公开(公告)号：US20120270381A1

公开(公告)日：2012-10-25

申请号：US13502018

申请日：2009-10-16

申请人： Hyo Sook Joo ,  Suk Ky Chang ,  Hyo Soon Park ,  Yong Su Park ,  Jong Wan Hong ,  Hyun Ju Cho ,  Jang Soon Kim

发明人： Hyo Sook Joo ,  Suk Ky Chang ,  Hyo Soon Park ,  Yong Su Park ,  Jong Wan Hong ,  Hyun Ju Cho ,  Jang Soon Kim

IPC分类号： C09J7/02 ,  B32B7/02 ,  H01L21/78

CPC分类号： H01L24/83 ,  C08G2650/40 ,  C08L71/00 ,  C08L79/08 ,  C08L81/06 ,  C09J7/20 ,  C09J163/00 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/85 ,  H01L2221/68327 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/451 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/0106 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/181 ,  Y10T428/24959 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/48 ,  H01L2224/45099

摘要： Provided are a die attach film, a semiconductor wafer, and a semiconductor packaging method. The die attach film can prevent generation of burrs or scattering of chips in a dicing process, and exhibits excellent expandability and pick-up characteristics in a die pressure-sensitive adhesive process. Further, the die attach film can prevent release, shifting, or deflection of a chip in a wire pressure-sensitive adhesive or molding process. Thus, it is possible to improve embeddability, inhibit warpage of a wafer or wiring substrate, and enhance productivity in a semiconductor packaging process.

摘要翻译： 提供了芯片附着膜，半导体晶片和半导体封装方法。 芯片附着膜可以防止在切割工艺中产生毛刺或碎片的散射，并且在模具压敏粘合剂工艺中显示出优异的可扩展性和拾取特性。 此外，芯片附着膜可以防止芯线在线压敏粘合剂或模制过程中的释放，移动或偏转。 因此，可以提高嵌入性，抑制晶片或布线基板的翘曲，提高半导体封装工序的生产率。

公开(公告)号：US09659763B2

公开(公告)日：2017-05-23

申请号：US12989353

申请日：2009-04-24

申请人： Hyun Jee Yoo ,  Dong Han Kho ,  Jang Soon Kim ,  Hyo Soon Park ,  Jong Wan Hong ,  Hyo Sook Joo

发明人： Hyun Jee Yoo ,  Dong Han Kho ,  Jang Soon Kim ,  Hyo Soon Park ,  Jong Wan Hong ,  Hyo Sook Joo

IPC分类号： C09J163/00 ,  C09J7/02 ,  C09J5/06 ,  C08L33/00 ,  C08L61/06 ,  C08L61/12 ,  C08L61/20 ,  C08L63/00 ,  H01L21/02 ,  C08G59/62 ,  H01L21/683 ,  C08L33/06

CPC分类号： H01L21/02002 ,  C08G59/621 ,  C08K5/13 ,  C08L33/066 ,  C08L33/068 ,  C08L61/06 ,  C08L61/12 ,  C08L61/20 ,  C08L63/00 ,  C08L2666/02 ,  C09J5/06 ,  C09J7/20 ,  C09J133/066 ,  C09J133/068 ,  C09J163/00 ,  C09J2201/36 ,  C09J2201/60 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6836 ,  Y10T428/269 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31515

摘要： Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

公开(公告)号：US20100291739A1

公开(公告)日：2010-11-18

申请号：US12681572

申请日：2008-10-15

申请人： Jong Wan Hong ,  Jang Soon Kim ,  Hyo Soon Park ,  Hyun Jee Yoo ,  Dong Han Kho ,  Hyo Sook Joo

发明人： Jong Wan Hong ,  Jang Soon Kim ,  Hyo Soon Park ,  Hyun Jee Yoo ,  Dong Han Kho ,  Hyo Sook Joo

