公开(公告)号：US08488316B2

公开(公告)日：2013-07-16

申请号：US13074539

申请日：2011-03-29

申请人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Qi-Feng Ye ,  Xue-Tao Guo ,  Ai-Xing Tong

发明人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Qi-Feng Ye ,  Xue-Tao Guo ,  Ai-Xing Tong

IPC分类号： H05K7/20

CPC分类号： H05K7/209 ,  H01L24/34 ,  H01L24/45 ,  H01L2224/0603 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01047 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H02M7/003 ,  H05K5/065 ,  H05K7/1432 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power module includes a first power chip and a second power chip, each of which has at least two electrodes. The power module is applied to a power converter having a power density higher than 15 W/inch3 and a maximum efficiency higher than 92%, or to a power converter having a power density higher than 20 W/inch3 or having a maximum efficiency higher than 93%. At least one of the power chips operates at a frequency higher than 25 kHz.

摘要翻译： 功率模块包括第一功率芯片和第二功率芯片，每个芯片具有至少两个电极。 功率模块被应用于功率密度高于15W / inch 3且最大效率高于92％的功率转换器，或者功率密度高于20W / inch 3的功率转换器或具有高于 93％。 功率芯片中的至少一个以高于25kHz的频率工作。

公开(公告)号：US20120014069A1

公开(公告)日：2012-01-19

申请号：US13049322

申请日：2011-03-16

申请人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Qi-Feng Ye ,  Yi-Cheng Lin

发明人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Qi-Feng Ye ,  Yi-Cheng Lin

IPC分类号： H05K7/20 ,  H05K13/04 ,  H05K3/34

CPC分类号： H01L23/4334 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/115 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48135 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H02M7/003 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power module includes a first heat sink, first and second power chips, a thermo-conductive insulating layer, a lead frame and a molding compound. The first heat sink has a first area and a second area. The first power chip is disposed in the first area. The thermo-conductive insulating layer is disposed in the second area. The second power chip is disposed on the heat sink through the thermo-conductive insulating layer. The lead frame is electrically connected to at least one of the first and second power chips. The molding compound covers the first and second power chips, the thermo-conductive insulating layer and a portion of the lead frame. The first heat sink is electrically connected to at least one of the first and second power chips. Because the first power chip is not disposed on the first heat sink through the thermo-conductive insulating layer, the cost can be reduced.

摘要翻译： 功率模块包括第一散热器，第一和第二功率芯片，热导绝缘层，引线框架和模塑料。 第一散热器具有第一区域和第二区域。 第一功率芯片设置在第一区域中。 热导绝缘层设置在第二区域中。 第二功率芯片通过热导绝缘层设置在散热片上。 引线框架电连接到第一和第二功率芯片中的至少一个。 模制化合物覆盖第一和第二功率芯片，热导绝缘层和引线框架的一部分。 第一散热器电连接到第一和第二功率芯片中的至少一个。 由于第一功率芯片不通过导热绝缘层设置在第一散热器上，所以可以降低成本。

公开(公告)号：US08472196B2

公开(公告)日：2013-06-25

申请号：US13049322

申请日：2011-03-16

申请人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Qi-Feng Ye ,  Yi-Cheng Lin

发明人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Qi-Feng Ye ,  Yi-Cheng Lin

IPC分类号： H05K7/20 ,  H05K13/04 ,  H05K3/34

CPC分类号： H01L23/4334 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/115 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48135 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H02M7/003 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power module includes a first heat sink, first and second power chips, a thermo-conductive insulating layer, a lead frame and a molding compound. The first heat sink has a first area and a second area. The first power chip is disposed in the first area. The thermo-conductive insulating layer is disposed in the second area. The second power chip is disposed on the heat sink through the thermo-conductive insulating layer. The lead frame is electrically connected to at least one of the first and second power chips. The molding compound covers the first and second power chips, the thermo-conductive insulating layer and a portion of the lead frame. The first heat sink is electrically connected to at least one of the first and second power chips. Because the first power chip is not disposed on the first heat sink through the thermo-conductive insulating layer, the cost can be reduced.

