公开(公告)号：US08536670B2

公开(公告)日：2013-09-17

申请号：US13216654

申请日：2011-08-24

申请人： Ikuo Yoshihara ,  Taku Umebayashi ,  Hiroshi Takahashi ,  Hironobu Yoshida

发明人： Ikuo Yoshihara ,  Taku Umebayashi ,  Hiroshi Takahashi ,  Hironobu Yoshida

IPC分类号： H01L31/04 ,  H01L21/66 ,  H01L23/538

CPC分类号： H01L25/00 ,  H01L21/76251 ,  H01L23/147 ,  H01L23/49805 ,  H01L23/49822 ,  H01L25/0657 ,  H01L25/167 ,  H01L25/50 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes: a first semiconductor chip; and a second semiconductor chip that is stacked on the first semiconductor chip. The first semiconductor chip includes a first wiring portion of which a side surface is exposed at a side portion of the first semiconductor chip. The second semiconductor chip includes a second wiring portion of which a side surface is exposed at a side portion of the second semiconductor chip. The respective side surfaces of the first wiring portion and the second wiring portion, which are exposed at the side portions of the first semiconductor chip and the second semiconductor chip, are covered by a conductive layer, and the first wiring portion and the second wiring portion are electrically connected to each other through the conductive layer.

公开(公告)号：US20120056288A1

公开(公告)日：2012-03-08

申请号：US13216654

申请日：2011-08-24

申请人： Ikuo Yoshihara ,  Taku Umebayashi ,  Hiroshi Takahashi ,  Hironobu Yoshida

发明人： Ikuo Yoshihara ,  Taku Umebayashi ,  Hiroshi Takahashi ,  Hironobu Yoshida

IPC分类号： H01L31/04 ,  H01L21/66 ,  H01L23/538

CPC分类号： H01L25/00 ,  H01L21/76251 ,  H01L23/147 ,  H01L23/49805 ,  H01L23/49822 ,  H01L25/0657 ,  H01L25/167 ,  H01L25/50 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes: a first semiconductor chip; and a second semiconductor chip that is stacked on the first semiconductor chip. The first semiconductor chip includes a first wiring portion of which a side surface is exposed at a side portion of the first semiconductor chip. The second semiconductor chip includes a second wiring portion of which a side surface is exposed at a side portion of the second semiconductor chip. The respective side surfaces of the first wiring portion and the second wiring portion, which are exposed at the side portions of the first semiconductor chip and the second semiconductor chip, are covered by a conductive layer, and the first wiring portion and the second wiring portion are electrically connected to each other through the conductive layer.

摘要翻译： 半导体器件包括：第一半导体芯片; 以及堆叠在第一半导体芯片上的第二半导体芯片。 第一半导体芯片包括第一布线部分，其侧表面在第一半导体芯片的侧部暴露。 第二半导体芯片包括第二布线部分，其侧表面在第二半导体芯片的侧部暴露。 在第一半导体芯片和第二半导体芯片的侧面露出的第一布线部分和第二布线部分的各个侧表面被导电层覆盖，并且第一布线部分和第二布线部分 通过导电层彼此电连接。

公开(公告)号：US08410569B2

公开(公告)日：2013-04-02

申请号：US12842583

申请日：2010-07-23

申请人： Ikuo Yoshihara ,  Masaya Nagata ,  Naoto Sasaki ,  Taku Umebayashi ,  Hiroshi Takahashi ,  Yoichi Otsuka ,  Isaya Kitamura ,  Tokihisa Kaneguchi ,  Keishi Inoue ,  Toshihiko Hayashi ,  Hiroyasu Matsugai ,  Mayoshi Aonuma ,  Hiroshi Yoshioka

发明人： Ikuo Yoshihara ,  Masaya Nagata ,  Naoto Sasaki ,  Taku Umebayashi ,  Hiroshi Takahashi ,  Yoichi Otsuka ,  Isaya Kitamura ,  Tokihisa Kaneguchi ,  Keishi Inoue ,  Toshihiko Hayashi ,  Hiroyasu Matsugai ,  Mayoshi Aonuma ,  Hiroshi Yoshioka

IPC分类号： H01L27/146

CPC分类号： H01L27/14632 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14687

摘要： A solid-state imaging device includes a first substrate including a light-sensing portion configured to perform photoelectric conversion of incident light and a wiring portion provided on a light-incident side; an optically transparent second substrate provided on a wiring portion side of the first substrate at a certain distance; a through-hole provided in the first substrate; a through-via provided in the through-hole; a front-surface-side electrode connected to the through-via and provided on a front surface of the first substrate; a back-surface-side electrode connected to the through-via and provided on a back surface of the first substrate; and a stopper electrode provided on the front-surface-side electrode and filling a space between the front-surface-side electrode and the second substrate.

