公开(公告)号：US20070004316A1

公开(公告)日：2007-01-04

申请号：US11452609

申请日：2006-06-13

申请人： Jalal Ashjaee ,  Boris Govzman ,  Bernard Frey ,  Boguslaw Nagorski ,  Douglas Young ,  Bulent Basol ,  Homayoun Talieh

发明人： Jalal Ashjaee ,  Boris Govzman ,  Bernard Frey ,  Boguslaw Nagorski ,  Douglas Young ,  Bulent Basol ,  Homayoun Talieh

IPC分类号： B24B51/00 ,  B24B7/00

CPC分类号： H01L21/67745 ,  B24B37/345 ,  G05B19/41865 ,  G05B2219/32272 ,  G05B2219/45031 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67219 ,  H01L21/68707 ,  H01L21/68728 ,  Y02P90/20

摘要： An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.

摘要翻译： 提供了用于化学机械加工，清洁和干燥半导体工件的集成工艺工具。 集成工艺工具包括CMP模块和清洁和干燥模块。 在处理之后，使用可动壳体将工件从CMP模块传送到清洁和干燥模块。 在清洁和干燥模块中，使用清洁机构来清洁工件，同时工件被可移动壳体的支撑结构旋转并保持。 清洁和干燥模块的干燥机构从可移动的壳体上拾取工件并使其干燥。 在整个CMP过程中，清洁和干燥，晶片的经处理表面面朝下。

公开(公告)号：US20050133379A1

公开(公告)日：2005-06-23

申请号：US10822424

申请日：2004-04-12

申请人： Bulent Basol ,  Jalal Ashjaee ,  Boris Govzman ,  Homayoun Talieh ,  Bernard Frey

发明人： Bulent Basol ,  Jalal Ashjaee ,  Boris Govzman ,  Homayoun Talieh ,  Bernard Frey

IPC分类号： B24B37/04 ,  C25D5/02 ,  C25D5/06 ,  C25D5/22 ,  C25D7/12 ,  C25F7/00 ,  H01L21/00 ,  H01L21/288 ,  H01L21/321 ,  B23H9/00

CPC分类号： B24B37/046 ,  B24B37/20 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/32115 ,  H01L21/32125 ,  H01L21/67075 ,  H01L21/6715

摘要： An apparatus for electropolishing a conductive layer on a wafer using a solution is disclosed. The apparatus comprises an electrode assembly immersed in the solution configured proximate to the conductive layer having a longitudinal dimension extending to at least a periphery of the wafer, the electrode assembly including an elongated contact electrode configured to receive a potential difference, an isolator adjacent the elongated contact electrode, and an elongated process electrode adjacent the isolator configured to receive the potential difference, a voltage supply is configured to supply the potential difference between the contact electrode and the process electrode to electropolish the conductive layer on the wafer.

摘要翻译： 公开了一种使用溶液对晶片上的导电层进行电解抛光的装置。 该装置包括浸入在靠近导电层配置的溶液中的电极组件，其具有延伸至晶片的至少周边的纵向尺寸，电极组件包括构造成接收电位差的细长接触电极，邻近细长的隔离器 接触电极和邻近隔离器的细长工艺电极，其被配置为接收电位差，电压源被配置为提供接触电极和处理电极之间的电位差以对晶片上的导电层进行电解抛光。

公开(公告)号：US20160368055A1

公开(公告)日：2016-12-22

申请号：US15186277

申请日：2016-06-17

申请人： Bharath Swaminathan ,  Ajey M. Joshi ,  Nag B. Patibandla ,  Hou T. Ng ,  Ashavani Kumar ,  Eric Ng ,  Bernard Frey ,  Kasiraman Krishnan

发明人： Bharath Swaminathan ,  Ajey M. Joshi ,  Nag B. Patibandla ,  Hou T. Ng ,  Ashavani Kumar ,  Eric Ng ,  Bernard Frey ,  Kasiraman Krishnan

IPC分类号： B22F3/105 ,  B33Y30/00 ,  B23K26/16 ,  B22F3/10 ,  B23K26/342 ,  B33Y10/00 ,  B33Y50/02

CPC分类号： B22F3/1055 ,  B22F2003/1057 ,  B23K26/16 ,  B23K26/342 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/14 ,  B23K2103/26 ,  B29C64/153 ,  B29C64/245 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  Y02P10/295

摘要： A method of additive manufacturing include delivering at least one layer by either depositing a uniform layer of powder on a support and then removing a portion of the layer with a roller with a surface having spatially controlled electrostatic charge, or by depositing powder onto the surface of the roller and moving the roller relative to a support such that the spatially controllable electrostatic charge on the surface of the roller causes transfer of a corresponding portion of the powder from the roller onto the support or an underlying layer.

