公开(公告)号：US08018075B2

公开(公告)日：2011-09-13

申请号：US12501309

申请日：2009-07-10

Applicant: Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Ho Ming Tong ,  Jian Cheng Chen ,  Wei Chi Yih ,  Chang Ying Hung

Inventor： Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Ho Ming Tong ,  Jian Cheng Chen ,  Wei Chi Yih ,  Chang Ying Hung

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L24/85 ,  H01L23/3128 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85201 ,  H01L2224/85375 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A wire bonding structure of a semiconductor package includes a bonding wire, a pad and a non-conductive adhesive material. The bonding wire includes a line portion and a block portion, wherein the block portion is physically connected to the line portion, and the sectional area of the block portion is bigger than that of the line portion. The pad is bonded to the block portion. The non-conductive adhesive material covers the pad and seals the whole block portion of the bonding wire.

Abstract translation: 半导体封装的引线接合结构包括接合线，焊盘和非导电粘合材料。 接合线包括线部分和块部分，其中块部分物理连接到线部分，并且块部分的截面积大于线部分的截面面积。 焊盘粘合到块部分。 非导电粘合剂材料覆盖焊盘并密封焊丝的整个块部分。

公开(公告)号：US08076786B2

公开(公告)日：2011-12-13

申请号：US12501693

申请日：2009-07-13

Applicant: Chang Ying Hung ,  Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Jian Cheng Chen ,  Wei Chi Yih ,  Ho Ming Tong

Inventor： Chang Ying Hung ,  Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Jian Cheng Chen ,  Wei Chi Yih ,  Ho Ming Tong

IPC: H01L23/488

CPC classification number: H01L24/85 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/92247 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A wire bonding structure includes a chip and a bonding wire. The chip includes a base material, at least one first metallic pad, a re-distribution layer and at least one second metallic pad. The first metallic pad is disposed on the base material. The re-distribution layer has a first end and a second end, and the first end is electrically connected to the first metallic pad. The second metallic pad is electrically connected to the second end of the re-distribution layer. The bonding wire is bonded to the second metallic pad.

Abstract translation: 引线键合结构包括芯片和接合线。 芯片包括基材，至少一个第一金属垫，再分布层和至少一个第二金属垫。 第一金属垫设置在基材上。 再分布层具有第一端和第二端，并且第一端电连接到第一金属垫。 第二金属垫电连接到再分配层的第二端。 接合线接合到第二金属垫。

公开(公告)号：US08053906B2

公开(公告)日：2011-11-08

申请号：US12501285

申请日：2009-07-10

Applicant: Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Ho Ming Tong ,  Jian Cheng Chen ,  Wei Chi Yih ,  Chang Ying Hung ,  Cheng Tsung Hsu ,  Chih Cheng Hung

Inventor： Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Ho Ming Tong ,  Jian Cheng Chen ,  Wei Chi Yih ,  Chang Ying Hung ,  Cheng Tsung Hsu ,  Chih Cheng Hung

IPC: H01L23/48

CPC classification number: H01L24/85 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85047 ,  H01L2224/85201 ,  H01L2224/85365 ,  H01L2224/85947 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2924/00012

Abstract: A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the cross-sectional area of the non-spherical block portion is bigger than that of the line portion.

Abstract translation: 铜接合线包括线部分和非球形块部分。 非球形块部分物理连接到线路部分，非球形块部分的横截面面积大于线路部分的横截面面积。

公开(公告)号：US08110931B2

公开(公告)日：2012-02-07

申请号：US12501246

申请日：2009-07-10

Applicant: Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Ho Ming Tong ,  Jian Cheng Chen ,  Wei Chi Yih ,  Chang Ying Hung ,  Cheng Wei Huang ,  Chih Hsing Chen ,  Tai Yuan Huang ,  Chieh Ting Chen ,  Yi Tsai Lu

Inventor： Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Ho Ming Tong ,  Jian Cheng Chen ,  Wei Chi Yih ,  Chang Ying Hung ,  Cheng Wei Huang ,  Chih Hsing Chen ,  Tai Yuan Huang ,  Chieh Ting Chen ,  Yi Tsai Lu

