公开(公告)号：US11727260B2

公开(公告)日：2023-08-15

申请号：US17484828

申请日：2021-09-24

Applicant: Intel Corporation

Inventor： Abhishek Sharma ,  Jack T. Kavalieros ,  Ian A. Young ,  Ram Krishnamurthy ,  Sasikanth Manipatruni ,  Uygar Avci ,  Gregory K. Chen ,  Amrita Mathuriya ,  Raghavan Kumar ,  Phil Knag ,  Huseyin Ekin Sumbul ,  Nazila Haratipour ,  Van H. Le

IPC: G06N3/063 ,  H01L27/108 ,  H01L27/11502 ,  G06N3/04 ,  G06F17/16 ,  H01L27/11 ,  G11C11/54 ,  G11C7/10 ,  G11C11/419 ,  G11C11/409 ,  G11C11/22 ,  G06N3/065 ,  H10B10/00 ,  H10B12/00 ,  H10B53/00

CPC classification number: G06N3/065 ,  G06F17/16 ,  G06N3/04 ,  G11C7/1006 ,  G11C7/1039 ,  G11C11/54 ,  H10B10/18 ,  H10B12/01 ,  H10B12/033 ,  H10B12/20 ,  H10B12/50 ,  H10B53/00 ,  G11C11/221 ,  G11C11/409 ,  G11C11/419

Abstract: An apparatus is described. The apparatus includes a compute-in-memory (CIM) circuit for implementing a neural network disposed on a semiconductor chip. The CIM circuit includes a mathematical computation circuit coupled to a memory array. The memory array includes an embedded dynamic random access memory (eDRAM) memory array. Another apparatus is described. The apparatus includes a compute-in-memory (CIM) circuit for implementing a neural network disposed on a semiconductor chip. The CIM circuit includes a mathematical computation circuit coupled to a memory array. The mathematical computation circuit includes a switched capacitor circuit. The switched capacitor circuit includes a back-end-of-line (BEOL) capacitor coupled to a thin film transistor within the metal/dielectric layers of the semiconductor chip. Another apparatus is described. The apparatus includes a compute-in-memory (CIM) circuit for implementing a neural network disposed on a semiconductor chip. The CIM circuit includes a mathematical computation circuit coupled to a memory array. The mathematical computation circuit includes an accumulation circuit. The accumulation circuit includes a ferroelectric BEOL capacitor to store a value to be accumulated with other values stored by other ferroelectric BEOL capacitors.

公开(公告)号：US11696514B2

公开(公告)日：2023-07-04

申请号：US17565106

申请日：2021-12-29

Applicant: Intel Corporation

Inventor： Chia-Ching Lin ,  Sasikanth Manipatruni ,  Tanay Gosavi ,  Dmitri Nikonov ,  Benjamin Buford ,  Kaan Oguz ,  John J. Plombon ,  Ian A. Young

IPC: H10N50/85 ,  H10B61/00 ,  H10N50/80

CPC classification number: H10N50/85 ,  H10B61/22 ,  H10N50/80

Abstract: An apparatus is provided which comprises: a stack comprising a magnetoelectric (ME such as BiFeO3, (LaBi)FeO3, LuFeO3, PMN-PT, PZT, AlN, SmBiFeO3, Cr2O3, etc.) material and a transition metal dichalcogenide (TMD such as MoS2, MoSe2, WS2, WSe2, PtS2, PtSe2, WTe2, MoTe2, graphene, etc.); a magnet adjacent to a first portion of the TMD of the stack; a first interconnect adjacent to the magnet; a second interconnect adjacent to the ME material of the stack; and a third interconnect adjacent to a second portion of the TMD of the stack.

公开(公告)号：US11508903B2

公开(公告)日：2022-11-22

申请号：US16022094

申请日：2018-06-28

Applicant: Intel Corporation

Inventor： Angeline Smith ,  Ian Young ,  Kaan Oguz ,  Sasikanth Manipatruni ,  Christopher Wiegand ,  Kevin O'Brien ,  Tofizur Rahman ,  Noriyuki Sato ,  Benjamin Buford ,  Tanay Gosavi

IPC: H01L43/02 ,  H01L27/22 ,  H01L43/10

Abstract: An insertion layer for perpendicular spin orbit torque (SOT) memory devices between the SOT electrode and the free magnetic layer, memory devices and computing platforms employing such insertion layers, and methods for forming them are discussed. The insertion layer is predominantly tungsten and improves thermal stability and perpendicular magnetic anisotropy in the free magnetic layer.

