公开(公告)号：US20140077224A1

公开(公告)日：2014-03-20

申请号：US13616415

申请日：2012-09-14

Applicant: Zhen-Yu Li ,  Chung-Pao Lin ,  Hsing-Kuo Hsia ,  Hao-Chung Kuo ,  Cindy Huichun Shu ,  Hsin-Chieh Huang

Inventor： Zhen-Yu Li ,  Chung-Pao Lin ,  Hsing-Kuo Hsia ,  Hao-Chung Kuo ,  Cindy Huichun Shu ,  Hsin-Chieh Huang

IPC: H01L29/12 ,  H01L33/02 ,  H01L21/20 ,  H01L29/165

CPC classification number: H01L33/0075 ,  B82Y20/00 ,  H01L21/02035 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/268 ,  H01L21/30604 ,  H01L29/0657 ,  H01L29/2003 ,  H01L29/205 ,  H01L29/66462 ,  H01L33/0025 ,  H01L33/0066 ,  H01L33/12 ,  H01L33/20 ,  H01S5/0207 ,  H01S5/021 ,  H01S5/0218 ,  H01S5/34333

Abstract: The present disclosure involves an apparatus. The apparatus includes a substrate having a front side a back side opposite the front side. The substrate includes a plurality of openings formed from the back side of the substrate. The openings collectively define a pattern on the back side of the substrate from a planar view. In some embodiments, the substrate is a silicon substrate or a silicon carbide substrate. Portions of the silicon substrate vertically aligned with the openings have vertical dimensions that vary from about 100 microns to about 300 microns. A III-V group compound layer is formed over the front side of the silicon substrate. The III-V group compound layer is a component of one of: a light-emitting diode (LED), a laser diode (LD), and a high-electron mobility transistor (HEMT).

Abstract translation: 本公开涉及一种装置。 该装置包括具有前侧与前侧相对的后侧的基板。 基板包括从基板的背面形成的多个开口。 这些开口从平面图中共同地在基板的背面上限定图案。 在一些实施例中，衬底是硅衬底或碳化硅衬底。 与开口垂直对准的硅衬底的部分具有约100微米至约300微米的垂直尺寸。 在硅衬底的正面上形成III-V族化合物层。 III-V族化合物层是发光二极管（LED），激光二极管（LD）和高电子迁移率晶体管（HEMT）之一的组分。

公开(公告)号：US20110135102A1

公开(公告)日：2011-06-09

申请号：US12728578

申请日：2010-03-22

Applicant: Hsin-Chieh Huang ,  Wen-Kuo Lin ,  Chih-Wei Kao

Inventor： Hsin-Chieh Huang ,  Wen-Kuo Lin ,  Chih-Wei Kao

IPC: H04R29/00 ,  H04N7/18 ,  G01S3/80 ,  G06K9/00 ,  H04R3/00

CPC classification number: H04N7/142 ,  G01S3/8083 ,  G06T7/70 ,  G06T2207/10021 ,  G06T2207/10028 ,  H04R27/00

Abstract: A system for localizing an acoustic source is provided. This system includes a microphone apparatus, an audio processing apparatus, a photographing apparatus, and a decision apparatus. The microphone apparatus receives an acoustic signal and generates at least one received audio signal. The audio processing apparatus generates first location information based on the at least one received audio signal. The decision apparatus generates depth information based on at least one image captured by the photographing apparatus. According to the first location information, the at least one captured image, and the depth information, the decision apparatus determines a location corresponding to the source of the acoustic signal.

Abstract translation: 提供了用于定位声源的系统。 该系统包括麦克风装置，音频处理装置，拍摄装置和判定装置。 麦克风装置接收声信号并产生至少一个接收的音频信号。 音频处理装置基于至少一个所接收的音频信号产生第一位置信息。 决定装置基于由拍摄装置拍摄的至少一个图像来生成深度信息。 根据第一位置信息，至少一个拍摄图像和深度信息，判定装置确定对应于声信号源的位置。

公开(公告)号：US08786197B2

公开(公告)日：2014-07-22

申请号：US12912948

申请日：2010-10-27

Applicant: Hsin-Chieh Huang

Inventor： Hsin-Chieh Huang

IPC: H05B37/02

CPC classification number: H05B41/36 ,  G01J1/44 ,  H05B33/0851 ,  H05B37/0218 ,  Y02B20/46

Abstract: A system having a light guide adapted to collect light from a light source, a light detector attached to the light guide, a controller electrically connected to an output of the light detector, and a driver for driving the light source detachably connected to an output of the controller. The driver includes a memory that stores a calibration value for the light source.