摘要翻译： 功率模块包括第一散热器，第一和第二功率芯片，热导绝缘层，引线框架和模塑料。 第一散热器具有第一区域和第二区域。 第一功率芯片设置在第一区域中。 热导绝缘层设置在第二区域中。 第二功率芯片通过热导绝缘层设置在散热片上。 引线框架电连接到第一和第二功率芯片中的至少一个。 模制化合物覆盖第一和第二功率芯片，热导绝缘层和引线框架的一部分。 第一散热器电连接到第一和第二功率芯片中的至少一个。 由于第一功率芯片不通过导热绝缘层设置在第一散热器上，所以可以降低成本。

公开(公告)号：US20120327625A1

公开(公告)日：2012-12-27

申请号：US13602326

申请日：2012-09-04

申请人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC分类号： H05K7/06

CPC分类号： H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An assembled circuit comprising a substrate, a coil, a first conductive segment, a second conductive segment, a first through-hole connector and a second through-hole connector is disclosed. The first conductive segment is electrically connected to one end of the first through-hole connector, the other end of the first through-hole connector is electrically connected to one end of the second through-hole connector via the first conductive segment, and the other end of the second through-hole connector is electrically connected to the second conductive segment.

摘要翻译： 公开了一种包括基板，线圈，第一导电段，第二导电段，第一通孔连接器和第二通孔连接器的组装电路。 第一导电段电连接到第一通孔连接器的一端，第一通孔连接器的另一端通过第一导电段电连接到第二通孔连接器的一端，另一端 第二通孔连接器的端部与第二导电段电连接。

公开(公告)号：US20150228400A1

公开(公告)日：2015-08-13

申请号：US14696382

申请日：2015-04-25

申请人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC分类号： H01F27/29 ,  H01F27/28

CPC分类号： H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An electrical component is disclosed, the electrical component comprising: a magnetic body having a top surface, a bottom surface, wherein at least one first conductive through hole is formed from the top surface to bottom surface of the magnetic body; and a coil disposed in the magnetic body, wherein a first end of the coil is electrically connected to one of the at least one first conductive through hole.

摘要翻译： 公开了一种电气部件，所述电气部件包括：具有顶表面，底表面的磁体，其中至少一个第一导电通孔从所述磁体的顶表面到底表面形成; 以及设置在所述磁体中的线圈，其中所述线圈的第一端电连接到所述至少一个第一导电通孔中的一个。

公开(公告)号：US08593245B2

公开(公告)日：2013-11-26

申请号：US12787893

申请日：2010-05-26

申请人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Nan Ye ,  Wei Yang ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Shou-Yu Hong ,  Nan Ye ,  Wei Yang ,  Jian-Ping Ying

IPC分类号： H01F38/30 ,  H01F27/36 ,  H01F27/32 ,  H01F5/00 ,  H01F27/28

CPC分类号： H01F27/2885

摘要： A coil assembly includes at least one insulated wire and an electromagnetic interference shielding layer. The insulated wire is wound into a winding coil part. The winding coil part includes a first wire-outlet segment, a second wire-outlet segment and a central through-hole. The electromagnetic interference shielding layer is formed on the winding coil part for shielding the insulated wire. The electromagnetic interference shielding layer has lateral projection profile on the winding coil part. The electromagnetic interference shielding layer has a radial gap such that the electromagnetic interference shielding layer is a non-conducting loop.

摘要翻译： 线圈组件包括至少一个绝缘线和电磁干扰屏蔽层。 绝缘线缠绕在绕组线圈部分。 绕组线圈部分包括第一线出口段，第二线出口段和中心通孔。 电磁干扰屏蔽层形成在用于屏蔽绝缘线的绕组线圈部分上。 电磁干扰屏蔽层在绕组线圈部分具有侧向突出轮廓。 电磁干扰屏蔽层具有径向间隙，使得电磁干扰屏蔽层是非导通环路。

公开(公告)号：US20140085848A1

公开(公告)日：2014-03-27

申请号：US14094811

申请日：2013-12-03

申请人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC分类号： H05K7/02 ,  H01F17/00

CPC分类号： H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An assembled circuit is disclosed, wherein the assembled circuit comprises an inductor having a top surface, a bottom surface and side surfaces, wherein each of a plurality of conductors extends from the top surface to the bottom surface via one of the side surfaces of the inductor, wherein a circuit board is disposed over the top surface of the first electronic component and electrically connected to the plurality of conductors and a plurality of pins disposed on the bottom surface of the inductor for connecting to another circuit board.