IPC分类号： H01L21/60 ,  H01L21/78 ,  H01L21/56 ,  B32B5/04

CPC分类号： C09J163/00 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2924/1434 ,  H01L2924/37001 ,  Y10T428/24

摘要： The present invention relates to a dicing die bonding film, which is able to maintain good workability and reliability in any semiconductor packaging process, such as adhesive property, gap filling property and pick-up property, while controlling burr incidence in a dicing process and thus contamination of die, and a dicing method. Specifically, the present invention is characterized by optimizing tensile characteristics of the dicing die bonding film, or carrying out the dicing on the parts of the die bonding film in the dicing process and separating it through an expanding process. Therefore, the present invention may regulate physical properties of films so as to have the maximized adhesive property, pick-up property and gap filling property without any specific restriction, while controlling burr incidence in the dicing process and contamination of die. As a result, workability and reliability in a packaging process may be excellently maintained.

摘要翻译： 本发明涉及一种切割模片接合薄膜，其能够在任何半导体封装工艺中保持良好的可加工性和可靠性，例如粘合性能，间隙填充性能和拾取性能，同时控制切割工艺中的毛刺发生率 模具污染和切割方法。 具体地说，本发明的特征在于优化切割芯片接合薄膜的拉伸特性，或者在切割工艺中对芯片接合薄膜的部分进行切割，并通过扩展工艺进行分离。 因此，本发明可以调节膜的物理性能，从而具有最大化的粘合性，吸收性和间隙填充性，而不受任何限制，同时控制切割过程中的毛刺发生率和模具的污染。 因此，可以极好地保持包装过程中的可操作性和可靠性。

公开(公告)号：US20100289158A1

公开(公告)日：2010-11-18

申请号：US12738560

申请日：2008-10-24

申请人： Jong Wan Hong ,  Jang Soon Kim ,  Hyo Soon Park ,  Hyun Jee Yoo ,  Dong Han Kho ,  Hyo Sook Joo

发明人： Jong Wan Hong ,  Jang Soon Kim ,  Hyo Soon Park ,  Hyun Jee Yoo ,  Dong Han Kho ,  Hyo Sook Joo

IPC分类号： H01L23/52 ,  B32B5/00 ,  B32B5/16

CPC分类号： H01L24/29 ,  C08L33/068 ,  C08L2666/04 ,  C09J7/35 ,  C09J133/02 ,  C09J133/14 ,  C09J163/00 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83885 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T428/25 ,  Y10T428/269 ,  Y10T428/2874 ,  Y10T428/31515 ,  H01L2924/00

摘要： The present invention relates to an adhesive film, a dicing die bonding film and a semiconductor device. More specifically, the adhesive film of the present invention is characterized by comprising a base film and an adhesive layer and having a yield strength of 20 to 50 gf and a slope of tensile elastic region of 30 to 80 gf/mm at a thickness of 5 to 50 μm. In the present adhesive film, the yield strength and the slope of tensile elastic region are controlled so that the incidence of burrs may be predicted and controlled depending on thickness of an adhesive layer. The dicing die bonding film, and the semiconductor device comprising the same have lower incidence of burrs and an excellent workability and reliability.

摘要翻译： 粘合膜技术领域本发明涉及一种粘合膜，切割芯片接合膜和半导体器件。 更具体地说，本发明的粘合膜的特征在于，包括基膜和粘合剂层，其屈服强度为20〜50gf，拉伸弹性区域的斜率为30〜80gf / mm，厚度为5 至50μm。 在本粘合膜中，控制屈服强度和拉伸弹性区域的斜率，使得可以根据粘合剂层的厚度来预测和控制毛刺的发生。 切割芯片接合薄膜及其半导体装置具有较低的毛刺发生率和良好的可加工性和可靠性。

公开(公告)号：US08541289B2

公开(公告)日：2013-09-24

申请号：US12681572

申请日：2008-10-15

申请人： Jong Wan Hong ,  Jang Soon Kim ,  Hyo Soon Park ,  Hyun Jee Yoo ,  Dong Han Kho ,  Hyo Sook Joo

