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    Multilayer wiring board and manufacturing method thereof
    1.
    发明授权
    Multilayer wiring board and manufacturing method thereof 失效
    多层布线板及其制造方法

    公开(公告)号：US08591750B2

    公开(公告)日：2013-11-26

    申请号：US12659893

    申请日：2010-03-24

    申请人： Hiroyuki Uematsu ,  Kenichi Kawabata ,  Kenji Nagase

    发明人： Hiroyuki Uematsu ,  Kenichi Kawabata ,  Kenji Nagase

    IPC分类号： H01B13/00 ,  H05K1/11 ,  H05K1/14

    CPC分类号： H05K3/427 ,  H05K3/002 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0041 ,  H05K3/0044 ,  H05K3/061 ,  H05K3/064 ,  H05K3/382 ,  H05K3/389 ,  H05K3/421 ,  H05K3/4652 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0394 ,  H05K2203/025 ,  H05K2203/0353 ,  H05K2203/054 ,  H05K2203/0585 ,  H05K2203/0733

    摘要： Provided is a method for manufacturing a multilayer wiring board, whereby even if the multilayer wiring board suffers warping or irregularities, thin-film patterns with great uniformity that are to be used as a mask for forming a wiring layer can be obtained in a simple way. A primer-coated metal foil 20 composed of a primer resin layer 21 and a metal layer 22 is placed on a surface of a double-face CCL 10, which is prepared by applying metal layers 12 and 13 onto the surfaces of a support base 11, and the primer-coated metal foil 20 and the double-face CCL 10 are bonded and the primer resin layer 21 is cured. A via Vb is thereafter formed from the metal layer 22 side, and a metal-plate layer 30 is formed on the resulting metal layer 22. After that, the etched down metal-plate layer 30 and the metal layer 22 are patterned, and using the patterned layers as a mask, the primer resin layer 21 is patterned. Using the patterned primer resin layer 21 as a mask, the metal layer 12 of the double-face CCL 10 and the metal-plate layer 30 are patterned to form a wiring pattern.

    摘要翻译： 提供一种多层布线板的制造方法，即使多层布线板发生翘曲或不均匀，也可以以简单的方式获得用作形成布线层的掩模的具有均匀性的薄膜图案 。 将由底漆树脂层21和金属层22构成的底漆涂布金属箔20放置在双面CCL 10的表面上，该双面CCL 10通过将金属层12和13施加到支撑基底11的表面上而制备 并且底漆涂覆的金属箔20和双面CCL 10被粘合，底漆树脂层21固化。 之后，从金属层22侧形成通孔Vb，在所得到的金属层22上形成金属板层30.之后，对蚀刻后的金属板层30和金属层22进行图案化，使用 作为掩模的图案化层，对底漆树脂层21进行图案化。 使用图案化底漆树脂层21作为掩模，将双面CCL 10的金属层12和金属板层30图案化以形成布线图案。

    Method for manufacturing printed wiring board
    4.
    发明申请
    Method for manufacturing printed wiring board 审中-公开
    印刷电路板制造方法

    公开(公告)号：US20100065194A1

    公开(公告)日：2010-03-18

    申请号：US12461245

    申请日：2009-08-05

    申请人： Kenji Nagase ,  Hiroyuki Uematsu ,  Kenichi Kawabata

    发明人： Kenji Nagase ,  Hiroyuki Uematsu ,  Kenichi Kawabata

    IPC分类号： H05K3/06

    CPC分类号： H05K3/427 ,  H05K3/025 ,  H05K3/4007 ,  H05K3/421 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0554

    摘要： To provide a method for manufacturing a printed wiring board which can easily and surely form a fine wiring pattern having a small layer thickness while enhancing the productivity by simplifying a process, when forming a wiring structure having a filled via. The method for manufacturing a printed wiring board according to the present invention includes: bonding a metal foil 20 provided with a carrier foil having a carrier foil layer 22 and a metal foil layer 21 onto a resin substrate 11 (insulator) so that the metal foil layer 21 can contact one surface of the resin substrate 11; subsequently forming a via hole V (connection hole); filling the via with a film 32 formed by plating; then peeling the carrier foil layer 22 of the metal foil 20 provided with the carrier foil from the metal foil layer 21; and patterning the metal foil layer 21 which remains on the resin substrate 11 in a bonded state to form a wiring pattern 23.

