公开(公告)号：US11854787B2

公开(公告)日：2023-12-26

申请号：US17735006

申请日：2022-05-02

申请人： Intel Corporation

发明人： Richard E. Schenker ,  Robert L. Bristol ,  Kevin L. Lin ,  Florian Gstrein ,  James M. Blackwell ,  Marie Krysak ,  Manish Chandhok ,  Paul A. Nyhus ,  Charles H. Wallace ,  Curtis W. Ward ,  Swaminathan Sivakumar ,  Elliot N. Tan

IPC分类号： H01L23/528 ,  H01L23/522 ,  H01L23/532 ,  H01L27/088 ,  H01L29/78

CPC分类号： H01L23/528 ,  H01L23/5226 ,  H01L23/5329 ,  H01L23/53238 ,  H01L27/0886 ,  H01L29/7848

摘要： Advanced lithography techniques including sub-10 nm pitch patterning and structures resulting therefrom are described. Self-assembled devices and their methods of fabrication are described.

公开(公告)号：US10460993B2

公开(公告)日：2019-10-29

申请号：US15859327

申请日：2017-12-29

申请人： Intel Corporation

发明人： Tahir Ghani ,  Byron Ho ,  Curtis W. Ward ,  Michael L. Hattendorf ,  Christopher P. Auth

IPC分类号： H01L29/66 ,  H01L29/06 ,  H01L29/78 ,  H01L27/088 ,  H01L21/762 ,  H01L21/8234 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532 ,  H01L29/165 ,  H01L21/033 ,  H01L21/28 ,  H01L21/285 ,  H01L21/308 ,  H01L21/311 ,  H01L21/8238 ,  H01L23/528 ,  H01L27/092 ,  H01L27/11 ,  H01L49/02 ,  H01L29/08 ,  H01L29/51 ,  H01L27/02 ,  H01L29/417 ,  H01L21/02 ,  H01L29/167 ,  H01L23/00

摘要： Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. A first isolation structure separates a first end of a first portion of the fin from a first end of a second portion of the fin, the first end of the first portion of the fin having a depth. A gate structure is over the top of and laterally adjacent to the sidewalls of a region of the first portion of the fin. A second isolation structure is over a second end of a first portion of the fin, the second end of the first portion of the fin having a depth different than the depth of the first end of the first portion of the fin.

公开(公告)号：US10777656B2

公开(公告)日：2020-09-15

申请号：US16577993

申请日：2019-09-20

申请人： Intel Corporation

发明人： Tahir Ghani ,  Byron Ho ,  Curtis W. Ward ,  Michael L. Hattendorf ,  Christopher P. Auth

IPC分类号： H01L29/66 ,  H01L29/78 ,  H01L27/088 ,  H01L21/762 ,  H01L29/06 ,  H01L21/8234 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532 ,  H01L29/165 ,  H01L29/417 ,  H01L21/033 ,  H01L21/28 ,  H01L21/285 ,  H01L21/308 ,  H01L21/311 ,  H01L21/8238 ,  H01L23/528 ,  H01L27/092 ,  H01L27/11 ,  H01L49/02 ,  H01L29/08 ,  H01L29/51 ,  H01L27/02 ,  H01L21/02 ,  H01L29/167 ,  H01L23/00

摘要： Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. A first isolation structure separates a first end of a first portion of the fin from a first end of a second portion of the fin, the first end of the first portion of the fin having a depth. A gate structure is over the top of and laterally adjacent to the sidewalls of a region of the first portion of the fin. A second isolation structure is over a second end of a first portion of the fin, the second end of the first portion of the fin having a depth different than the depth of the first end of the first portion of the fin.

公开(公告)号：US09893167B2

公开(公告)日：2018-02-13

申请号：US15118838

申请日：2014-03-24

申请人： Intel Corporation

发明人： Seiyon Kim ,  Daniel A. Simon ,  Kelin J. Kuhn ,  Curtis W. Ward

IPC分类号： H01L29/06 ,  H01L29/423 ,  H01L29/66 ,  H01L21/764 ,  H01L29/786

CPC分类号： H01L29/66553 ,  B82Y10/00 ,  H01L21/764 ,  H01L29/0653 ,  H01L29/0673 ,  H01L29/42392 ,  H01L29/66439 ,  H01L29/66545 ,  H01L29/66742 ,  H01L29/775 ,  H01L29/78618 ,  H01L29/78696

摘要： A nanowire device having a plurality of internal spacers and a method for forming said internal spacers are disclosed. In an embodiment, a semiconductor device comprises a nanowire stack disposed above a substrate, the nanowire stack having a plurality of vertically-stacked nanowires, a gate structure wrapped around each of the plurality of nanowires, defining a channel region of the device, the gate structure having gate sidewalls, a pair of source/drain regions on opposite sides of the channel region; and an internal spacer on a portion of the gate sidewall between two adjacent nanowires, internal to the nanowire stack. In an embodiment, the internal spacers are formed by depositing photo-definable spacer material in dimples etched adjacent to the channel region. Photo-definable material remains in the dimples by altering the etch characteristics of material outside of the dimples and selectively removing altered photo-definable material outside of the dimples.

