公开(公告)号：US08592973B2

公开(公告)日：2013-11-26

申请号：US12580933

申请日：2009-10-16

申请人： HyungSang Park ,  DeokKyung Yang ,  DaeSik Choi

发明人： HyungSang Park ,  DeokKyung Yang ,  DaeSik Choi

IPC分类号： H01L23/34

CPC分类号： H01L23/49816 ,  H01L21/568 ,  H01L22/14 ,  H01L22/20 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83005 ,  H01L2224/85005 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A method of manufacture of an integrated circuit packaging system including: forming a top package including: providing a through silicon via interposer having a through silicon via; coupling a stacked integrated circuit die to the through silicon via, and testing a top package; forming a base package including: providing a substrate, coupling a base integrated circuit die to the substrate, and testing a base package; and coupling a stacked interconnect between the top package and the base package.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成顶部封装，其包括：通过具有通过硅通孔的插入件提供通过硅的通孔; 将堆叠的集成电路管芯耦合到贯穿硅通孔，并测试顶部封装; 形成基本封装，包括：提供基板，将基底集成电路管芯耦合到所述基板，以及测试基底封装; 以及耦合顶部封装和基底封装之间的堆叠互连。

公开(公告)号：US20110089552A1

公开(公告)日：2011-04-21

申请号：US12580933

申请日：2009-10-16

申请人： HyungSang Park ,  DeokKyung Yang ,  DaeSik Choi

发明人： HyungSang Park ,  DeokKyung Yang ,  DaeSik Choi

IPC分类号： H01L25/065 ,  H01L21/50

CPC分类号： H01L23/49816 ,  H01L21/568 ,  H01L22/14 ,  H01L22/20 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83005 ,  H01L2224/85005 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A method of manufacture of an integrated circuit packaging system including: forming a top package including: providing a through silicon via interposer having a through silicon via; coupling a stacked integrated circuit die to the through silicon via, and testing a top package; forming a base package including: providing a substrate, coupling a base integrated circuit die to the substrate, and testing a base package; and coupling a stacked interconnect between the top package and the base package.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成顶部封装，其包括：通过具有通过硅通孔的插入件提供通过硅的通孔; 将堆叠的集成电路管芯耦合到贯穿硅通孔，并测试顶部封装; 形成基本封装，包括：提供基板，将基底集成电路管芯耦合到所述基板，以及测试基底封装; 以及耦合顶部封装和基底封装之间的堆叠互连。

公开(公告)号：US08102666B2

公开(公告)日：2012-01-24

申请号：US12194506

申请日：2008-08-19

申请人： HyungSang Park ,  In Sang Yoon ,  DeokKyung Yang ,  Soo-San Park

发明人： HyungSang Park ,  In Sang Yoon ,  DeokKyung Yang ,  Soo-San Park

IPC分类号： H01L23/02

CPC分类号： H01L23/4334 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: connecting a carrier and an integrated circuit mounted thereover; mounting an interposer, having an opening, over the integrated circuit; connecting an interconnect between the interposer and the carrier through the opening; and forming an encapsulation planar with a carrier vertical side of the carrier and an interposer vertical side of the interposer.

摘要翻译： 集成电路封装系统包括：连接载体和安装在其上的集成电路; 在集成电路上安装具有开口的插入器; 通过开口连接插入器和载体之间的互连; 并且形成与载体的载体垂直侧和插入器的插入器垂直侧的平坦的封装。

公开(公告)号：US20110062591A1

公开(公告)日：2011-03-17

申请号：US12949835

申请日：2010-11-19

申请人： A Leam Choi ,  Jae Han Chung ,  DeokKyung Yang ,  HyungSang Park

发明人： A Leam Choi ,  Jae Han Chung ,  DeokKyung Yang ,  HyungSang Park

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/49816 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49833 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a through silicon via die having an interconnect through a silicon substrate; depositing a re-distribution layer on the through silicon via die and connected to the interconnects; mounting a structure over the through silicon via die; connecting the structure to the interconnect of the through silicon via die with a direct interconnect; and encapsulating the through silicon via die and partially encapsulating the structure with an encapsulation.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有通过硅衬底的互连的通孔芯片; 通过管芯沉积在穿硅上的再分布层并连接到互连; 通过模具将结构安装在贯穿硅上; 通过芯片将直接互连的结构连接到通孔的互连件; 并通过管芯封装穿硅，并用封装部分地封装结构。

公开(公告)号：US07859099B2

公开(公告)日：2010-12-28

申请号：US12333297

申请日：2008-12-11

申请人： A Leam Choi ,  Jae Han Chung ,  DeokKyung Yang ,  HyungSang Park

发明人： A Leam Choi ,  Jae Han Chung ,  DeokKyung Yang ,  HyungSang Park

IPC分类号： H01L23/04

CPC分类号： H01L23/49816 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49833 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a through silicon via die having an interconnect through a silicon substrate; depositing a re-distribution layer on the through silicon via die and connected to the interconnects; mounting a structure over the through silicon via die; connecting the structure to the interconnect of the through silicon via die with a direct interconnect; and encapsulating the through silicon via die and partially encapsulating the structure with an encapsulation.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有通过硅衬底的互连的通孔芯片; 通过管芯沉积在穿硅上的再分布层并连接到互连; 通过模具将结构安装在贯穿硅上; 通过芯片将直接互连的结构连接到通孔的互连件; 并通过管芯封装穿硅，并用封装部分地封装结构。