    摘要翻译： 提供一种制造印刷电路板的方法，其可以容易且可靠地形成具有小层厚度的精细布线图案，同时通过简化工艺来提高生产率，当形成具有填充通孔的布线结构时。 根据本发明的制造印刷电路板的方法包括：将具有载体箔层22和金属箔层21的载体箔的金属箔20接合到树脂基板11（绝缘体）上，使得金属箔 层21可以接触树脂基板11的一个表面; 随后形成通孔V（连接孔）; 用通过电镀形成的膜32填充通孔; 然后从金属箔层21剥离设置有载体箔的金属箔20的载体箔层22; 并且在接合状态下图案化保留在树脂基板11上的金属箔层21，以形成布线图案23。

    Printed wiring board and manufacturing method therefor
    5.
    发明申请
    Printed wiring board and manufacturing method therefor 有权
    印刷电路板及其制造方法

    公开(公告)号：US20090211799A1

    公开(公告)日：2009-08-27

    申请号：US12379295

    申请日：2009-02-18

    申请人： Kenji Nagase ,  Hiroyuki Uematsu ,  Kenichi Kawabata

    发明人： Kenji Nagase ,  Hiroyuki Uematsu ,  Kenichi Kawabata

    IPC分类号： H05K1/11 ,  B44C1/22 ,  H05K3/42 ,  H01K3/10

    CPC分类号： H05K3/0035 ,  H05K1/115 ,  H05K3/0055 ,  H05K3/381 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K2203/0557 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： The present invention provides a printed wiring board which can prevent a plating failure in a connection hole such as a via to be formed in the printed wiring board, thereby can enhance the connection reliability and a manufacturing method therefor. The printed wiring board 100 includes a thermosetting resin sheet 16 (insulation layer) having a via hole 20 (through hole) constituted by inner wall parts having different taper angles from each other, a copper foil 17 (conductor layer) provided on the thermosetting resin sheet 16, and a wiring pattern 13 (wiring layer) which is provided so as to be exposed from the via hole 20 and is electrically connected with the copper foil 17 through the via hole 20.

    摘要翻译： 本发明提供一种能够防止在印刷电路板中形成的通孔等的连接孔中的电镀失败的印刷电路板，从而能够提高连接可靠性及其制造方法。 印刷布线板100包括具有由具有不同锥角的内壁部构成的通孔20（通孔）的热固性树脂片16（绝缘层），设置在热固性树脂上的铜箔17（导体层） 布线图案13（布线层），其设置成从通孔20露出，并通过通孔20与铜箔17电连接。

    Multilayer wiring board and manufacturing method thereof
    6.
    发明申请
    Multilayer wiring board and manufacturing method thereof 失效
    多层布线板及其制造方法

    公开(公告)号：US20100243601A1

    公开(公告)日：2010-09-30

    申请号：US12659893

    申请日：2010-03-24

    申请人： Hiroyuki Uematsu ,  Kenichi Kawabata ,  Kenji Nagase

    发明人： Hiroyuki Uematsu ,  Kenichi Kawabata ,  Kenji Nagase

    IPC分类号： C23F1/00 ,  H01B13/00

    CPC分类号： H05K3/427 ,  H05K3/002 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0041 ,  H05K3/0044 ,  H05K3/061 ,  H05K3/064 ,  H05K3/382 ,  H05K3/389 ,  H05K3/421 ,  H05K3/4652 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0394 ,  H05K2203/025 ,  H05K2203/0353 ,  H05K2203/054 ,  H05K2203/0585 ,  H05K2203/0733

    摘要： Provided is a method for manufacturing a multilayer wiring board, whereby even if the multilayer wiring board suffers warping or irregularities, thin-film patterns with great uniformity that are to be used as a mask for forming a wiring layer can be obtained in a simple way. A primer-coated metal foil 20 composed of a primer resin layer 21 and a metal layer 22 is placed on a surface of a double-face CCL 10, which is prepared by applying metal layers 12 and 13 onto the surfaces of a support base 11, and the primer-coated metal foil 20 and the double-face CCL 10 are bonded and the primer resin layer 21 is cured. A via Vb is thereafter formed from the metal layer 22 side, and a metal-plate layer 30 is formed on the resulting metal layer 22. After that, the etched down metal-plate layer 30 and the metal layer 22 are patterned, and using the patterned layers as a mask, the primer resin layer 21 is patterned. Using the patterned primer resin layer 21 as a mask, the metal layer 12 of the double-face CCL 10 and the metal-plate layer 30 are patterned to form a wiring pattern.