公开(公告)号：US12016170B2

公开(公告)日：2024-06-18

申请号：US18124936

申请日：2023-03-22

申请人： Intel Corporation

发明人： Tahir Ghani ,  Byron Ho ,  Curtis W. Ward ,  Michael L. Hattendorf ,  Christopher P. Auth

IPC分类号： H10B10/00 ,  H01L27/06 ,  H01L27/092 ,  H01L29/66

CPC分类号： H10B10/15 ,  H01L27/0688 ,  H01L27/0924 ,  H01L29/66545 ,  H10B10/125

摘要： Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. A first isolation structure separates a first end of a first portion of the fin from a first end of a second portion of the fin, the first end of the first portion of the fin having a depth. A gate structure is over the top of and laterally adjacent to the sidewalls of a region of the first portion of the fin. A second isolation structure is over a second end of a first portion of the fin, the second end of the first portion of the fin having a depth different than the depth of the first end of the first portion of the fin.

公开(公告)号：US11646359B2

公开(公告)日：2023-05-09

申请号：US17233063

申请日：2021-04-16

申请人： Intel Corporation

发明人： Tahir Ghani ,  Byron Ho ,  Curtis W. Ward ,  Michael L. Hattendorf ,  Christopher P. Auth

IPC分类号： H01L29/66 ,  H01L29/78 ,  H01L27/088 ,  H01L21/762 ,  H01L29/06 ,  H01L21/8234 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532 ,  H01L29/165 ,  H01L29/417 ,  H01L21/033 ,  H01L21/28 ,  H01L21/285 ,  H01L21/308 ,  H01L21/311 ,  H01L21/8238 ,  H01L23/528 ,  H01L27/092 ,  H01L27/11 ,  H01L49/02 ,  H01L29/08 ,  H01L29/51 ,  H01L27/02 ,  H01L21/02 ,  H01L29/167 ,  H01L23/00

CPC分类号： H01L29/66545 ,  H01L21/02532 ,  H01L21/02636 ,  H01L21/0337 ,  H01L21/28247 ,  H01L21/28518 ,  H01L21/28568 ,  H01L21/3086 ,  H01L21/31105 ,  H01L21/31144 ,  H01L21/76224 ,  H01L21/76232 ,  H01L21/76801 ,  H01L21/76802 ,  H01L21/76816 ,  H01L21/76834 ,  H01L21/76846 ,  H01L21/76849 ,  H01L21/76877 ,  H01L21/76897 ,  H01L21/823431 ,  H01L21/823481 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823821 ,  H01L21/823828 ,  H01L21/823842 ,  H01L21/823857 ,  H01L21/823871 ,  H01L21/823878 ,  H01L23/528 ,  H01L23/5226 ,  H01L23/5283 ,  H01L23/5329 ,  H01L23/53209 ,  H01L23/53238 ,  H01L23/53266 ,  H01L27/0207 ,  H01L27/0886 ,  H01L27/0922 ,  H01L27/0924 ,  H01L27/1104 ,  H01L28/20 ,  H01L28/24 ,  H01L29/0649 ,  H01L29/0653 ,  H01L29/0847 ,  H01L29/165 ,  H01L29/167 ,  H01L29/41783 ,  H01L29/41791 ,  H01L29/516 ,  H01L29/6653 ,  H01L29/6656 ,  H01L29/66636 ,  H01L29/66795 ,  H01L29/66818 ,  H01L29/785 ,  H01L29/7843 ,  H01L29/7845 ,  H01L29/7846 ,  H01L29/7848 ,  H01L29/7851 ,  H01L29/7854 ,  H01L21/0217 ,  H01L21/02164 ,  H01L21/0332 ,  H01L21/76883 ,  H01L21/76885 ,  H01L21/823437 ,  H01L21/823475 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L29/665 ,  H01L29/7842 ,  H01L29/7853 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204

摘要： Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. A first isolation structure separates a first end of a first portion of the fin from a first end of a second portion of the fin, the first end of the first portion of the fin having a depth. A gate structure is over the top of and laterally adjacent to the sidewalls of a region of the first portion of the fin. A second isolation structure is over a second end of a first portion of the fin, the second end of the first portion of the fin having a depth different than the depth of the first end of the first portion of the fin.