发明人： Jong Wan Hong ,  Jang Soon Kim ,  Hyo Soon Park ,  Hyun Jee Yoo ,  Dong Han Kho ,  Hyo Sook Joo

IPC分类号： H01L21/00

CPC分类号： C09J163/00 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2924/1434 ,  H01L2924/37001 ,  Y10T428/24

摘要： The present invention relates to a dicing die bonding film, which is able to maintain good workability and reliability in any semiconductor packaging process, such as adhesive property, gap filling property and pick-up property, while controlling burr incidence in a dicing process and thus contamination of die, and a dicing method. Specifically, the present invention is characterized by optimizing tensile characteristics of the dicing die bonding film, or carrying out the dicing on the parts of the die bonding film in the dicing process and separating it through an expanding process. Therefore, the present invention may regulate physical properties of films so as to have the maximized adhesive property, pick-up property and gap filling property without any specific restriction, while controlling burr incidence in the dicing process and contamination of die. As a result, workability and reliability in a packaging process may be excellently maintained.

摘要翻译： 本发明涉及一种切割模片接合薄膜，其能够在任何半导体封装工艺中保持良好的可加工性和可靠性，例如粘合性能，间隙填充性能和拾取性能，同时控制切割工艺中的毛刺发生率，因此 模具污染和切割方法。 具体地说，本发明的特征在于优化切割芯片接合薄膜的拉伸特性，或者在切割工艺中对芯片接合薄膜的部分进行切割，并通过扩展工艺进行分离。 因此，本发明可以调节膜的物理性能，从而具有最大化的粘合性，吸收性和间隙填充性，而不受任何限制，同时控制切割过程中的毛刺发生率和模具的污染。 因此，可以极好地保持包装过程中的可操作性和可靠性。

公开(公告)号：US08207616B2

公开(公告)日：2012-06-26

申请号：US12738560

申请日：2008-10-24

申请人： Jong Wan Hong ,  Jang Soon Kim ,  Hyo Soon Park ,  Hyun Jee Yoo ,  Dong Han Kho ,  Hyo Sook Joo

发明人： Jong Wan Hong ,  Jang Soon Kim ,  Hyo Soon Park ,  Hyun Jee Yoo ,  Dong Han Kho ,  Hyo Sook Joo

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L24/29 ,  C08L33/068 ,  C08L2666/04 ,  C09J7/35 ,  C09J133/02 ,  C09J133/14 ,  C09J163/00 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83885 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T428/25 ,  Y10T428/269 ,  Y10T428/2874 ,  Y10T428/31515 ,  H01L2924/00

摘要： The present invention relates to an adhesive film, a dicing die bonding film and a semiconductor device. More specifically, the adhesive film of the present invention is characterized by comprising a base film and an adhesive layer and having a yield strength of 20 to 50 gf and a slope of tensile elastic region of 30 to 80 gf/mm at a thickness of 5 to 50 μm. In the present adhesive film, the yield strength and the slope of tensile elastic region are controlled so that the incidence of burrs may be predicted and controlled depending on thickness of an adhesive layer. The dicing die bonding film, and the semiconductor device comprising the same have lower incidence of burrs and an excellent workability and reliability.

摘要翻译： 粘合膜技术领域本发明涉及一种粘合膜，切割芯片接合膜和半导体器件。 更具体地说，本发明的粘合膜的特征在于，包括基膜和粘合剂层，其屈服强度为20〜50gf，拉伸弹性区域的斜率为30〜80gf / mm，厚度为5 至50μm。 在本粘合膜中，控制屈服强度和拉伸弹性区域的斜率，使得可以根据粘合剂层的厚度来预测和控制毛刺的发生。 切割芯片接合薄膜及其半导体装置具有较低的毛刺发生率和良好的可加工性和可靠性。