Abstract translation: 一种具有适于收集来自光源的光的导光体的系统，安装在光导上的光检测器，与光检测器的输出电连接的控制器，以及用于驱动可拆卸地连接到光检测器的输出的光源的驱动器 控制器。 驱动器包括存储光源的校准值的存储器。

公开(公告)号：US08476918B2

公开(公告)日：2013-07-02

申请号：US12769231

申请日：2010-04-28

Applicant: Hsin-Chieh Huang

Inventor： Hsin-Chieh Huang

IPC: G01R31/20

CPC classification number: G01R31/2635 ,  G01R31/2889 ,  G01R31/311 ,  G09G3/006

Abstract: The present disclosure provides a semiconductor test system. The semiconductor test system includes a wafer stage to hold a wafer having a plurality of light emitting devices (LEDs); a probe test card operable to test each test field of the wafer; and a light detector integrated with the probe test card to collect light from a LED of the wafer.

Abstract translation: 本公开提供了一种半导体测试系统。 半导体测试系统包括用于保持具有多个发光器件（LED）的晶片的晶片台; 探针测试卡，用于测试晶片的每个测试场; 以及与探针测试卡集成的光检测器，用于收集来自晶片的LED的光。

公开(公告)号：US08447046B2

公开(公告)日：2013-05-21

申请号：US13005609

申请日：2011-01-13

Applicant: Hsin-Chieh Huang ,  Yi-Lung Chen

Inventor： Hsin-Chieh Huang ,  Yi-Lung Chen

IPC: H04B15/00

CPC classification number: H03F3/187 ,  H03F1/305 ,  H03F3/45475 ,  H04R3/007

Abstract: The present invention discloses a circuit with three-stage of power-on sequence used for suppressing the pop noise in audio system. It mainly comprises a first resistor (R1); a capacitor (Cout); a first switch (SW1); a second switch (SW2); a soft start device; a first feedback amplifier; and a second feedback amplifier. By using the three-stage of power-on sequence, the present invention can effectively suppress the pop noise when the audio driver is power on.

Abstract translation: 本发明公开了一种具有用于抑制音频系统中的流行噪声的三阶段上电序列的电路。 它主要包括第一电阻（R1）; 电容器（Cout）; 第一开关（SW1）; 第二开关（SW2）; 软起动装置; 第一反馈放大器; 和第二反馈放大器。 通过使用三级上电序列，本发明可以有效地抑制音频驱动器接通时的弹出噪声。

公开(公告)号：US20110220930A1

公开(公告)日：2011-09-15

申请号：US12720462

申请日：2010-03-09

Applicant: Hsin-Chieh Huang

Inventor： Hsin-Chieh Huang

IPC: H01L33/20 ,  H01L21/302

CPC classification number: H01L33/22 ,  H01L33/04 ,  H01L33/24

Abstract: A device includes a textured substrate having a trench extending from a top surface of the textured substrate into the textured substrate, wherein the trench comprises a sidewall and a bottom. A light-emitting device (LED) includes an active layer over the textured substrate. The active layer has a first portion parallel to the sidewall of the trench and a second portion parallel to the bottom of the trench.

Abstract translation: 一种器件包括纹理化衬底，其具有从纹理化衬底的顶表面延伸到纹理衬底中的沟槽，其中沟槽包括侧壁和底部。 发光器件（LED）包括纹理衬底上的有源层。 有源层具有平行于沟槽侧壁的第一部分和平行于沟槽底部的第二部分。

公开(公告)号：US20110198609A1

公开(公告)日：2011-08-18

申请号：US12704974

申请日：2010-02-12

Applicant: Hsin-Chieh Huang

Inventor： Hsin-Chieh Huang

IPC: H01L33/30 ,  H01L33/48 ,  H01L33/00 ,  H01L33/62

CPC classification number: H01L33/382 ,  H01L33/387 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/16

Abstract: Multiple through-substrate vias (TSVs) are used to make electrical connections for an LED formed over a substrate. A first TSV extends through the substrate from a back surface of the substrate to the front surface of the substrate and includes a first TSV conductor that electrically connects to a first cladding layer of the LED. A second TSV extends through the substrate and an active layer of the LED from the back surface of the substrate to a second cladding layer or an ITO layer. The second TSV includes an isolation layer that electrically isolates a second TSV conductor from the first cladding layer and the active layer. Additionally dummy TSVs may be formed to conduct heat away from the LED optionally through a package substrate.

