公开(公告)号：US20110316025A1

公开(公告)日：2011-12-29

申请号：US13067716

申请日：2011-06-22

申请人： Ikko Kuzuhara ,  Kouji Nishioka

发明人： Ikko Kuzuhara ,  Kouji Nishioka

IPC分类号： H01L33/50

CPC分类号： H01L33/504 ,  H01L33/507 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting device includes a light emitting element, a first phosphor which emits a light by being excited by a light emitted from the light emitting element and a second phosphor which emits a light by being excited by the light emitted from the light emitting element and/or the light emitted from the first phosphor. The light emitted from the light emitting element, the light emitted from the first phosphor and the light emitted from the second phosphor are mixed to make an inclination angle of a line, on a chromaticity diagram, connecting a chromaticity coordinate of the light emitted from the first phosphor and a chromaticity coordinate of the light emitted from the light emitting element equal to an inclination angle of an isotemperature line of light of a predetermined color temperature.

摘要翻译： 发光装置包括发光元件，通过被从发光元件发射的光激发而发射光的第一荧光体和通过被从发光元件发射的光而被激发而发光的第二荧光体，以及 /或从第一荧光体发射的光。 从发光元件发射的光，从第一荧光体发射的光和从第二荧光体发射的光混合，以在色度图上形成一条线的倾斜角，连接从该第一荧光体发出的光的色度坐标 第一荧光体和从发光元件发射的光的色度坐标等于预定色温的等温线的倾斜角。

公开(公告)号：US08598608B2

公开(公告)日：2013-12-03

申请号：US13067716

申请日：2011-06-22

申请人： Ikko Kuzuhara ,  Kouji Nishioka

发明人： Ikko Kuzuhara ,  Kouji Nishioka

IPC分类号： H01L33/00

CPC分类号： H01L33/504 ,  H01L33/507 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting device includes a light emitting element, a first phosphor which emits a light by being excited by a light emitted from the light emitting element and a second phosphor which emits a light by being excited by the light emitted from the light emitting element and/or the light emitted from the first phosphor. The light emitted from the light emitting element, the light emitted from the first phosphor and the light emitted from the second phosphor are mixed to make an inclination angle of a line, on a chromaticity diagram, connecting a chromaticity coordinate of the light emitted from the first phosphor and a chromaticity coordinate of the light emitted from the light emitting element equal to an inclination angle of an isotemperature line of light of a predetermined color temperature.

摘要翻译： 发光装置包括发光元件，通过被从发光元件发射的光激发而发射光的第一荧光体和通过被从发光元件发射的光而被激发而发光的第二荧光体，以及 /或从第一荧光体发射的光。 从发光元件发射的光，从第一荧光体发射的光和从第二荧光体发射的光混合，以在色度图上形成一条线的倾斜角，连接从该第一荧光体发出的光的色度坐标 第一荧光体和从发光元件发射的光的色度坐标等于预定色温的等温线的倾斜角。

公开(公告)号：US06713844B2

公开(公告)日：2004-03-30

申请号：US10026639

申请日：2001-12-27

申请人： Jun Tatsuta ,  Masao Kubo ,  Shinobu Kida ,  Shigenari Takami ,  Ikko Kuzuhara ,  Kyoji Tanaka ,  Yoshiharu Sanagawa

发明人： Jun Tatsuta ,  Masao Kubo ,  Shinobu Kida ,  Shigenari Takami ,  Ikko Kuzuhara ,  Kyoji Tanaka ,  Yoshiharu Sanagawa

IPC分类号： H01L2348

CPC分类号： H01L23/49833 ,  H01L21/563 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/29 ,  H01L25/105 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13019 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/83192 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor-chip mounting substrate with a high degree of reliability of an electrical connection between a substrate and a semiconductor chip such as IC chips is provided. The substrate has at least one projection thereon, which is integrally molded with the substrate. A conductive layer is formed on the projection to obtain a first bump. The semiconductor chip has a terminal projecting as a second bump on its surface. The semiconductor chip is mounted on the substrate such that the first bump contacts the second bump. A required contact pressure between the first bump and the second bump is held by use of a pressure holding means.