IPC: H01L23/48

CPC classification number: H01L24/85 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05017 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05169 ,  H01L2224/05556 ,  H01L2224/05557 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05618 ,  H01L2224/05623 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05649 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05672 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48507 ,  H01L2224/48609 ,  H01L2224/48611 ,  H01L2224/48618 ,  H01L2224/48623 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48649 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48666 ,  H01L2224/48669 ,  H01L2224/48672 ,  H01L2224/48809 ,  H01L2224/48818 ,  H01L2224/48823 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48849 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/48866 ,  H01L2224/48872 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85375 ,  H01L2224/8581 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/00 ,  H01L2224/48811 ,  H01L2224/48869 ,  H01L2924/00012

Abstract: A wafer defines a plurality of chips arranged in array manner. Each chip includes at least one aluminum pad and a middle material. The middle material covers the aluminum pad and is mounted on the aluminum pad.

Abstract translation: 晶片限定以阵列方式布置的多个芯片。 每个芯片包括至少一个铝焊盘和中间材料。 中间材料覆盖铝垫，并安装在铝垫上。

公开(公告)号：US07709913B2

公开(公告)日：2010-05-04

申请号：US12038914

申请日：2008-02-28

Applicant: Jian Cheng Chen

Inventor： Jian Cheng Chen

IPC: H01L31/0203 ,  H01L31/18

CPC classification number: H01L27/14618 ,  G02B7/02 ,  H01L27/14625 ,  H01L2224/45144 ,  H01L2224/48091 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An image sensor package includes a substrate, a sensor chip, a frame, a lens element and at least a pair of guide pins. The sensor chip is mounted on the substrate, and has two opposite sides and a sensing region, which has a sensing region central axis. The frame is mounted on the substrate, and has an aperture and an inner space with the sensor chip disposed therein. The lens element is disposed inside the aperture and has a lens central axis. The guide pins locate oppositely inside the inner space of the frame with an interval between the tips of the guide pins substantially identical to the distance between the opposite sides of the sensor chip, wherein the central line of the interval between the tips of the guide pins defines a positioning line, which substantially coincides with the lens central axis; wherein the tip of each guide pin is aligned with one of the opposite sides of the sensor chip such that the positioning line is substantially coincided with the sensing region central axis.

Abstract translation: 图像传感器封装包括基板，传感器芯片，框架，透镜元件和至少一对引导销。 传感器芯片安装在基板上，并且具有两个相对的侧面和一个具有感测区域中心轴的感测区域。 框架安装在基板上，并且具有孔和内部空间，传感器芯片设置在其中。 透镜元件设置在孔内并具有透镜中心轴线。 引导销相对地位于框架的内部空间内，引导销的顶端之间的间隔基本上与传感器芯片的相对侧之间的距离相同，其中导向销的尖端之间的间隔的中心线 限定了基本上与透镜中心轴线重合的定位线; 其中每个引导销的尖端与传感器芯片的相对侧中的一个对准，使得定位线基本上与感测区域中心轴线重合。

公开(公告)号：US20100007011A1

公开(公告)日：2010-01-14

申请号：US12501693

申请日：2009-07-13

Applicant: Chang Ying HUNG ,  Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Jian Cheng Chen ,  Wei Chi Yih ,  Ho Ming Tong

Inventor： Chang Ying HUNG ,  Hsiao Chuan Chang ,  Tsung Yueh Tsai ,  Yi Shao Lai ,  Jian Cheng Chen ,  Wei Chi Yih ,  Ho Ming Tong

IPC: H01L23/488 ,  H01L21/56 ,  H01L21/60

CPC classification number: H01L24/85 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/92247 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A wire bonding structure includes a chip and a bonding wire. The chip includes a base material, at least one first metallic pad, a re-distribution layer and at least one second metallic pad. The first metallic pad is disposed on the base material. The re-distribution layer has a first end and a second end, and the first end is electrically connected to the first metallic pad. The second metallic pad is electrically connected to the second end of the re-distribution layer. The bonding wire is bonded to the second metallic pad.

Abstract translation: 引线键合结构包括芯片和接合线。 芯片包括基材，至少一个第一金属垫，再分布层和至少一个第二金属垫。 第一金属垫设置在基材上。 再分布层具有第一端和第二端，并且第一端电连接到第一金属垫。 第二金属垫电连接到再分配层的第二端。 接合线接合到第二金属垫。