公开(公告)号：US5159238A

公开(公告)日：1992-10-27

申请号：US562906

申请日：1990-08-06

申请人： Ichiro Koiwa ,  Yoshitaka Terao ,  Hideo Sawai ,  Naoyuki Shiozawa ,  Kozo Fujii

发明人： Ichiro Koiwa ,  Yoshitaka Terao ,  Hideo Sawai ,  Naoyuki Shiozawa ,  Kozo Fujii

IPC分类号： H01J9/02 ,  H01J17/06

CPC分类号： H01J17/066 ,  H01J9/02

摘要： A gas discharge panel with a plurality of electrically conductive oxide cathode electrodes and a plurality of anode electrodes that are arranged in a matrix in a sealed container. This electrically conductive oxide cathode electrode is formed using, for example, lanthanum chromite, lanthanum calcium chromite, alumina-doped zinc oxide, or antimony-doped tin oxide.

公开(公告)号：US20050254198A1

公开(公告)日：2005-11-17

申请号：US10973411

申请日：2004-10-27

申请人： Takayuki Matsumoto ,  Tetsuyuki Sakuda ,  Nobuhiro Honda ,  Shigekatsu Ohnishi ,  Naoyuki Shiozawa ,  Hideaki Kojima

发明人： Takayuki Matsumoto ,  Tetsuyuki Sakuda ,  Nobuhiro Honda ,  Shigekatsu Ohnishi ,  Naoyuki Shiozawa ,  Hideaki Kojima

IPC分类号： H01G9/04 ,  H01G9/00 ,  H01G9/028 ,  H01G9/042 ,  H01G9/15

CPC分类号： H01G9/15 ,  H01G9/028 ,  H01G9/0425 ,  Y10T29/417

摘要： A solid electrolytic capacitor includes an anode body formed with a dielectric oxide film, a laminate cathode provided on the dielectric oxide film, a cathode lead frame provided on the cathode, and an anode lead frame attached to a lead portion of the anode body. The laminate cathode includes a solid electrolyte layer, and a mixture layer of a mixture of silver flake particles and carbon particles provided directly on an outer surface of the solid electrolyte layer.

摘要翻译： 固体电解电容器包括形成有电介质氧化物膜的阳极体，设置在电介质氧化物膜上的叠层阴极，设置在阴极上的阴极引线框架和连接到阳极体的引线部分的阳极引线框架。 层叠阴极包括固体电解质层和直接在固体电解质层的外表面上设置的银片颗粒和碳颗粒的混合物的混合层。

公开(公告)号：US06328844B1

公开(公告)日：2001-12-11

申请号：US09230017

申请日：1999-08-24

申请人： Itsuo Watanabe ,  Kenzo Takemura ,  Osamu Watanabe ,  Naoyuki Shiozawa ,  Akira Nagai ,  Kazuyoshi Kojima ,  Toshiaki Tanaka ,  Kazunori Yamamoto

发明人： Itsuo Watanabe ,  Kenzo Takemura ,  Osamu Watanabe ,  Naoyuki Shiozawa ,  Akira Nagai ,  Kazuyoshi Kojima ,  Toshiaki Tanaka ,  Kazunori Yamamoto

IPC分类号： C09J16302

CPC分类号： H01L24/29 ,  C08L2666/02 ,  C09J163/00 ,  H01B1/22 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29386 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0271 ,  H05K3/323 ,  H05K2201/0133 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/48

摘要： A heat-active adhesive for a connecting circuit which is used for electrically connecting circuit electrodes facing each other in the pressing direction by heating and pressing the electrodes. The adhesive has an elastic modulus of 100-2,000 MPa at 40° C. after adhesion. The adhesive can contain at least an epoxy resin, acrylic rubber, and a latent curing agent. An acrylic rubber having a glycidryl ether group as a molecule is preferably used as the acrylic rubber.