公开(公告)号：US11145541B2

公开(公告)日：2021-10-12

申请号：US16637930

申请日：2017-09-30

申请人： Intel Corporation

发明人： Charles H. Wallace ,  Reken Patel ,  Hyunsoo Park ,  Mohit K. Haran ,  Debashish Basu ,  Curtis W. Ward ,  Ruth A. Brain

IPC分类号： H01L21/768 ,  H01L21/311 ,  H01L23/522

摘要： Conductive via and metal line end fabrication is described. In an example, an interconnect structure includes a first inter-layer dielectric (ILD) on a hardmask layer, where the ILD includes a first ILD opening and a second ILD opening. The interconnect structure further includes an etch stop layer (ESL) on the ILD layer, where the ESL includes a first ESL opening aligned with the first ILD opening to form a first via opening, and where the ESL layer includes a second ESL opening aligned with the second ILD opening. The interconnect structure further includes a first via in the first via opening, a second ILD layer on the first ESL, and a metal line in the second ILD layer, where the metal line is in contact with the first via, and where the metal line includes a first metal opening, and where the metal line includes a second metal opening aligned with the second ILD opening and the ESL opening to form a second via opening. The interconnect structure further includes a metal line end in the first metal opening and further includes a second via in the metal line, where the second via is in the second via opening.

公开(公告)号：US11373950B2

公开(公告)日：2022-06-28

申请号：US17110215

申请日：2020-12-02

申请人： Intel Corporation

发明人： Richard E. Schenker ,  Robert L. Bristol ,  Kevin L. Lin ,  Florian Gstrein ,  James M. Blackwell ,  Marie Krysak ,  Manish Chandhok ,  Paul A. Nyhus ,  Charles H. Wallace ,  Curtis W. Ward ,  Swaminathan Sivakumar ,  Elliot N. Tan

IPC分类号： H01L23/528 ,  H01L23/522 ,  H01L23/532 ,  H01L27/088 ,  H01L29/78

摘要： Advanced lithography techniques including sub-10 nm pitch patterning and structures resulting therefrom are described. Self-assembled devices and their methods of fabrication are described.

公开(公告)号：US11063133B2

公开(公告)日：2021-07-13

申请号：US16925573

申请日：2020-07-10

申请人： Intel Corporation

发明人： Tahir Ghani ,  Byron Ho ,  Curtis W. Ward ,  Michael L. Hattendorf ,  Christopher P. Auth

IPC分类号： H01L29/66 ,  H01L29/78 ,  H01L27/088 ,  H01L21/762 ,  H01L29/06 ,  H01L21/8234 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532 ,  H01L29/165 ,  H01L29/417 ,  H01L21/033 ,  H01L21/28 ,  H01L21/285 ,  H01L21/308 ,  H01L21/311 ,  H01L21/8238 ,  H01L23/528 ,  H01L27/092 ,  H01L27/11 ,  H01L49/02 ,  H01L29/08 ,  H01L29/51 ,  H01L27/02 ,  H01L21/02 ,  H01L29/167 ,  H01L23/00

摘要： Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a fin. A first isolation structure separates a first end of a first portion of the fin from a first end of a second portion of the fin, the first end of the first portion of the fin having a depth. A gate structure is over the top of and laterally adjacent to the sidewalls of a region of the first portion of the fin. A second isolation structure is over a second end of a first portion of the fin, the second end of the first portion of the fin having a depth different than the depth of the first end of the first portion of the fin.

公开(公告)号：US10892223B2

公开(公告)日：2021-01-12

申请号：US16346873

申请日：2016-12-23

申请人： Intel Corporation

发明人： Richard E. Schenker ,  Robert L. Bristol ,  Kevin L. Lin ,  Florian Gstrein ,  James M. Blackwell ,  Marie Krysak ,  Manish Chandhok ,  Paul A. Nyhus ,  Charles H. Wallace ,  Curtis W. Ward ,  Swaminathan Sivakumar ,  Elliot N. Tan

IPC分类号： H01L23/528 ,  H01L23/522 ,  H01L23/532 ,  H01L27/088 ,  H01L29/78

摘要： Advanced lithography techniques including sub-10 nm pitch patterning and structures resulting therefrom are described. Self-assembled devices and their methods of fabrication are described.