摘要翻译： 公开了组装电路，其中组装电路包括具有顶表面，底表面和侧表面的电感器，其中多个导体中的每一个通过电感器的一个侧表面从顶表面延伸到底表面 其中电路板设置在所述第一电子部件的顶表面上并电连接到所述多个导体，以及设置在所述电感器的底表面上的多个引脚用于连接到另一个电路板。

公开(公告)号：US08624701B2

公开(公告)日：2014-01-07

申请号：US13602326

申请日：2012-09-04

申请人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

发明人： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC分类号： H01F5/00

CPC分类号： H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

摘要： An assembled circuit comprising a substrate, a coil, a first conductive segment, a second conductive segment, a first through-hole connector and a second through-hole connector is disclosed. The first conductive segment is electrically connected to one end of the first through-hole connector, the other end of the first through-hole connector is electrically connected to one end of the second through-hole connector via the first conductive segment, and the other end of the second through-hole connector is electrically connected to the second conductive segment.

摘要翻译： 公开了一种包括基板，线圈，第一导电段，第二导电段，第一通孔连接器和第二通孔连接器的组装电路。 第一导电段电连接到第一通孔连接器的一端，第一通孔连接器的另一端通过第一导电段电连接到第二通孔连接器的一端，另一端 第二通孔连接器的端部电连接到第二导电段。

公开(公告)号：US08426963B2

公开(公告)日：2013-04-23

申请号：US13084292

申请日：2011-04-11

申请人： Jian-Hong Zeng ,  Shou-Yu Hong

发明人： Jian-Hong Zeng ,  Shou-Yu Hong

IPC分类号： H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/00 ,  H01L21/44

CPC分类号： H01L23/49524 ,  H01L23/3107 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/73 ,  H01L25/071 ,  H01L25/074 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32155 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/1203 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A power semiconductor package structure includes a carrier, a first power chip, a second power chip, a first conductive sheet, a second conductive sheet and a third conductive sheet. The first power chip has a first surface and a second surface opposing to the first surface. A first control electrode and a first main power electrode are disposed on the first surface, and a second main power electrode is disposed on the second surface. The second surface is disposed on the carrier, and electrically connected to the carrier through the second main power electrode. The second power chip has a third surface and a fourth surface opposing to the third surface. A third main power electrode is disposed on the third surface, and a fourth main power electrode is disposed on the fourth surface. The fourth surface is disposed on the first power chip. The first conductive sheet is electrically connected to the first main power electrode and the fourth main power electrode. The second conductive sheet is electrically connected to the third main power electrode. The third conductive sheet is electrically connected to the first control electrode. At least a part of the first control electrode is non-covered by the second power chip along a projection direction, which is perpendicular to the carrier.

摘要翻译： 功率半导体封装结构包括载体，第一功率芯片，第二功率芯片，第一导电薄片，第二导电薄片和第三导电薄片。 第一功率芯片具有与第一表面相对的第一表面和第二表面。 第一控制电极和第一主电极设置在第一表面上，第二主电极设置在第二表面上。 第二表面设置在载体上，并通过第二主电极与载体电连接。 第二功率芯片具有与第三表面相对的第三表面和第四表面。 第三主电源电极设置在第三表面上，第四主电源设置在第四表面上。 第四表面设置在第一功率芯片上。 第一导电片电连接到第一主电源电极和第四主电源电极。 第二导电片与第三主电极电连接。 第三导电片与第一控制电极电连接。 第一控制电极的至少一部分沿着垂直于载体的投影方向被第二功率芯片未被覆盖。

公开(公告)号：US20100255282A1

公开(公告)日：2010-10-07

申请号：US12754021

申请日：2010-04-05

申请人： Shou-Yu Hong ,  Wei Yang ,  Jian-Hong Zeng ,  Jian-Ping Ying

发明人： Shou-Yu Hong ,  Wei Yang ,  Jian-Hong Zeng ,  Jian-Ping Ying

IPC分类号： H01F27/36 ,  H01F7/00 ,  H01F1/01 ,  C08L83/00 ,  C08L79/08 ,  C08K9/00 ,  C08K3/40

CPC分类号： H01F3/08 ,  H01F1/22 ,  H01F1/36 ,  H01F5/06 ,  H01F17/04 ,  H01F41/0246 ,  H01F2017/048 ,  Y10T428/249922 ,  Y10T428/2933

摘要： A high temperature resistant insulating composition includes an organic polymer and an inorganic binder. The inorganic binder is ranged between 10% and 90% by weight of the high temperature resistant insulating composition. The high temperature resistant insulating composition still possesses strength and insulating property after a high temperature treatment.

摘要翻译： 耐高温绝缘组合物包括有机聚合物和无机粘合剂。 无机粘合剂的范围为耐高温绝缘组合物的10重量％至90重量％。 耐高温绝缘组合物在高温处理后仍然具有强度和绝缘性能。