摘要翻译： 一种用于连接电路的热活性粘合剂，其用于通过加热和加压电极来将电路电极沿按压方向彼此面对地电连接。 粘合剂在粘合后在40℃下的弹性模量为100-2000MPa。 粘合剂可以含有至少一种环氧树脂，丙烯酸橡胶和潜在性固化剂。 作为丙烯酸橡胶，优选使用缩水甘油醚基作为分子的丙烯酸橡胶。

公开(公告)号：US07023689B2

公开(公告)日：2006-04-04

申请号：US10973411

申请日：2004-10-27

申请人： Takayuki Matsumoto ,  Tetsuyuki Sakuda ,  Nobuhiro Honda ,  Shigekatsu Ohnishi ,  Naoyuki Shiozawa ,  Hideaki Kojima

发明人： Takayuki Matsumoto ,  Tetsuyuki Sakuda ,  Nobuhiro Honda ,  Shigekatsu Ohnishi ,  Naoyuki Shiozawa ,  Hideaki Kojima

IPC分类号： H01G9/00

CPC分类号： H01G9/15 ,  H01G9/028 ,  H01G9/0425 ,  Y10T29/417

摘要： A solid electrolytic capacitor includes an anode body formed with a dielectric oxide film, a laminate cathode provided on the dielectric oxide film, a cathode lead frame provided on the cathode, and an anode lead frame attached to a lead portion of the anode body. The laminate cathode includes a solid electrolyte layer, and a mixture layer of a mixture of silver flake particles and carbon particles provided directly on an outer surface of the solid electrolyte layer.

摘要翻译： 固体电解电容器包括形成有电介质氧化物膜的阳极体，设置在电介质氧化物膜上的叠层阴极，设置在阴极上的阴极引线框架和连接到阳极体的引线部分的阳极引线框架。 层叠阴极包括固体电解质层和直接在固体电解质层的外表面上设置的银片颗粒和碳颗粒的混合物的混合层。

公开(公告)号：US06338195B1

公开(公告)日：2002-01-15

申请号：US09472026

申请日：1999-12-27

申请人： Isao Tsukagoshi ,  Yukihisa Hirosawa ,  Kouji Kobayashi ,  Tomohisa Ohta ,  Hiroshi Matsuoka ,  Itsuo Watanabe ,  Kenzo Takemura ,  Naoyuki Shiozawa ,  Osamu Watanabe ,  Kazuyoshi Kojima

发明人： Isao Tsukagoshi ,  Yukihisa Hirosawa ,  Kouji Kobayashi ,  Tomohisa Ohta ,  Hiroshi Matsuoka ,  Itsuo Watanabe ,  Kenzo Takemura ,  Naoyuki Shiozawa ,  Osamu Watanabe ,  Kazuyoshi Kojima

IPC分类号： H05K330

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0224 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

摘要： A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer containing a first adhesive having an insulating property and a second adhesive layer containing a second adhesive having an insulating property and a conductive material and placed at least on one side of the first adhesive layer. At the same time of electrode connection, the second adhesive molten has a viscosity equal to or lower than that of the first adhesive when molten. When the electrodes are connected with this structure, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, and part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes. Further, since the region between adjacent protruding electrodes contains no air bubbles, connection reliability and excellent moisture resistance is ensured.

摘要翻译： 通过将连接片插入电极之间，将彼此面对的电极牢固地接合在一起的连接片。 连接片包括含有绝缘性的第一粘合剂的第一粘合剂层和包含具有绝缘性的第二粘合剂和导电材料的第二粘合剂层，并且至少放置在第一粘合剂层的一侧。 在电极连接的同时，熔融时的第二粘合剂的粘度等于或低于第一粘合剂的粘度。 当电极与该结构连接时，包含在第二粘合剂层中的导电材料被嵌入具有相对较高熔融粘度的第一粘合剂层中，并且部分导电材料被捕​​获在与其连接的电极上。 因此，导电材料可以牢固地保持在电极之间。 此外，由于相邻的突出电极之间的区域不含气泡，因此确保了连接可靠性和优异的耐湿性。

公开(公告)号：US06223429B1

公开(公告)日：2001-05-01

申请号：US08981509

申请日：1998-07-30

申请人： Aizou Kaneda ,  Masaaki Yasuda ,  Itsuo Watanabe ,  Tomohisa Ohta ,  Fumio Inoue ,  Yoshiaki Tsubomatsu ,  Toshio Yamazaki ,  Hiroto Ohata ,  Kenzo Takemura ,  Akira Nagai ,  Osamu Watanabe ,  Naoyuki Shiozawa ,  Kazuyoshi Kojima ,  Toshiaki Tanaka ,  Kazunori Yamamoto

