根据与温度对应的值，以及当流量处于稳定状态时与代表点处的温度相对应的值来校正传感器的输出。
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公开(公告)号：US5301126A
公开(公告)日：1994-04-05
申请号：US849812
申请日：1992-03-11
CPC分类号： F02D41/187 , G01F1/6965
摘要： A method of processing signal for a thermal type flow sensor having a temperature dependence resistance employing platinum and the like and a holding member made of alumina for holding it so as to compensate for response delay when fluid flow is changed, in which, when the fluid flow is maintained in a stationary state, the so-called equilibrium state, by steps of setting in advance the relation between a flow related value which changes according to flow change and a first operational value showing the temperature characteristic of the holding member which changes according to flow so as to make the flow related value as a parameter, calculating the first operational value from the flow related value when flow is detected in accordance with the predetermined relation, comparing the calculated first operational value with the second operational value which is set in relation with the first operational value, correcting the second operational value so that it approximates the first operational value according to the compared result, calculating a compensating factor by a predetermined operational formula with the calculated first operational value and the corrected second operational value, and compensating the compensating factor by multiplying it by the detected flow.
摘要翻译： 一种处理具有使用铂等的温度依赖性电阻的热式流量传感器的信号的方法以及由氧化铝制成的保持部件，用于保持其流体流动改变时的响应延迟，其中当流体 通过预先设定根据流量变化而变化的流量相关值与显示保持部件的温度特性的第一操作值之间的关系的步骤，将流量维持在静止状态（即所谓的平衡状态） 流动以使流量相关值作为参数，根据预定关系检测流量时根据流量相关值计算第一操作值，将计算的第一操作值与设置在第二操作值中的第二操作值进行比较 与第一操作值的关系，校正第二操作值使其近似于第一操作 根据比较结果计算补偿因子，并通过计算的第一操作值和校正的第二操作值计算补偿因子，并通过将其与检测到的流相乘来补偿补偿因子。
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公开(公告)号：US5137001A
公开(公告)日：1992-08-11
申请号：US653911
申请日：1991-02-12
申请人： Nobutake Taniguchi
发明人： Nobutake Taniguchi
CPC分类号： F02D41/187
摘要： An engine control apparatus has an intake air quantity detector which detects an intake air quantity to an engine, a controller which controls the engine in response to the output of the intake air quantity detector a load detecting detector which detects a load to the engine, and a clip device the output of the intake air quantity detecting means at a second value when a first time has passed after the load of engine has reached a predetermined value or higher.
摘要翻译： 发动机控制装置具有检测发动机的进气量的进气量检测器，响应于进气量检测器的输出而控制发动机的控制器，负载检测检测器检测对发动机的负荷， 当在发动机的负荷已经达到预定值或更高之后第一次经过时，将进气量检测装置的输出设定为第二值。
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