公开(公告)号：US20110111218A1

公开(公告)日：2011-05-12

申请号：US12989353

申请日：2009-04-24

申请人： Hyun Jee Yoo ,  Dong Han Kho ,  Jang Soon Kim ,  Hyo Soon Park ,  Jong Wan Hong ,  Hyo Sook Joo

发明人： Hyun Jee Yoo ,  Dong Han Kho ,  Jang Soon Kim ,  Hyo Soon Park ,  Jong Wan Hong ,  Hyo Sook Joo

IPC分类号： B32B7/12 ,  B32B27/38 ,  C08L63/00

CPC分类号： H01L21/02002 ,  C08G59/621 ,  C08K5/13 ,  C08L33/066 ,  C08L33/068 ,  C08L61/06 ,  C08L61/12 ,  C08L61/20 ,  C08L63/00 ,  C08L2666/02 ,  C09J5/06 ,  C09J7/20 ,  C09J133/066 ,  C09J133/068 ,  C09J163/00 ,  C09J2201/36 ,  C09J2201/60 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6836 ,  Y10T428/269 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31515

摘要： Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of buns during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

摘要翻译： 提供环氧组合物，粘合剂膜，切割芯片接合膜和使用其的半导体器件。 具体地，提供环氧组合物及其用途，其中环氧组合物在一定条件下测定的凝胶含量为5〜20％。 根据本发明的环氧组合物作为粘合剂，当制备成具有低的玻璃化转变温度，在高温下表现出良好的粘附性并且在加工期间具有最小的小圆面包的情况下，显示出优异的弹性。 因此，根据本发明，能够防止在高温下的引线接合或模压加工中由于模切移位引起的缺陷，并且由于粘合剂的粘合性和加工性优异，因此获得了高可靠性的半导体器件。

公开(公告)号：US09695345B2

公开(公告)日：2017-07-04

申请号：US12741011

申请日：2008-10-28

申请人： Hyun Jee Yoo ,  Jang Soon Kim ,  Jong Wan Hong ,  Hyo Soon Park ,  Dong Han Kho

发明人： Hyun Jee Yoo ,  Jang Soon Kim ,  Jong Wan Hong ,  Hyo Soon Park ,  Dong Han Kho

IPC分类号： C09J163/00 ,  C09J133/08 ,  C09J7/02 ,  C08K5/13 ,  C08K5/3442 ,  C08K3/36 ,  C09J133/06 ,  C08K5/3445 ,  C08K5/00 ,  C08G59/62 ,  H01L21/683 ,  H01L23/00

CPC分类号： C09J163/00 ,  C08G59/621 ,  C08K3/36 ,  C08K5/0025 ,  C08K5/13 ,  C08K5/3445 ,  C09J7/35 ,  C09J7/385 ,  C09J133/068 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0615 ,  H01L2924/351 ,  H01L2924/3511 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31515 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/06 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention relates to a dicing die bonding film employed in a semiconductor packaging process, and a semiconductor device using the same. The dicing die bonding film is configured such that a ratio X/Y of adhesive power X between the wafer and the adhesive layer of the die bonding portion to tacky power Y between the die bonding portion and the tacky layer of the dicing portion is 0.15 to 1, and the adhesive layer of the die bonding portion has a storage modulus of 100 to 1000 MPa at a normal temperature. The dicing die bonding film according to the present invention reduces burr generation in dicing process, and thereby preparing a semiconductor device having excellent reliability without inferiority caused by bad connection reliability due to the burr covering a bonding pad.