摘要翻译： 固态成像装置包括：第一基板，包括被配置为执行入射光的光电转换的光感测部分和设置在光入射侧的布线部分; 光学透明的第二基板，设置在所述第一基板的布线部侧一定距离; 设置在所述第一基板中的通孔; 通孔，设置在通孔中; 连接到所述通孔并设置在所述第一基板的前表面上的前表面侧电极; 连接到所述通孔并设置在所述第一基板的背面上的背面侧电极; 以及设置在前表面侧电极上并填充前表面侧电极和第二基板之间的间隔的止动电极。

公开(公告)号：US20110024858A1

公开(公告)日：2011-02-03

申请号：US12842583

申请日：2010-07-23

申请人： Ikuo Yoshihara ,  Masaya Nagata ,  Naoto Sasaki ,  Taku Umebayashi ,  Hiroshi Takahashi ,  Yoichi Otsuka ,  Isaya Kitamura ,  Tokihisa Kaneguchi ,  Keishi Inoue ,  Toshihiko Hayashi ,  Hiroyasu Matsugai ,  Masayoshi Aonuma ,  Hiroshi Yoshioka

发明人： Ikuo Yoshihara ,  Masaya Nagata ,  Naoto Sasaki ,  Taku Umebayashi ,  Hiroshi Takahashi ,  Yoichi Otsuka ,  Isaya Kitamura ,  Tokihisa Kaneguchi ,  Keishi Inoue ,  Toshihiko Hayashi ,  Hiroyasu Matsugai ,  Masayoshi Aonuma ,  Hiroshi Yoshioka

IPC分类号： H01L31/0232 ,  H01L31/02 ,  H01L31/18

CPC分类号： H01L27/14632 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14687

摘要： A solid-state imaging device includes a first substrate including a light-sensing portion configured to perform photoelectric conversion of incident light and a wiring portion provided on a light-incident side; an optically transparent second substrate provided on a wiring portion side of the first substrate at a certain distance; a through-hole provided in the first substrate; a through-via provided in the through-hole; a front-surface-side electrode connected to the through-via and provided on a front surface of the first substrate; a back-surface-side electrode connected to the through-via and provided on a back surface of the first substrate; and a stopper electrode provided on the front-surface-side electrode and filling a space between the front-surface-side electrode and the second substrate.

摘要翻译： 固态成像装置包括：第一基板，包括被配置为执行入射光的光电转换的光感测部分和设置在光入射侧的布线部分; 光学透明的第二基板，设置在所述第一基板的布线部侧一定距离; 设置在所述第一基板中的通孔; 通孔，设置在通孔中; 连接到所述通孔并设置在所述第一基板的前表面上的前表面侧电极; 连接到所述通孔并设置在所述第一基板的背面上的背面侧电极; 以及设置在前表面侧电极上并填充前表面侧电极和第二基板之间的间隔的止动电极。

公开(公告)号：US08848075B2

公开(公告)日：2014-09-30

申请号：US12910014

申请日：2010-10-22

申请人： Hiroshi Takahashi ,  Taku Umebayashi

发明人： Hiroshi Takahashi ,  Taku Umebayashi

IPC分类号： H04N3/14 ,  H04N5/335 ,  H01L23/00 ,  H01L27/146 ,  H01L23/48 ,  H01L21/768 ,  H01L21/762

CPC分类号： H01L27/14636 ,  H01L21/76251 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/05 ,  H01L27/14632 ,  H01L27/14634 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14687 ,  H01L27/1469 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/18 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48463 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/12043 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2224/45099

摘要： A semiconductor device having a first semiconductor section including a first wiring layer at one side thereof; a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together with the respective first and second wiring layer sides of the first and second semiconductor sections facing each other; a conductive material extending through the first semiconductor section to the second wiring layer of the second semiconductor section and by means of which the first and second wiring layers are in electrical communication; and an opening, other than the opening for the conductive material, which extends through the first semiconductor section to the second wiring layer.