摘要翻译： 添加剂制造的方法包括通过在支撑体上沉积均匀的粉末层，然后用具有空间控制静电荷的表面的辊去除一部分层，或通过将粉末沉积在 辊子并相对于支撑件移动辊子，使得辊子表面上的空间可控静电电荷使得相应部分的粉末从辊转移到支撑件或下层上。

公开(公告)号：US20170014911A1

公开(公告)日：2017-01-19

申请号：US15212098

申请日：2016-07-15

申请人： Hou T. Ng ,  Nag B. Patibandla ,  Ajey M. Joshi ,  Bharath Swaminathan ,  Ashavani Kumar ,  Eric Ng ,  Bernard Frey ,  Kasiraman Krishnan

发明人： Hou T. Ng ,  Nag B. Patibandla ,  Ajey M. Joshi ,  Bharath Swaminathan ,  Ashavani Kumar ,  Eric Ng ,  Bernard Frey ,  Kasiraman Krishnan

IPC分类号： B22F7/02 ,  B33Y10/00 ,  B33Y30/00 ,  B22F3/105

CPC分类号： B22F3/1055 ,  B22F1/0014 ,  B22F1/0059 ,  B22F3/008 ,  B22F2003/1056 ,  B22F2003/1057 ,  B22F2207/13 ,  B22F2998/10 ,  B22F2999/00 ,  B29C64/153 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  Y02P10/295

摘要： Additive manufacturing includes successively forming a plurality of layers on a support. Depositing a layer from the plurality of layers includes dispensing first particles, selectively dispensing second particles in selected regions corresponding to a surface of the object, and fusing at least a portion of the layer. The layer has the first particles throughout and the second particles in the selected regions. Alternatively or in addition, forming the plurality of layers includes depositing multiple groups of layers. Depositing a group of layers includes, for each layer in the group of layers dispensing a feed material to provide the layer, and after dispensing the feed material and before dispensing a subsequent layer fusing a selected portion of the layer. After all layers in the group of layers are dispensed, a volume of the group of layers that extends through all the layers in the group of layers is fused.

摘要翻译： 添加剂制造包括在载体上连续形成多个层。 从多个层沉积层包括分配第一颗粒，在对应于物体的表面的选定区域中选择性地分配第二颗粒，并熔融该层的至少一部分。 该层具有整个的第一颗粒和所选区域中的第二颗粒。 或者或另外，形成多个层包括沉积多组层。 沉积一组层包括分配给料材料以提供层的层组中的每个层，以及在分配进料之后以及在分配融合所述层的选定部分的后续层之后。 在一组层中的所有层分配之后，延伸穿过该组层中的所有层的一组层的体积被熔合。

公开(公告)号：US20160379851A1

公开(公告)日：2016-12-29

申请号：US15195766

申请日：2016-06-28

申请人： Bharath Swaminathan ,  Eric Ng ,  Nag B. Patibandla ,  Hou T. Ng ,  Ashavani Kumar ,  Ajey M. Joshi ,  Bernard Frey ,  Kasiraman Krishnan

发明人： Bharath Swaminathan ,  Eric Ng ,  Nag B. Patibandla ,  Hou T. Ng ,  Ashavani Kumar ,  Ajey M. Joshi ,  Bernard Frey ,  Kasiraman Krishnan

IPC分类号： H01L21/67 ,  H01L21/677 ,  C23C16/455 ,  H01J37/32 ,  C23C16/50

CPC分类号： H01L21/67115 ,  B22F3/008 ,  B22F3/1055 ,  B22F2003/1056 ,  B22F2999/00 ,  C23C16/481 ,  C23C16/505 ,  H01J37/32724 ,  H01J37/32743 ,  H01L21/02274 ,  H01L21/0262 ,  H01L21/28556 ,  H01L21/3065 ,  H01L21/31116 ,  H01L21/31138 ,  H01L21/32136 ,  Y02P10/295 ,  B22F2202/13

摘要： A semiconductor processing system includes a vacuum chamber, a gas source configured to supply a gas to the chamber, a platen having a top surface in the chamber to support a substrate, the platen including a conductive plate, a robot to transport the substrate onto and off of the platen, a first plurality of lamps disposed below the top surface of the platen to heat the platen, and an RF power source to generate a plasma in the chamber above the platen.

