利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

57 条记录 (耗时 0.027 秒)

    Self-locking features in a multi-chip module
    7.
    发明授权
    Self-locking features in a multi-chip module 有权
    多芯片模块中的自锁功能

    公开(公告)号：US08315065B2

    公开(公告)日：2012-11-20

    申请号：US12568017

    申请日：2009-09-28

    申请人： Jing Shi ,  Hiren D. Thacker ,  Ashok V. Krishnamoorthy

    发明人： Jing Shi ,  Hiren D. Thacker ,  Ashok V. Krishnamoorthy

    IPC分类号： H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

    CPC分类号： H05K3/303 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09036 ,  H05K2201/1059 ,  H05K2201/209 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49126 ,  H01L2924/00

    摘要： A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features may mate and self-lock with each other. For example, the positive features on one of the surfaces may include pairs of counterposed micro-springs, and the negative features may include pits or grooves on the other surface. When the substrates are mechanically coupled, a given pair of positive features may provide a force in a plane of the other surface. Furthermore, by compressing the MCM so that the surfaces of the substrates are pushed toward each other, the mechanical coupling may be released.

    摘要翻译： 描述了多芯片模块（MCM）。 该MCM包括至少两个基板，其通过在基板的相对表面上的正和负特征可重新机械耦合。 这些积极和消极的特征可以彼此交配和自锁。 例如，其中一个表面上的阳性特征可以包括成对的相对的微弹簧，并且负特征可以包括在另一个表面上的凹坑或凹槽。 当基板机械耦合时，给定的一对正特征可以在另一表面的平面中提供力。 此外，通过压缩MCM使得基板的表面彼此推动，可以释放机械联接。

    SELF-LOCKING FEATURES IN A MULTI-CHIP MODULE
    8.
    发明申请
    SELF-LOCKING FEATURES IN A MULTI-CHIP MODULE 有权
    多芯片模块中的自锁特性

    公开(公告)号：US20110075380A1

    公开(公告)日：2011-03-31

    申请号：US12568017

    申请日：2009-09-28

    申请人： Jing Shi ,  Hiren D. Thacker ,  Ashok V. Krishnamoorthy

    发明人： Jing Shi ,  Hiren D. Thacker ,  Ashok V. Krishnamoorthy

    IPC分类号： H05K1/14 ,  H05K3/36

    CPC分类号： H05K3/303 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09036 ,  H05K2201/1059 ,  H05K2201/209 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49126 ,  H01L2924/00

    摘要： A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features may mate and self-lock with each other. For example, the positive features on one of the surfaces may include pairs of counterposed micro-springs, and the negative features may include pits or grooves on the other surface. When the substrates are mechanically coupled, a given pair of positive features may provide a force in a plane of the other surface. Furthermore, by compressing the MCM so that the surfaces of the substrates are pushed toward each other, the mechanical coupling may be released.

    摘要翻译： 描述了多芯片模块（MCM）。 该MCM包括至少两个基板，其通过在基板的相对表面上的正和负特征可重新机械耦合。 这些积极和消极的特征可以彼此交配和自锁。 例如，其中一个表面上的阳性特征可以包括成对的相对的微弹簧，并且负特征可以包括在另一个表面上的凹坑或凹槽。 当基板机械耦合时，给定的一对正特征可以在另一表面的平面中提供力。 此外，通过压缩MCM使得基板的表面彼此推动，可以释放机械联接。

    Capactive connectors with enhanced capacitive coupling
    9.
    发明授权
    Capactive connectors with enhanced capacitive coupling 有权
    具有增强电容耦合的电容式连接器

    公开(公告)号：US07863743B1

    公开(公告)日：2011-01-04

    申请号：US12494981

    申请日：2009-06-30

    申请人： Jing Shi ,  Darko R. Popovic ,  Ashok V. Krishnamoorthy

    发明人： Jing Shi ,  Darko R. Popovic ,  Ashok V. Krishnamoorthy

    IPC分类号： H01L23/48

    CPC分类号： H01L25/0657 ,  H01L23/642 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A single-chip module (SCM) and a multi-chip module (MCM) that includes at least two instances of the SCM are described. The SCM includes a pad disposed on a substrate. This pad has a top surface that includes a pattern of features. A given feature in the pattern of features has a height that extends above a minimum thickness of the pad, thereby increasing a capacitance associated with the pad relative to a configuration in which the top surface is planar. Furthermore, pads disposed on the two instances of the SCM in the MCM may each have a corresponding pattern of features that increases the capacitive coupling between the pads relative to a configuration in which the top surfaces of either or both of the pads are planar. Note that the pads may be aligned such that features in the patterns of features on these pads are interdigited with each other.

    摘要翻译： 描述了包括SCM的至少两个实例的单芯片模块（SCM）和多芯片模块（MCM）。 SCM包括设置在基板上的焊盘。 该垫具有包括特征图案的顶面。 特征图案中的给定特征具有高于垫的最小厚度的高度，从而增加与衬垫相关联的电容相对于顶表面为平面的构造。 此外，设置在MCM中的SCM的两个实例上的焊盘可以各自具有对应的特征图案，其相对于其中一个或两个焊盘的顶表面是平面的配置增加了焊盘之间的电容耦合。 注意，焊盘可以对准，使得这些焊盘上的特征图案中的特征彼此交叉。

    CAPACTIVE CONNECTORS WITH ENHANCED CAPACITIVE COUPLING
    10.
    发明申请
    CAPACTIVE CONNECTORS WITH ENHANCED CAPACITIVE COUPLING 有权
    具有增强电容耦合的电容连接器

    公开(公告)号：US20100327460A1

    公开(公告)日：2010-12-30

    申请号：US12494981

    申请日：2009-06-30

    申请人： Jing Shi ,  Darko R. Popovic ,  Ashok V. Krishnamoorthy

    发明人： Jing Shi ,  Darko R. Popovic ,  Ashok V. Krishnamoorthy

    IPC分类号： H01L25/065 ,  H01L23/495

    CPC分类号： H01L25/0657 ,  H01L23/642 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A single-chip module (SCM) and a multi-chip module (MCM) that includes at least two instances of the SCM are described. The SCM includes a pad disposed on a substrate. This pad has a top surface that includes a pattern of features. A given feature in the pattern of features has a height that extends above a minimum thickness of the pad, thereby increasing a capacitance associated with the pad relative to a configuration in which the top surface is planar. Furthermore, pads disposed on the two instances of the SCM in the MCM may each have a corresponding pattern of features that increases the capacitive coupling between the pads relative to a configuration in which the top surfaces of either or both of the pads are planar. Note that the pads may be aligned such that features in the patterns of features on these pads are interdigited with each other.

    摘要翻译： 描述了包括SCM的至少两个实例的单芯片模块（SCM）和多芯片模块（MCM）。 SCM包括设置在基板上的焊盘。 该垫具有包括特征图案的顶面。 特征图案中的给定特征具有高于垫的最小厚度的高度，从而增加与衬垫相关联的电容相对于顶表面为平面的构造。 此外，设置在MCM中的SCM的两个实例上的焊盘可以各自具有对应的特征图案，其相对于其中一个或两个焊盘的顶表面是平面的配置增加了焊盘之间的电容耦合。 注意，焊盘可以对准，使得这些焊盘上的特征图案中的特征彼此交叉。