Abstract translation: 多个贯通衬底通孔（TSV）用于为衬底上形成的LED形成电连接。 第一TSV从衬底的背表面延伸穿过衬底到衬底的前表面，并且包括电连接到LED的第一覆层的第一TSV导体。 第二TSV从衬底的背面延伸穿过衬底和LED的有源层到第二覆层或ITO层。 第二TSV包括隔离层，其将第二TSV导体与第一包层和有源层电隔离。 另外，可以形成虚拟TSV以将热量从LED中任选地通过封装衬底导出。

公开(公告)号：US5371046A

公开(公告)日：1994-12-06

申请号：US94705

申请日：1993-07-22

Applicant: Yung-Haw Liaw ,  Hsin-Chieh Huang ,  Pao-Ling Kuo

Inventor： Yung-Haw Liaw ,  Hsin-Chieh Huang ,  Pao-Ling Kuo

IPC: H01L21/00 ,  H01L21/3105 ,  H01L21/316 ,  H01L21/465

CPC classification number: H01L21/6715 ,  H01L21/31051 ,  H01L21/316

Abstract: A new method of planarizing an integrated circuit is described. A first coating of a silicate spin-on-glass material is applied to the surface of a patterned conductor layer to be planarized. The spin-on-glass material is applied under low relative humidity, filling the valleys of the irregular structure of the conductor layer. The first spin-on-glass layer is covered with a second coating of the spin-on-glass material also applied under low relative humidity. Then, both first and second spin-on-glass layers are cured. This method provides a uniform spin-on-glass dielectric layer upon which a second conductor layer may now be successfully applied.

Abstract translation: 描述了一种平面化集成电路的新方法。 将硅酸盐旋涂玻璃材料的第一涂层施加到待平坦化的图案化导体层的表面上。 旋转玻璃材料在低相对湿度下施加，填充导体层的不规则结构的谷部。 第一个旋涂玻璃层被也在低相对湿度下施加的旋涂玻璃材料的第二涂层覆盖。 然后，固化第一和第二旋涂玻璃层。 该方法提供了均匀的旋涂玻璃介电层，其上可以成功地施加第二导体层。

公开(公告)号：US09257942B2

公开(公告)日：2016-02-09

申请号：US13469085

申请日：2012-05-10

Applicant: Yi-Lung Chen ,  Hsin-Chieh Huang

Inventor： Yi-Lung Chen ,  Hsin-Chieh Huang

IPC: H03F99/00 ,  H03F1/30 ,  H03F3/187 ,  H03F3/21

CPC classification number: H03F1/305 ,  H03F3/187 ,  H03F3/211 ,  H03F2203/21109 ,  H03F2203/21175 ,  H03F2203/21196

Abstract: An audio amplifier apparatus for driving a loudspeaker is provided. The audio amplifier apparatus includes a soft charge unit, a first amplification module, and a second amplification module. The soft charge unit is coupled to the loudspeaker through an output terminal and supplies a driving current according to a first control signal to soft charge the loudspeaker, so as to gradually increase a voltage level on the output terminal. The first amplification module receives an audio signal according to the first control signal and amplifies the audio signal to output a first amplified signal for driving the loudspeaker. The second amplification module receives the audio signal according to a second control signal and amplifies the audio signal to output a second amplified signal for driving the loudspeaker. The soft charge unit generates the second control signal by comparing the voltage level on the output terminal with a predetermined voltage level.

Abstract translation: 提供一种用于驱动扬声器的音频放大器装置。 音频放大器装置包括软充电单元，第一放大模块和第二放大模块。 软充电单元通过输出端子耦合到扬声器，并且根据第一控制信号提供驱动电流以对扬声器进行软充电，以便逐渐增加输出端子上的电压电平。 第一放大模块根据第一控制信号接收音频信号，并放大音频信号以输出用于驱动扬声器的第一放大信号。 第二放大模块根据第二控制信号接收音频信号，并放大音频信号以输出用于驱动扬声器的第二放大信号。 软充电单元通过将输出端子上的电压电平与预定电压电平进行比较来产生第二控制信号。

公开(公告)号：US08523407B2

公开(公告)日：2013-09-03

申请号：US13231911

申请日：2011-09-13

Applicant: Hsin-Chieh Huang ,  Chia-Song Yen ,  Shun-Wen Teng

Inventor： Hsin-Chieh Huang ,  Chia-Song Yen ,  Shun-Wen Teng

IPC: F21V5/00 ,  F21V5/04 ,  F21V8/00

CPC classification number: F21K9/61 ,  F21K9/232 ,  F21V3/00 ,  F21V29/85 ,  F21Y2115/10

Abstract: An optical element is assembled to a light emitting diode (LED) to form an illuminative light source. The optical element includes a transparent main body having a light guiding pillar and an extending part. The light guiding pillar has a top surface and a bottom surface having a recess. The extending part is extended from the circumference of the top surface and an end of the extending part has at least a light-emitting surface. Wherein the LED is disposed on the recess and emits light to the optical element. The extending part guides the light and enlarges the light-emitting angle.

Abstract translation: 将光学元件组装到发光二极管（LED）以形成照明光源。 光学元件包括具有导光柱和延伸部的透明主体。 导光柱具有顶表面和具有凹部的底表面。 延伸部分从顶表面的圆周延伸，并且延伸部分的端部至少具有发光表面。 其中LED设置在凹部上并向光学元件发射光。 延伸部分引导光并扩大发光角度。