公开(公告)号：US20100148354A1

公开(公告)日：2010-06-17

申请号：US12333297

申请日：2008-12-11

申请人： A Leam Choi ,  Jae Han Chung ,  DeokKyung Yang ,  HyungSang Park

发明人： A Leam Choi ,  Jae Han Chung ,  DeokKyung Yang ,  HyungSang Park

IPC分类号： H01L23/31 ,  H01L21/62

CPC分类号： H01L23/49816 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49833 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a through silicon via die having an interconnect through a silicon substrate; depositing a re-distribution layer on the through silicon via die and connected to the interconnects; mounting a structure over the through silicon via die; connecting the structure to the interconnect of the through silicon via die with a direct interconnect; and encapsulating the through silicon via die and partially encapsulating the structure with an encapsulation.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有通过硅衬底的互连的通孔芯片; 通过管芯沉积在穿硅上的再分布层并连接到互连; 通过模具将结构安装在贯穿硅上; 通过芯片将直接互连的结构连接到通孔的互连件; 并通过管芯封装穿硅，并用封装部分地封装结构。

公开(公告)号：US20100046183A1

公开(公告)日：2010-02-25

申请号：US12194506

申请日：2008-08-19

申请人： HyungSang Park ,  In Sang Yoon ,  DeokKyung Yang ,  Soo-San Park

发明人： HyungSang Park ,  In Sang Yoon ,  DeokKyung Yang ,  Soo-San Park

IPC分类号： H05K7/10 ,  H01L21/00

CPC分类号： H01L23/4334 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: connecting a carrier and an integrated circuit mounted thereover; mounting an interposer, having an opening, over the integrated circuit; connecting an interconnect between the interposer and the carrier through the opening; and forming an encapsulation planar with a carrier vertical side of the carrier and an interposer vertical side of the interposer.

摘要翻译： 集成电路封装系统包括：连接载体和安装在其上的集成电路; 在集成电路上安装具有开口的插入器; 通过开口连接插入器和载体之间的互连; 并且形成与载体的载体垂直侧和插入器的插入器垂直侧的平坦的封装。

公开(公告)号：US20100123232A1

公开(公告)日：2010-05-20

申请号：US12273540

申请日：2008-11-18

申请人： DaeSik Choi ,  DeokKyung Yang ,  Jong-Woo Ha ,  Byoung Wook Jang ,  JaeSick Bae ,  Seung Won Kim

发明人： DaeSik Choi ,  DeokKyung Yang ,  Jong-Woo Ha ,  Byoung Wook Jang ,  JaeSick Bae ,  Seung Won Kim

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L24/73 ,  H01L23/3128 ,  H01L24/28 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing an internal structure substrate having an internal structure substrate cavity; mounting an internal structure die above the internal structure substrate; encapsulating the internal structure die with an internal structure encapsulation to form an internal structure package; forming an internal structure protrusion in the internal structure encapsulation below the internal structure substrate cavity; mounting the internal structure package above a substrate; and encapsulating the internal structure package above the substrate with an encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有内部结构基板空腔的内部结构基板; 在内部结构基板上安装内部结构模具; 用内部结构封装封装内部结构管芯以形成内部结构封装; 在所述内部结构衬底腔内形成内部结构的内部结构包封; 将内部结构封装安装在基板上方; 并用封装将衬底上的内部结构封装封装。

公开(公告)号：US20100044878A1

公开(公告)日：2010-02-25

申请号：US12197209

申请日：2008-08-22

申请人： Jong-Woo Ha ,  DaeSik Choi ,  DeokKyung Yang

发明人： Jong-Woo Ha ,  DaeSik Choi ,  DeokKyung Yang

IPC分类号： H01L23/538 ,  H01L21/56

CPC分类号： H01L23/49811 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes providing a carrier having a first side and a second side; mounting an integrated circuit over the carrier with the first side facing the integrated circuit; attaching an external interconnect to the second side; and forming an encapsulation over the integrated circuit and around the external interconnect with the external interconnect exposed from the encapsulation and with the encapsulation and the second side forming a cavity.

摘要翻译： 集成电路封装系统包括提供具有第一侧和第二侧的载体; 将集成电路安装在载体上，第一面朝向集成电路; 将外部互连件连接到第二侧; 以及在所述集成电路上并围绕所述外部互连形成封装，所述外部互连与所述封装暴露的所述外部互连以及所述封装并且所述第二侧形成空腔。

公开(公告)号：US08093100B2

公开(公告)日：2012-01-10

申请号：US12949835

申请日：2010-11-19

申请人： A Leam Choi ,  Jae Han Chung ,  DeokKyung Yang ,  HyungSang Park

发明人： A Leam Choi ,  Jae Han Chung ,  DeokKyung Yang ,  HyungSang Park

IPC分类号： H01L21/00

CPC分类号： H01L23/49816 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49833 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a through silicon via die having an interconnect through a silicon substrate; depositing a re-distribution layer on the through silicon via die and connected to the interconnects; mounting a structure over the through silicon via die; connecting the structure to the interconnect of the through silicon via die with a direct interconnect; and encapsulating the through silicon via die and partially encapsulating the structure with an encapsulation.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有通过硅衬底的互连的通孔芯片; 通过管芯沉积在穿硅上的再分布层并连接到互连; 通过模具将结构安装在贯穿硅上; 通过芯片将直接互连的结构连接到通孔的互连件; 并通过管芯封装穿硅，并用封装部分地封装结构。