摘要翻译： 一种半导体器件，具有在其一侧包括第一布线层的第一半导体部分; 其一侧包括第二布线层的第二半导体部分，所述第一和第二半导体部分与所述第一和第二半导体部分的相应的第一和第二布线层侧面相互固定在一起; 导电材料，其延伸穿过所述第一半导体部分到所述第二半导体部分的所述第二布线层，并且所述第一和第二布线层与所述第二半导体部分电连通; 以及除了通过第一半导体部分延伸到第二布线层的导电材料的开口以外的开口。

公开(公告)号：US20100238331A1

公开(公告)日：2010-09-23

申请号：US12722069

申请日：2010-03-11

申请人： Taku Umebayashi ,  Hiroshi Takahashi ,  Reijiroh Shohji

发明人： Taku Umebayashi ,  Hiroshi Takahashi ,  Reijiroh Shohji

IPC分类号： H04N5/335 ,  H01L31/14 ,  H01L31/18 ,  H01L27/146

CPC分类号： H01L27/14634 ,  H01L21/76898 ,  H01L23/481 ,  H01L27/14612 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2224/11 ,  H04N5/225 ,  H04N5/374

摘要： A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.

摘要翻译： 提供了一种半导体器件作为背照式固态成像器件。 该器件通过将具有半成品状态的像素阵列的第一半导体晶片和具有半成品状态的逻辑电路的第二半导体晶片结合在一起而制造，使得第一半导体晶片成为薄膜，电 连接像素阵列和逻辑电路，使得像素阵列和逻辑电路成为成品状态，并将第一半导体晶片和第二半导体结合在一起成为微芯片。

公开(公告)号：US09451131B2

公开(公告)日：2016-09-20

申请号：US12722069

申请日：2010-03-11

申请人： Taku Umebayashi ,  Hiroshi Takahashi ,  Reijiroh Shohji

发明人： Taku Umebayashi ,  Hiroshi Takahashi ,  Reijiroh Shohji

IPC分类号： H01L21/00 ,  H01L31/062 ,  H01L31/113 ,  H04N5/225 ,  H01L27/146 ,  H04N5/374

CPC分类号： H01L27/14634 ,  H01L21/76898 ,  H01L23/481 ,  H01L27/14612 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14645 ,  H01L27/14687 ,  H01L27/1469 ,  H01L2224/11 ,  H04N5/225 ,  H04N5/374

摘要： A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips.

摘要翻译： 提供了一种半导体器件作为背照式固态成像器件。 该器件通过将具有半成品状态的像素阵列的第一半导体晶片和具有半成品状态的逻辑电路的第二半导体晶片结合在一起而制造，使得第一半导体晶片成为薄膜，电 连接像素阵列和逻辑电路，使得像素阵列和逻辑电路成为成品状态，并将第一半导体晶片和第二半导体结合在一起成为微芯片。

公开(公告)号：US20110102657A1

公开(公告)日：2011-05-05

申请号：US12910014

申请日：2010-10-22

申请人： Hiroshi Takahashi ,  Taku Umebayashi

发明人： Hiroshi Takahashi ,  Taku Umebayashi

IPC分类号： H04N5/335 ,  H01L31/06 ,  H01L31/18

CPC分类号： H01L27/14636 ,  H01L21/76251 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/05 ,  H01L27/14632 ,  H01L27/14634 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14687 ,  H01L27/1469 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/18 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48463 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/12043 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2224/45099

摘要： A semiconductor device having a first semiconductor section including a first wiring layer at one side thereof; a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together with the respective first and second wiring layer sides of the first and second semiconductor sections facing each other; a conductive material extending through the first semiconductor section to the second wiring layer of the second semiconductor section and by means of which the first and second wiring layers are in electrical communication; and an opening, other than the opening for the conductive material, which extends through the first semiconductor section to the second wiring layer.