发明人： Aizou Kaneda ,  Masaaki Yasuda ,  Itsuo Watanabe ,  Tomohisa Ohta ,  Fumio Inoue ,  Yoshiaki Tsubomatsu ,  Toshio Yamazaki ,  Hiroto Ohata ,  Kenzo Takemura ,  Akira Nagai ,  Osamu Watanabe ,  Naoyuki Shiozawa ,  Kazuyoshi Kojima ,  Toshiaki Tanaka ,  Kazunori Yamamoto

IPC分类号： H05K330

CPC分类号： H01L24/83 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/32 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29384 ,  H01L2224/29444 ,  H01L2224/29469 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81192 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83951 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/00014

摘要： To provide a highly reliable semiconductor device structure that enables cost reduction in the production of packages, inclusive of the cost for chips, and may cause less changes in connection resistance even under conditions of a long-term environmental resistance test. In a semiconductor device comprising a semiconductor chip face-down bonded to a wiring board, it has a structure wherein projecting metal portions are provided at the opposing wiring board terminals without forming bumps on bonding pads of the chip, the whole chip surface is bonded with an organic, anisotropic conductive adhesive material, and the whole or at least an edge of the back of the chip is covered with a sealing material.

摘要翻译： 为了提供高可靠性的半导体器件结构，其能够降低封装的生产成本，包括芯片的成本，并且即使在长期耐环境测试的条件下也可能导致连接电阻的变化较小。在包括 面向下接合到布线板的半导体芯片，其结构是在相对的布线板端子处设置突出的金属部分，而不在芯片的焊盘上形成凸块，整个芯片表面用有机的各向异性导电 粘合剂材料，并且芯片的背面的整个或至少一个边缘被密封材料覆盖。

公开(公告)号：US6034331A

公开(公告)日：2000-03-07

申请号：US681397

申请日：1996-07-23

申请人： Isao Tsukagoshi ,  Yukihisa Hirosawa ,  Kouji Kobayashi ,  Tomohisa Ohta ,  Hiroshi Matsuoka ,  Itsuo Watanabe ,  Kenzo Takemura ,  Naoyuki Shiozawa ,  Osamu Watanabe ,  Kazuyoshi Kojima

发明人： Isao Tsukagoshi ,  Yukihisa Hirosawa ,  Kouji Kobayashi ,  Tomohisa Ohta ,  Hiroshi Matsuoka ,  Itsuo Watanabe ,  Kenzo Takemura ,  Naoyuki Shiozawa ,  Osamu Watanabe ,  Kazuyoshi Kojima

IPC分类号： H01L21/60 ,  H05K3/32 ,  H05K1/16

CPC分类号： H01L24/83 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K2201/0224 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A connection sheet which firmly bonds electrodes that face each other together by interposing the connection sheet between the electrodes. The connection sheet comprises a first adhesive layer containing a first adhesive having an insulating property and a second adhesive layer placed at least on one side of the first adhesive layer and containing a second adhesive having an insulating property and a conductive material, wherein at the time of electrode connection, the second adhesive molten has a viscosity equal to or lower than that of the first adhesive when molten. When the electrodes are connected with this structure, the conductive material contained in the second adhesive layer is embedded in the first adhesive layer having relatively high melting viscosity, and part of the conductive material is trapped on the electrodes to be connected in contact therewith. Accordingly, the conductive material can be securely held between the electrodes. Further, since the region between adjacent protruding electrodes contains no air bubbles, connection reliability and excellent moisture resistance is ensured.

摘要翻译： 通过将连接片插入电极之间，将彼此面对的电极牢固地接合在一起的连接片。 连接片包括含有绝缘性的第一粘合剂的第一粘合剂层和位于第一粘合剂层的至少一侧并且包含具有绝缘性的第二粘合剂和导电材料的第二粘合剂层，其中在此时 的第二粘合剂熔融时的粘度等于或低于第一粘合剂熔融时的粘度。 当电极与该结构连接时，包含在第二粘合剂层中的导电材料被嵌入具有相对较高熔融粘度的第一粘合剂层中，并且部分导电材料被捕​​获在与其连接的电极上。 因此，导电材料可以牢固地保持在电极之间。 此外，由于相邻的突出电极之间的区域不含气泡，因此确保了连接可靠性和优异的耐湿性。