摘要:
A laminate comprising at least two layers of a photosensitive resin layer and a polyimide precursor resin layer; a process for formation of an insulating protective layer using a laminate which comprises laminating a laminate comprising at least photosensitive resin layer and a polyimide precursor resin layer on an insulating board having an exposed circuit; selectively exposing the photosensitive resin layer to active light; developing the resultant photosensitive resin layer; removing the exposed polyimide precursor resin layer by etching it with an alkaline solution using the photosensitive resin layer as a mask; removing the photosensitive resin layer; and then curing the residual polyimide precusor resin layer; and a process for preparation of a printed circuit which comprises forming a polymide precursor resin layer on an insulating board having an exposed circuit, patterning the resin layer with an alkaline solution, and then curing it.The laminate of this invention can provide extremely easily an insulating protective layer for circuits having a high processing precision and excellent in reliability on insulation. Further, a printed circuit having a high processing precision and excellent in reliability on insulation can be provided extremely easily by the processes of this invention.
摘要:
This invention relates to laminates in which a layer of polyimide precursors and a layer of photosensitive resins are formed one on top of another on an electric conductor such as a stainless steel foil and also to laminates consisting of a stainless steel foil and successive layers of polyimide precursors and photosensitive resins useful for the manufacture of HDD suspensions. In particular, the use of resins containing a repeating unit derivable from specific aromatic diamines and aromatic carboxylic acid dianhydrides as polyimide precursors makes it possible to fabricate an insulator of high fabrication accuracy and reliability on an electric conductor and, in addition, the laminates are useful as materials for the manufacture of HDD suspensions of an integrated circuit/wiring structure with high accuracy.
摘要:
This invention relates to a process for machining resin film for a wiring board or double-sided carrier tape which comprises forming openings in the resin film by applying a continuous-wave carbon dioxide gas laser beam which is scanned in one or two ways to the resin film or a laminate containing a layer of the resin film placed on a worktable (5) moving in the direction nearly at a right angle to the scanning direction of the laser beam (7). As a continuous-wave carbon dioxide gas laser beam is used for drilling holes, the operation is highly efficient and accurate and gives rigid-flex wiring boards or double-sided carrier tapes of good quality in high yield.
摘要:
A die for extrusion molding includes an extrusion port configured to extrude a plastic composition, and a plastic flow channel configured to cause the supplied plastic composition to flow to the extrusion port. The plastic flow channel includes a supply flow channel, and an extrusion flow channel. The supply flow channel is configured to be supplied with the plastic composition. The extrusion flow channel has an upstream end coupled to the supply flow channel, and downstream end having the extrusion port. In the extrusion flow channel, a flow channel cross-sectional area perpendicular to the flow direction of the plastic composition in the extrusion flow channel gradually changes to the extrusion port, and an inner wall surface of a flow channel has a protruding surface protruding toward an inside of the flow channel in a cross section including an extrusion central axis and parallel to the extrusion central axis.
摘要:
A fixing device receives a recording material having a toner image and applies pressure and heat to fix the toner image. The fixing device includes a fixing member, a sliding member, a pressing member, and a heating member. The fixing member has a rotatable endless belt shape that includes an inner circumferential resin layer. The sliding member is pressed against the inner circumferential surface of the fixing member with a lubricant interposed between the sliding member and the inner circumferential surface. The sliding member has a resin coating layer and slides on the inner circumferential surface. The pressing member presses the recording material toward an outer circumferential surface of the fixing member. The heating member generates heat to heat the recording material. A surface hardness of the inner circumferential surface of the fixing member is smaller than a surface hardness of the sliding surface of the sliding member.
摘要:
A wick includes a porous body. The porous body includes a plurality of bubbles, a plurality of composite cells, and a plurality of communication holes. The plurality of bubbles has sizes in a range from 0.1 μm to 50 μm, both inclusive, in a cross section obtained when the porous body is cut. The plurality of composite cells is formed by spherical bubbles partially overlapping each other. Bubbles of pore sizes from 5 μm to 10 μm, both inclusive, are most present among the plurality of composite cells. The plurality of communication holes of 5 μm or smaller is between the plurality of bubbles.
摘要:
A disclosed loop heat pipe includes an evaporator configured to absorb heat from outside by a wall to evaporate a working fluid from a liquid phase gas phase; a condenser configured to condense a gas phase working fluid introduced from the evaporator into a liquid phase; an elastic wick configured to contact an inner wall of the evaporator by an elastic force from the elastic wick; and a wick deformation member configured to deform the elastic wick increase a contact pressure of the elastic wick against the inner wall of the evaporator.
摘要:
An LED unit includes: a plurality of LED modules each having an LED chip for generating ultraviolet ray provided in a package which has an opening formed on one surface and a lens formed to cover the opening of the package; a substrate-shaped base block where the LED modules are mounted in a first direction; and a heat radiation member where a plurality of the base blocks is provided in a second direction perpendicular to the first direction. The heat radiation member has a plurality of inclined surfaces where each of the base blocks is disposed. Further, one inclined surface and the other inclined surface of the heat radiation member are inclined to face each other in the second direction.
摘要:
A plating apparatus can perform a plating process on an entire surface of a substrate uniformly. A plating apparatus 20 includes a substrate holding/rotating device 110 configured to hold and rotate a substrate 2; a discharging device 21 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding/rotating device 110; and a controller 160 configured to control the substrate holding/rotating device 110 and the discharging device 21. Further, the discharging device 21 includes a first nozzle 40 having a multiple number of discharge openings 41 arranged in a radial direction of the substrate 2 or having a discharge opening 42 extended in the radial direction of the substrate 2; and a second nozzle 45 having a discharge opening 46 configured to be positioned closer to a central portion of the substrate 2 than the discharge opening of the first nozzle 40.
摘要:
An electroconductive resin belt having a flame resistance of VTM-0 in UL94 standard when having a thickness of from 50 to 150 μm includes a first resin selected from the group consisting of polyetherimide-siloxane block copolymer, polyphenylene sulfide and polyimide; a second resin selected from the group consisting of polyetherimide, polyether sulfone, polyester, aliphatic polyamide, polyetherimide-siloxane block copolymer and polyamideimide; carbon as a first conductant; and at least one second conductant selected from the group consisting of particulate Al-doped ZnO, particulate Ga-doped ZnO, particulate Sb-doped SnO2, particulate In-doped SnO2, particulate P-doped SnO2 and the group consisting of metal oxides coated with any one of the second conductant group. The first resin forms a continuous phase, the second resin forms a dispersion phase, the carbon is unevenly distributed in the dispersion phase or an arc therearound, the second conductant is present in both of the dispersion phase and the continuous phase.