公开(公告)号：US20110037180A1

公开(公告)日：2011-02-17

申请号：US12741011

申请日：2008-10-28

申请人： Hyun Jee Yoo ,  Jang Soon Kim ,  Jong Wan Hong ,  Hyo Soon Park ,  Dong Han Kho

发明人： Hyun Jee Yoo ,  Jang Soon Kim ,  Jong Wan Hong ,  Hyo Soon Park ,  Dong Han Kho

IPC分类号： H01L23/12 ,  B32B27/38

CPC分类号： C09J163/00 ,  C08G59/621 ,  C08K3/36 ,  C08K5/0025 ,  C08K5/13 ,  C08K5/3445 ,  C09J7/35 ,  C09J7/385 ,  C09J133/068 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0615 ,  H01L2924/351 ,  H01L2924/3511 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31515 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/06 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention relates to a dicing die bonding film employed in a semiconductor packaging process, and a semiconductor device using the same. The dicing die bonding film is configured such that a ratio X/Y of adhesive power X between the wafer and the adhesive layer of the die bonding portion to tacky power Y between the die bonding portion and the tacky layer of the dicing portion is 0.15 to 1, and the adhesive layer of the die bonding portion has a storage modulus of 100 to 1000 MPa at a normal temperature. The dicing die bonding film according to the present invention reduces burr generation in dicing process, and thereby preparing a semiconductor device having excellent reliability without inferiority caused by bad connection reliability due to the burr covering a bonding pad.

摘要翻译： 本发明涉及半导体封装工序中使用的切割芯片接合薄膜以及使用其的半导体装置。 切割芯片接合膜被配置为使得晶片和芯片接合部分的粘合剂层之间的粘合力X与切割部分的粘合部分和粘性层之间的粘合力Y之间的粘合力X的比X / Y为0.15至 1，芯片接合部的粘合层在常温下的储能模量为100〜1000MPa。 根据本发明的切割芯片接合膜减少了切割工艺中的毛刺产生，从而制备了由于毛刺覆盖焊盘而导致的由于连接可靠性不良而导致的无劣异性的优异的可靠性的半导体器件。

公开(公告)号：US20110091676A1

公开(公告)日：2011-04-21

申请号：US12988774

申请日：2009-04-21

申请人： Se Ra Kim ,  Yoon Jeon Baek ,  Jan Soon Kim ,  Hyun Hee Son ,  Jong Wan Hong ,  Hyun Woo Park

发明人： Se Ra Kim ,  Yoon Jeon Baek ,  Jan Soon Kim ,  Hyun Hee Son ,  Jong Wan Hong ,  Hyun Woo Park

IPC分类号： C09J7/02 ,  B24B1/00 ,  B32B5/00 ,  C09J133/08 ,  C09J133/10 ,  B32B33/00

CPC分类号： H01L21/6836 ,  C09J7/22 ,  C09J2203/326 ,  C09J2423/006 ,  C09J2427/006 ,  C09J2433/00 ,  C09J2467/006 ,  C09J2475/006 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/68386 ,  Y10T428/1476 ,  Y10T428/264 ,  Y10T428/266 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/2887 ,  Y10T428/2891

摘要： The present invention relates to a pressure-sensitive adhesive film and a semiconductor wafer backgrinding method using the same. The present invention provides a pressure-sensitive adhesive film capable of remarkably improving production efficiency in a wafer backgrinding of a semiconductor manufacturing process due to its superior cutting and adherence properties in the semiconductor manufacturing process and an excellent cushioning property. Moreover, the present invention also provides a pressure-sensitive adhesive film having superior peeling and re-peeling properties and wettability to the wafer while providing excellent water resistance, and a backgrinding method using the pressure-sensitive adhesive film.

摘要翻译： 本发明涉及一种压敏粘合剂膜和使用其的半导体晶片背景研磨方法。 本发明提供一种能够显着提高半导体制造工序的晶片背面研磨的生产效率的压敏粘合膜，这是由于其在半导体制造工艺中具有优异的切割和粘合性能以及优异的缓冲性能。 此外，本发明还提供了具有优异的剥离和再剥离性能以及对晶片的润湿性同时提供优异的耐水性的压敏粘合剂膜，以及使用该压敏粘合剂膜的背面研磨方法。