公开(公告)号：US20220352358A1

公开(公告)日：2022-11-03

申请号：US17833662

申请日：2022-06-06

Applicant: Intel Corporation

Inventor： Chia-Ching Lin ,  Sasikanth Manipatruni ,  Tanay Gosavi ,  Sou-Chi Chang ,  Dmitri Nikonov ,  Ian A. Young

IPC: H01L29/66 ,  H01L29/82 ,  G11C11/16 ,  H01F10/32

Abstract: An apparatus is provided which comprises: a first stack comprising a magnetic insulating material (MI such as, EuS, EuO, YIG, TmIG, or GaMnAs) and a transition metal dichalcogenide (TMD such as MoS2, MoSe2, WS2, WSe2, PtS2, PtSe2, WTe2, MoTe2, or graphene; a second stack comprising an MI material and a TMD, wherein the first and second stacks are separated by an insulating material (e.g., oxide); a magnet (e.g., a ferromagnet or a paramagnet) adjacent to the TMDs of the first and second stacks, and also adjacent to the insulating material; and a magnetoelectric material (e.g., (LaBi)FeO3, LuFeO3, PMN-PT, PZT, AlN, or (SmBi)FeO3) adjacent to the magnet.

公开(公告)号：US11416165B2

公开(公告)日：2022-08-16

申请号：US16160482

申请日：2018-10-15

Applicant: INTEL CORPORATION

Inventor： Amrita Mathuriya ,  Sasikanth Manipatruni ,  Victor Lee ,  Huseyin Sumbul ,  Gregory Chen ,  Raghavan Kumar ,  Phil Knag ,  Ram Krishnamurthy ,  Ian Young ,  Abhishek Sharma

IPC: G06F12/00 ,  G06F3/06 ,  G06F12/1081 ,  G06N3/04 ,  G06F12/0802 ,  G06N3/063 ,  G06F12/0875 ,  G06F12/0897

Abstract: The present disclosure is directed to systems and methods of implementing a neural network using in-memory, bit-serial, mathematical operations performed by a pipelined SRAM architecture (bit-serial PISA) circuitry disposed in on-chip processor memory circuitry. The on-chip processor memory circuitry may include processor last level cache (LLC) circuitry. The bit-serial PISA circuitry is coupled to PISA memory circuitry via a relatively high-bandwidth connection to beneficially facilitate the storage and retrieval of layer weights by the bit-serial PISA circuitry during execution. Direct memory access (DMA) circuitry transfers the neural network model and input data from system memory to the bit-serial PISA memory and also transfers output data from the PISA memory circuitry to system memory circuitry. Thus, the systems and methods described herein beneficially leverage the on-chip processor memory circuitry to perform a relatively large number of vector/tensor calculations without burdening the processor circuitry.

公开(公告)号：US11264476B2

公开(公告)日：2022-03-01

申请号：US16349201

申请日：2016-12-27

Applicant: INTEL CORPORATION

Inventor： Sasikanth Manipatruni ,  Ravi Pillarisetty ,  Dmitri E. Nikonov ,  Ian A. Young ,  James S. Clarke

IPC: H01L29/45 ,  G06N10/00 ,  H01L21/285 ,  H01L29/12 ,  H01L29/66

Abstract: Systems, apparatus, and methods for initializing spin qubits with no external magnetic fields are described. An apparatus for quantum computing includes a quantum well and a pair of contacts. At least one of the contacts is formed of a ferromagnetic material. One of the contacts in the pair of contacts interfaces with a semiconductor material at a first position adjacent to the quantum well and the other contact in the pair of contacts interfaces with the semiconductor material at a second position adjacent to the quantum well. The ferromagnetic material initializes an electron or hole with a spin state prior to injection into the quantum well.