摘要翻译： 半导体处理系统包括真空室，被配置为向腔室供应气体的气源，具有在腔室中的顶表面支撑衬底的压板，压板包括导电板，机器人将衬底输送到 离开压板，布置在压板顶部表面下方以加热压板的第一组多个灯，以及RF电源，以在压板上方的腔室中产生等离子体。

公开(公告)号：US20170021419A1

公开(公告)日：2017-01-26

申请号：US15213277

申请日：2016-07-18

申请人： Hou T. Ng ,  Bharath Swaminathan ,  Nag B. Patibandla ,  Ajey M. Joshi ,  Ashavani Kumar ,  Eric Ng ,  Bernard Frey ,  Kasiraman Krishnan

发明人： Hou T. Ng ,  Bharath Swaminathan ,  Nag B. Patibandla ,  Ajey M. Joshi ,  Ashavani Kumar ,  Eric Ng ,  Bernard Frey ,  Kasiraman Krishnan

IPC分类号： B22F3/105 ,  B28B1/00 ,  B33Y10/00 ,  C04B35/64 ,  B33Y40/00 ,  B23K26/342 ,  B23K26/70 ,  H05B3/00 ,  B29C67/00 ,  B33Y30/00

CPC分类号： B22F3/1055 ,  B22F2003/1056 ,  B22F2003/1057 ,  B22F2203/11 ,  B22F2998/10 ,  B22F2999/00 ,  B29C64/153 ,  B29K2105/251 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  H05B3/0057 ,  H05B3/0061 ,  H05B2203/032 ,  Y02P10/295 ,  B22F1/0085

摘要： An additive manufacturing system includes a platen having a top surface to support an object being manufactured, a dispenser to deliver a plurality of successive layers of feed material over the platen, an energy source positioned above the platen to direct a beam to fuse at least some of an outermost layer of feed material, and a plurality of lamps disposed above the platen and around the energy source to radiatively heat the outermost layer of feed material.

摘要翻译： 添加剂制造系统包括具有用于支撑待制造物体的顶表面的压板，用于在压板上方输送多个连续的进料材料层的分配器，位于压板上方的能量源，以引导束熔化至少一些 的最外层进料材料，以及多个灯，其设置在压板上方和能量源周围，以辐射加热进料的最外层。

公开(公告)号：US20160368077A1

公开(公告)日：2016-12-22

申请号：US15186247

申请日：2016-06-17

申请人： Bharath Swaminathan ,  Eric Ng ,  Nag B. Patibandla ,  Hou T. Ng ,  Ajey M. Joshi ,  Ashavani Kumar ,  Bernard Frey ,  Kasiraman Krishnan

发明人： Bharath Swaminathan ,  Eric Ng ,  Nag B. Patibandla ,  Hou T. Ng ,  Ajey M. Joshi ,  Ashavani Kumar ,  Bernard Frey ,  Kasiraman Krishnan

IPC分类号： B23K10/00 ,  H01J37/305 ,  H05H1/30 ,  B25J9/00 ,  B23K26/36

CPC分类号： H01J37/3056 ,  B22F2003/247 ,  B22F2998/10 ,  B22F2999/00 ,  B23K10/003 ,  B23K10/006 ,  B23K26/032 ,  B23K26/0884 ,  B23K26/127 ,  B23K26/352 ,  B23K26/355 ,  B23K26/36 ,  B23K2103/05 ,  B23K2103/14 ,  B23K2103/26 ,  B23K2103/42 ,  B23K2103/52 ,  B25J9/0096 ,  B29C64/188 ,  B29C64/35 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y50/02 ,  H01J37/321 ,  H01J37/32366 ,  H01J2237/3174 ,  H01J2237/31749 ,  H05H1/2406 ,  H05H1/30 ,  H05H2001/245 ,  H05H2245/123 ,  Y10S901/42 ,  B22F3/008 ,  B22F3/1055 ,  B22F2202/13

摘要： An apparatus for surface modification includes a support to hold a workpiece, a plasma source to generate a plasma in a localized region that is smaller than the workpiece, and a six-axis robot to manipulate relative positioning of the workpiece and the plasma source. The six-axis robot is coupled to at least one of the support and the plasma source.