    摘要翻译： 提供一种多层布线板的制造方法，即使多层布线板发生翘曲或不均匀，也可以以简单的方式获得用作形成布线层的掩模的具有均匀性的薄膜图案 。 将由底漆树脂层21和金属层22构成的底漆涂布金属箔20放置在双面CCL 10的表面上，该双面CCL 10通过将金属层12和13施加到支撑基底11的表面上而制备 并且底漆涂覆的金属箔20和双面CCL 10被粘合，底漆树脂层21固化。 之后，从金属层22侧形成通孔Vb，在所得到的金属层22上形成金属板层30.之后，对蚀刻后的金属板层30和金属层22进行图案化，使用 作为掩模的图案化层，对底漆树脂层21进行图案化。 使用图案化底漆树脂层21作为掩模，将双面CCL 10的金属层12和金属板层30图案化以形成布线图案。

    Method for manufacturing magnetic metal powder, and magnetic metal powder
    9.
    发明授权
    Method for manufacturing magnetic metal powder, and magnetic metal powder 有权
    磁性金属粉末和磁性金属粉末的制造方法

    公开(公告)号：US07416795B2

    公开(公告)日：2008-08-26

    申请号：US10946984

    申请日：2004-09-22

    申请人： Minoru Takaya ,  Yoshiaki Akachi ,  Hisashi Kobuke ,  Hiroyuki Uematsu

    发明人： Minoru Takaya ,  Yoshiaki Akachi ,  Hisashi Kobuke ,  Hiroyuki Uematsu

    IPC分类号： H01F1/33

    CPC分类号： H01F1/24 ,  H01F1/06 ,  H01F1/20

    摘要： A method for manufacturing magnetic metal powder is provided. In the method, a powdered magnetic metal oxide is supplied to a heat treatment furnace with a carrier gas composed of a reducing gas. The heat treatment furnace is maintained at temperatures above a reducing action starting temperature for the powdered magnetic metal oxide and above a melting point of the magnetic metal in the powder. The powdered magnetic metal oxide is subject to a reducing process, and then magnetic metal particles, the resultant reduced product, is melted to form a melt. The melt is re-crystallized in a succeeding cooling step, to obtain single crystal magnetic metal power in substantially spherical form.

    摘要翻译： 提供一种制造磁性金属粉末的方法。 在该方法中，将粉末状的磁性金属氧化物供给到具有由还原气体构成的载气的热处理炉。 该热处理炉保持在高于粉末状磁性金属氧化物的还原作用开始温度以上且高于粉末中磁性金属的熔点的温度。 粉末状磁性金属氧化物经历还原过程，然后将所得还原产物的磁性金属颗粒熔化以形成熔体。 熔体在随后的冷却步骤中再结晶，以获得基本上为球形的单晶磁性金属功率。

    Data erasing apparatus
    10.
    发明申请
    Data erasing apparatus 失效
    数据擦除装置

    公开(公告)号：US20050041319A1

    公开(公告)日：2005-02-24

    申请号：US10780602

    申请日：2004-02-19

    申请人： Hiroshi Hasegawa ,  Hisato Suzuki ,  Kazutoshi Suzuki ,  Hiroyuki Uematsu ,  Takahiro Ono

    发明人： Hiroshi Hasegawa ,  Hisato Suzuki ,  Kazutoshi Suzuki ,  Hiroyuki Uematsu ,  Takahiro Ono

    IPC分类号： G11B5/024 ,  G11B23/50 ,  G11B25/04 ,  G11B5/03

    CPC分类号： G11B23/505 ,  G11B5/0245 ,  G11B25/043

    摘要： The invention enables a magnetic disk drive to be inserted and removed against an attraction force exerted by a magnetic force that is strong enough to erase data on a magnetic disk enclosed within a metal case. A converting mechanism comprising a ballscrew and a ballscrew nut bracket is provided that converts rotational motion of a handle into translational motion of an HDD holder; by rotating the handle, the HDD holder with the hard disk drive mounted thereon is moved in the inserting and removing directions by overcoming the attraction force being exerted by the magnetic field generated by means of a permanent magnet. An electric motor may be used to generate the rotational force.

    摘要翻译： 本发明使得能够克服由强力施加的吸引力来插入和移除磁盘驱动器，该磁力足以擦除封闭在金属外壳内的磁盘上的数据。 提供一种包括滚珠丝杠和滚珠丝杠螺母支架的转换机构，其将手柄的旋转运动转换成HDD支架的平移运动; 通过旋转手柄，安装有硬盘驱动器的HDD保持器通过克服由永久磁铁产生的磁场施加的吸引力而沿插入和移除方向移动。 可以使用电动机来产生旋转力。