公开(公告)号：US11257613B2

公开(公告)日：2022-02-22

申请号：US15942434

申请日：2018-03-31

Applicant: Intel Corporation

Inventor： Kaan Oguz ,  Tanay Gosavi ,  Sasikanth Manipatruni ,  Charles Kuo ,  Mark Doczy ,  Kevin O'Brien

IPC: H01F10/32 ,  H01F41/30 ,  G11C11/16 ,  H01L43/12 ,  H01L27/22 ,  H01L43/08 ,  H01L43/10

Abstract: A perpendicular spin orbit torque (SOT) memory device includes an electrode having a spin orbit torque material, where the SOT material includes iridium and manganese and a perpendicular magnetic tunnel junction (pMTJ) device on a portion of the electrode. The pMTJ device includes a free magnet structure electrode, a fixed layer and a tunnel barrier between the free layer and the fixed layer and a SAF structure above the fixed layer. The Ir—Mn SOT material and the free magnet have an in-plane magnetic exchange bias.

公开(公告)号：US11245068B2

公开(公告)日：2022-02-08

申请号：US16009035

申请日：2018-06-14

Applicant: Intel Corporation

Inventor： Chia-Ching Lin ,  Sasikanth Manipatruni ,  Tanay Gosavi ,  Dmitri Nikonov ,  Benjamin Buford ,  Kaan Oguz ,  John J. Plombon ,  Ian A. Young

IPC: H01L43/10 ,  H01L43/02 ,  H01L27/22

Abstract: An apparatus is provided which comprises: a stack comprising a magnetoelectric (ME such as BiFeO3, (LaBi)FeO3, LuFeO3, PMN-PT, PZT, AlN, SmBiFeO3, Cr2O3, etc.) material and a transition metal dichalcogenide (TMD such as MoS2, MoSe2, WS2, WSe2, PtS2, PtSe2, WTe2, MoTe2, graphene, etc.); a magnet adjacent to a first portion of the TMD of the stack; a first interconnect adjacent to the magnet; a second interconnect adjacent to the ME material of the stack; and a third interconnect adjacent to a second portion of the TMD of the stack.

公开(公告)号：US11127785B2

公开(公告)日：2021-09-21

申请号：US16305370

申请日：2016-06-28

Applicant: Intel Corporation

Inventor： Sasikanth Manipatruni ,  Dmitri E. Nikonov ,  Ian A. Young

IPC: H01L27/22 ,  H01L43/02 ,  H01L43/10 ,  H01L43/12

Abstract: A three dimensional (3D) array of magnetic random access memory (MRAM) bit-cells is described, wherein the array includes a mesh of: a first interconnect extending along a first axis; a second interconnect extending along a second axis; and a third interconnect extending along a third axis, wherein the first, second and third axes are orthogonal to one another, and wherein a bit-cell of the MRAM bit-cells includes: a magnetic junction device including a first electrode coupled to the first interconnect; a piezoelectric (PZe) layer adjacent to a second electrode, wherein the second electrode is coupled to the second interconnect; and a first layer adjacent to the PZe layer and the magnetic junction, wherein the first layer is coupled the third interconnect.

公开(公告)号：US11107908B2

公开(公告)日：2021-08-31

申请号：US16306540

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Sasikanth Manipatruni ,  Anurag Chaudhry ,  Dmitri E. Nikonov ,  Jasmeet S. Chawla ,  Christopher J. Wiegand ,  Kanwaljit Singh ,  Uygar E. Avci ,  Ian A. Young

IPC: H01L29/66 ,  H01L29/45 ,  H01L29/775 ,  H01L29/10 ,  H01L29/739 ,  H01L29/06 ,  B82Y10/00 ,  H01L29/786 ,  H01L29/423 ,  H01L29/417 ,  H01L21/285 ,  H01L29/16 ,  H01L29/20 ,  H01L29/24 ,  H01L29/47 ,  H01L29/78

Abstract: Embodiments herein describe techniques for a semi-conductor device comprising a channel having a first semiconductor material; a source contact coupled to the channel, comprising a first Heusler alloy; and a drain contact coupled to the channel, comprising a second Heusler alloy. The first Heusler alloy is lattice-matched to the first semiconductor material within a first predetermined threshold. A first Schottky barrier between the channel and the source contact, and a second Schottky barrier between the channel and the drain contact are negative, or smaller than another predetermined threshold. The source contact and the drain contact can be applied to a strained silicon transistor, an III-V transistor, a tunnel field-effect transistor, a dichalcogenide (MX2) transistor, and a junctionless nanowire transistor.