摘要翻译： 用于表面改性的装置包括用于保持工件的支撑件，等离子体源以在小于工件的局部区域中产生等离子体;以及六轴机器人来操纵工件和等离子体源的相对定位。 六轴机器人耦合到支撑件和等离子体源中的至少一个。

公开(公告)号：US20170014906A1

公开(公告)日：2017-01-19

申请号：US15211872

申请日：2016-07-15

申请人： Hou T. Ng ,  Nag B. Patibandla ,  Ajey M. Joshi ,  Bharath Swaminathan ,  Ashavani Kumar ,  Eric Ng ,  Bernard Frey ,  Kasiraman Krishnan

发明人： Hou T. Ng ,  Nag B. Patibandla ,  Ajey M. Joshi ,  Bharath Swaminathan ,  Ashavani Kumar ,  Eric Ng ,  Bernard Frey ,  Kasiraman Krishnan

IPC分类号： B22F3/105 ,  B33Y30/00 ,  B33Y10/00 ,  H05B3/00 ,  B28B17/00 ,  B33Y40/00 ,  B23K26/342 ,  B23K26/70 ,  B29C67/00 ,  B28B1/00

摘要： An additive manufacturing system includes a platen having a top surface to support an object being manufactured, a feed material dispenser to deliver a plurality of successive layers of feed material over the platen, an energy source positioned above the platen to fuse at least a portion of an outermost layer of feed material, and a coolant fluid dispenser to deliver a coolant fluid onto the outermost layer of feed material after at least a portion of the outermost layer has been fused.

摘要翻译： 添加剂制造系统包括具有用于支撑正在制造的物体的顶表面的压板，用于在压板上方输送多个连续的进料材料层的进料分配器，位于压板上方的能量源，以将至少一部分 最外层的进料，以及冷却剂流体分配器，用于在最外层的至少一部分熔融之后将冷却剂流体输送到进料的最外层上。

公开(公告)号：US20160368056A1

公开(公告)日：2016-12-22

申请号：US15185996

申请日：2016-06-17

申请人： Bharath Swaminathan ,  Ajey M. Joshi ,  Nag B. Patibandla ,  Hou T. Ng ,  Ashavani Kumar ,  Eric Ng ,  Bernard Frey ,  Kasiraman Krishnan

发明人： Bharath Swaminathan ,  Ajey M. Joshi ,  Nag B. Patibandla ,  Hou T. Ng ,  Ashavani Kumar ,  Eric Ng ,  Bernard Frey ,  Kasiraman Krishnan

IPC分类号： B22F3/16 ,  B28B1/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B23K26/144 ,  B22F3/105 ,  B22F3/02 ,  B23K26/00 ,  B23K26/342 ,  B23K26/60 ,  B29C67/00 ,  B22F1/02

CPC分类号： B23K26/144 ,  B22F1/02 ,  B22F3/1055 ,  B22F2003/1056 ,  B22F2999/00 ,  B23K10/00 ,  B23K26/082 ,  B23K26/1224 ,  B23K26/127 ,  B23K26/342 ,  B23K26/346 ,  B23K26/60 ,  B23K2103/05 ,  B23K2103/26 ,  B23K2103/52 ,  B29C64/153 ,  B29K2995/0006 ,  B33Y10/00 ,  B33Y30/00 ,  Y02P10/295 ,  B22F2202/06

摘要： An additive manufacturing system includes a platen, a dispenser apparatus configured to deliver a layer of powder onto the platen or a previously dispensed layer on the platen, a voltage source coupled to the platen and configured to apply a voltage to the platen to create an electrostatic attraction of the powder to the platen sufficient to compact the powder, and an energy source configured to apply sufficient energy to the powder to fuse the powder.

摘要翻译： 添加剂制造系统包括压板，分配器装置，其被配置为将粉末层输送到压板上或压板上的预先分配的层，电压源，耦合到压板并构造成向压板施加电压以产生静电 将粉末吸引到压板足以压​​实粉末，以及能量源，其被配置为向粉末施加足够的能量以熔化粉末。