摘要翻译： 提供了具有高可靠性的基板和诸如IC芯片的半导体芯片之间的电连接的半导体芯片安装基板。 衬底上具有至少一个突起，其与衬底整体模制。 在突起上形成导电层以获得第一凸块。 半导体芯片具有在其表面上作为第二凸起突出的端子。 半导体芯片安装在基板上，使得第一凸块接触第二凸块。 通过使用压力保持装置保持第一凸起和第二凸起之间的所需接触压力。

公开(公告)号：US20130070452A1

公开(公告)日：2013-03-21

申请号：US13641483

申请日：2011-04-26

申请人： Yoji Urano ,  Ryoji Yokotani ,  Ikko Kuzuhara ,  Kenichiro Tanaka

发明人： Yoji Urano ,  Ryoji Yokotani ,  Ikko Kuzuhara ,  Kenichiro Tanaka

IPC分类号： F21V29/00 ,  F21V9/00

CPC分类号： H05K1/0203 ,  F21K9/20 ,  F21K9/27 ,  F21K9/90 ,  F21V19/004 ,  F21V29/767 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2107/90 ,  F21Y2115/10 ,  H01L24/45 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/056 ,  H05K1/181 ,  H05K3/202 ,  H05K2201/10106 ,  Y02P70/611 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01049

摘要： Provided is lead frame in which a wiring pattern supported by a support piece inside of a one-pitch outer frame section comprises a plurality of base units, each of which comprises a die pad on which a solid-state light emitting element is mounted, a heat sink extending from die pad so as to surround die pad electrically connected to one electrode of the element, and a lead electrically connected to the other electrode of the element. Lead of one base unit among adjacent base units and heat sink of the other base unit are coupled and electrically connected in series. Increase in temperature of the element is inhibited, light output is increased, and cost of a light emitting unit in which a plurality of solid-state light emitting elements connected in series are used is reduced. Also provided are wiring board, light emitting unit, and illuminating apparatus.

摘要翻译： 本发明提供了一种引线框架，其中由一节距外框部分内的支撑件支撑的布线图案包括多个基座单元，每个基座单元包括其上安装固态发光元件的芯片焊盘， 从芯片焊盘延伸的散热片，以便围绕与该元件的一个电极电连接的芯片焊盘以及与该元件的另一个电极电连接的引线。 相邻基座中的一个基本单元和另一个基座单元的散热器的引线串联并电连接。 抑制元件的温度升高，光输出增加，并且使用串联连接的多个固态发光元件的发光单元的成本降低。 还提供了布线板，发光单元和照明装置。

公开(公告)号：US08592836B2

公开(公告)日：2013-11-26

申请号：US13331028

申请日：2011-12-20

申请人： Ryoji Yokotani ,  Yoji Urano ,  Ikko Kuzuhara ,  Kenichiro Tanaka

发明人： Ryoji Yokotani ,  Yoji Urano ,  Ikko Kuzuhara ,  Kenichiro Tanaka

IPC分类号： H01L29/18

CPC分类号： H01L33/486 ,  H01L24/45 ,  H01L25/0753 ,  H01L33/507 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/01019 ,  H01L2924/01047 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light emitting device includes a solid light-emitting element; a mounting substrate mounting the solid light-emitting element thereon; an encapsulating member encapsulating the solid light-emitting element; and a lead frame electrically connected to the solid light-emitting element through a wire. The lead frame is arranged on a rear surface of the mounting substrate, and the mounting substrate includes a front mounting surface on which the solid light-emitting element is mounted. The front mounting surface having a smooth surface region covered with the encapsulating member. The mounting substrate further includes a wire hole through which the wire extends from the front mounting surface of the mounting substrate to the rear surface thereof.