摘要翻译： 一种半导体器件，具有在其一侧包括第一布线层的第一半导体部分; 其一侧包括第二布线层的第二半导体部分，所述第一和第二半导体部分与所述第一和第二半导体部分的相应的第一和第二布线层侧面相互固定在一起; 导电材料，其延伸穿过所述第一半导体部分到所述第二半导体部分的所述第二布线层，并且所述第一和第二布线层与所述第二半导体部分电连通; 以及除了通过第一半导体部分延伸到第二布线层的导电材料的开口以外的开口。

公开(公告)号：US09496979B2

公开(公告)日：2016-11-15

申请号：US14236419

申请日：2012-08-02

申请人： Ken-ichi Sato ,  Hiroshi Hasegawa ,  Tomonobu Niwa ,  Hiroshi Takahashi ,  Toshio Watanabe

发明人： Ken-ichi Sato ,  Hiroshi Hasegawa ,  Tomonobu Niwa ,  Hiroshi Takahashi ,  Toshio Watanabe

IPC分类号： H04J14/00 ,  H04J14/02 ,  H04Q11/00

CPC分类号： H04J14/02 ,  H04J14/0212 ,  H04J14/0213 ,  H04J14/0217 ,  H04Q11/0005 ,  H04Q2011/0016 ,  H04Q2011/0024 ,  H04Q2011/0035 ,  H04Q2011/0052

摘要： Disclosed is a spatial switching apparatus having a plurality of input terminals, an input optical signal of a single wavelength being input to each of the plurality of the input terminals, and a plurality of output terminals an output optical signal of a single wavelength being output from each of the plurality of the output terminals. The apparatus includes a signal wavelength converting portion having an electric signal converting element converting the input optical signal into an electric signal and a variable wavelength laser, the signal wavelength converting portion using the variable wavelength laser to convert an electric signal converted by the electric signal converting element into an optical signal of an arbitrary wavelength; and a spatial switching portion having a plurality of first cyclic AWGs performing output from a plurality of output ports corresponding to wavelengths of a plurality of input signals input from the variable wavelength laser.

摘要翻译： 公开了一种空间切换装置，具有多个输入端子，单个波长的输入光信号输入到多个输入端子中的每一个，多个输出端子输出单个波长的输出光信号， 多个输出端子中的每一个。 该装置包括信号波长转换部分，其具有将输入光信号转换为电信号的电信号转换元件和可变波长激光器，信号波长转换部分使用可变波长激光器转换由电信号转换转换的电信号 元素变成任意波长的光信号; 以及具有多个第一循环AWG的空间切换部分，其执行从与所述可变波长激光器输入的多个输入信号的波长对应的多个输出端口的输出。

公开(公告)号：US09129793B2

公开(公告)日：2015-09-08

申请号：US13397346

申请日：2012-02-15

申请人： Tomihiko Ikeda ,  Hiroshi Takahashi ,  Shinichi Ushijima ,  Tetsuya Gouda ,  Kei Shimada

发明人： Tomihiko Ikeda ,  Hiroshi Takahashi ,  Shinichi Ushijima ,  Tetsuya Gouda ,  Kei Shimada

IPC分类号： H05B37/00 ,  H01J61/54

CPC分类号： H01J61/54 ,  H01J61/547

摘要： A high pressure discharge lamp with auxiliary lamp comprises: a high pressure discharge lamp having an arc tube and at least one sealing portion, a pair of main electrodes, and a pair of feeders supplying power to the main electrodes; an auxiliary lamp having an airtight case, an inner electrode, and an outer electrode, wherein the inner electrode is arranged at a position so as to part the inner space to large and small spaces, the outer electrode is arranged at a position so as to face the large space, the auxiliary lamp as arranged as the large space faces the sealing portion.

摘要翻译： 具有辅助灯的高压放电灯包括：具有电弧管和至少一个密封部分的一个高压放电灯，一对主电极和向主电极供电的一对馈电器; 具有气密壳体，内部电极和外部电极的辅助灯，其中，所述内部电极布置在将所述内部空间分成大小空间的位置，所述外部电极被布置在 面对大空间，辅助灯排列成大空间面向密封部分。