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公开(公告)号：US09704819B1
公开(公告)日：2017-07-11
申请号：US15084442
申请日：2016-03-29
发明人： Ziyang Gao , Ya Lv
IPC分类号： H01L23/34 , H05K7/10 , H01L21/00 , H01L23/00 , H01L25/00 , H01L21/66 , H01L23/31 , H01L25/065 , H01L23/498
CPC分类号： H01L25/0657 , H01L21/563 , H01L22/20 , H01L23/3107 , H01L23/3735 , H01L23/4334 , H01L23/49833 , H01L23/5385 , H01L23/5386 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/072 , H01L25/105 , H01L2224/11334 , H01L2224/11849 , H01L2224/13013 , H01L2224/13082 , H01L2224/13083 , H01L2224/131 , H01L2224/13294 , H01L2224/133 , H01L2224/16227 , H01L2224/17181 , H01L2224/27334 , H01L2224/27849 , H01L2224/29082 , H01L2224/29083 , H01L2224/291 , H01L2224/2919 , H01L2224/29191 , H01L2224/29294 , H01L2224/293 , H01L2224/32227 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2224/81024 , H01L2224/8109 , H01L2224/81192 , H01L2224/83024 , H01L2224/8309 , H01L2224/83104 , H01L2224/83192 , H01L2224/92125 , H01L2224/92242 , H01L2924/014 , H01L2924/0665 , H01L2924/00014 , H01L2224/81
摘要： A power electronic package includes a first substrate, a second substrate oppositely disposed from the first substrate, one or more chips disposed between the substrates, and at least three spacers. The spacers control a height variation of the power electronic package and protect the chips and other electronics from experiencing excessive stress. The height of the spacers is determined based on a height of the chips, on a height of solder blocks that connect the chips to the top substrate, and on a height of solder blocks that connect the chips to the bottom substrate.
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公开(公告)号：US09713284B2
公开(公告)日：2017-07-18
申请号：US14799594
申请日：2015-07-15
发明人： Ziyang Gao , Ya Lv , Yat Kit Tsui
IPC分类号： H05K7/20 , F28F3/02 , H01L23/473
CPC分类号： H05K7/20218 , F28F3/022 , H01L23/3735 , H01L23/473 , H05K7/20254 , H05K7/2039 , H05K7/20409 , H05K7/20509 , H05K7/20927
摘要： The present invention discloses a fluid cooling assembly which facilitates turbulent flow inside the assembly so as to achieve better heat dissipating effect. The cooling assembly comprises an enclosed chamber with an inlet and an outlet for fluid to pass through; together with a heat spreader; a plurality of micropillars and a plurality of heat dissipating fins installed inside the assembly. When fluid flows through the chamber, these elements in combination are adapted to create an enhanced turbulent flow upon the fluid so as to effectively dissipate heat from said heat spreader through the fluid.
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公开(公告)号：US10014280B2
公开(公告)日：2018-07-03
申请号：US15619532
申请日：2017-06-11
发明人： Ziyang Gao , Xunqing Shi , Shi Wo Chow
IPC分类号： H01L23/34 , H05K7/10 , H01L21/00 , H01L25/065 , H01L21/56 , H01L21/48 , H01L23/31 , H01L23/498 , H01L25/00 , H01L23/00 , H01L25/10
CPC分类号： H01L25/0657 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/565 , H01L22/12 , H01L22/20 , H01L23/051 , H01L23/3107 , H01L23/3114 , H01L23/3735 , H01L23/49811 , H01L23/49822 , H01L23/5385 , H01L24/17 , H01L24/20 , H01L25/105 , H01L25/50 , H01L2225/06548 , H01L2225/06582 , H01L2225/06589 , H01L2225/1058 , H01L2225/1088 , H01L2225/1094
摘要： A power electronic package includes a first substrate, a second substrate oppositely disposed from the first substrate, one or more chips disposed between the substrates, and at least three spacers. The spacers control a height variation of the power electronic package and protect the chips and other electronics from experiencing excessive stress. The height of the spacers is determined based on a height of the chips, on a height of solder blocks that connect the chips to the top substrate, and on a height of solder blocks that connect the chips to the bottom substrate.
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