摘要翻译： 发光器件包括固体发光元件; 将固体发光元件安装在其上的安装基板; 封装所述固体发光元件的封装构件; 以及通过线电连接到固体发光元件的引线框架。 引线框布置在安装基板的后表面上，安装基板包括安装有固体发光元件的前安装面。 前安装表面具有被封装构件覆盖的光滑表面区域。 安装基板还包括线，该线从安装基板的前安装表面延伸到其后表面。

公开(公告)号：US20120153313A1

公开(公告)日：2012-06-21

申请号：US13331028

申请日：2011-12-20

申请人： Ryoji YOKOTANI ,  Yoji Urano ,  Ikko Kuzuhara ,  Kenichiro Tanaka

发明人： Ryoji YOKOTANI ,  Yoji Urano ,  Ikko Kuzuhara ,  Kenichiro Tanaka

IPC分类号： H01L33/62 ,  H01L33/08

CPC分类号： H01L33/486 ,  H01L24/45 ,  H01L25/0753 ,  H01L33/507 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/01019 ,  H01L2924/01047 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light emitting device includes a solid light-emitting element; a mounting substrate mounting the solid light-emitting element thereon; an encapsulating member encapsulating the solid light-emitting element; and a lead frame electrically connected to the solid light-emitting element through a wire. The lead frame is arranged on a rear surface of the mounting substrate, and the mounting substrate includes a front mounting surface on which the solid light-emitting element is mounted. The front mounting surface having a smooth surface region covered with the encapsulating member. The mounting substrate further includes a wire hole through which the wire extends from the front mounting surface of the mounting substrate to the rear surface thereof.

摘要翻译： 发光器件包括固体发光元件; 将固体发光元件安装在其上的安装基板; 封装所述固体发光元件的封装构件; 以及通过线电连接到固体发光元件的引线框架。 引线框布置在安装基板的后表面上，安装基板包括安装有固体发光元件的前安装面。 前安装表面具有被封装构件覆盖的光滑表面区域。 安装基板还包括线，该线从安装基板的前安装表面延伸到其后表面。

公开(公告)号：US08967827B2

公开(公告)日：2015-03-03

申请号：US13641483

申请日：2011-04-26

申请人： Yoji Urano ,  Ryoji Yokotani ,  Ikko Kuzuhara ,  Kenichiro Tanaka

发明人： Yoji Urano ,  Ryoji Yokotani ,  Ikko Kuzuhara ,  Kenichiro Tanaka

IPC分类号： F21S4/00 ,  F21V21/00 ,  H05K1/02 ,  F21K99/00 ,  F21V19/00 ,  H05K1/18 ,  F21V29/00 ,  H01L25/075 ,  H01L33/48 ,  H01L33/62 ,  H05K1/05 ,  H05K3/20 ,  F21Y101/02 ,  F21Y103/00 ,  F21Y105/00 ,  H01L23/00

CPC分类号： H05K1/0203 ,  F21K9/20 ,  F21K9/27 ,  F21K9/90 ,  F21V19/004 ,  F21V29/767 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2107/90 ,  F21Y2115/10 ,  H01L24/45 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/056 ,  H05K1/181 ,  H05K3/202 ,  H05K2201/10106 ,  Y02P70/611 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01049

摘要： Provided is lead frame in which a wiring pattern supported by a support piece inside of a one-pitch outer frame section comprises a plurality of base units, each of which comprises a die pad on which a solid-state light emitting element is mounted, a heat sink extending from die pad so as to surround die pad electrically connected to one electrode of the element, and a lead electrically connected to the other electrode of the element. Lead of one base unit among adjacent base units and heat sink of the other base unit are coupled and electrically connected in series. Increase in temperature of the element is inhibited, light output is increased, and cost of a light emitting unit in which a plurality of solid-state light emitting elements connected in series are used is reduced. Also provided are wiring board, light emitting unit, and illuminating apparatus.

摘要翻译： 本发明提供了一种引线框架，其中由一节距外框部分内的支撑件支撑的布线图案包括多个基座单元，每个基座单元包括其上安装固态发光元件的芯片焊盘， 从芯片焊盘延伸的散热片，以便围绕与该元件的一个电极电连接的芯片焊盘以及与该元件的另一个电极电连接的引线。 相邻基座中的一个基本单元和另一个基座单元的散热器的引线串联并电连接。 抑制元件的温度升高，光输出增加，并且使用串联连接的多个固态发光元件的发光单元的成本降低。 还提供了布线板，发光单元和照明装置。