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    Dual Metal Gate and Method of Manufacture
    3.
    发明申请
    Dual Metal Gate and Method of Manufacture 审中-公开
    双金属门和制造方法

    公开(公告)号：US20070059874A1

    公开(公告)日：2007-03-15

    申请号：US11456054

    申请日：2006-07-06

    申请人： Naim Moumen ,  Husam Alshareef ,  Joel Barnett ,  Muhammad Hussain ,  Hongfa Luan ,  Seung-Chul Song ,  Raj Jammy

    发明人： Naim Moumen ,  Husam Alshareef ,  Joel Barnett ,  Muhammad Hussain ,  Hongfa Luan ,  Seung-Chul Song ,  Raj Jammy

    IPC分类号： H01L21/8238

    CPC分类号： H01L21/823842

    摘要： Methods for fabricating two metal gate stacks for complementary metal oxide semiconductor (CMOS) devices are provided. A common layer, such as a metal layer, a metal alloy layer, or a metal nitride layer may be deposited on to a gate dielectric. A first mask layer may be deposited and patterned over an active region, exposing a portion of the common layer. A first ion may be deposited in the common layer forming a first mask layer. Similarly, a second mask layer may be deposited and patterned over the other active region and the first metal layer, and another portion of the common layer is exposed. A second ion may be deposited in the common layer, forming a second mask layer.

    摘要翻译： 提供了用于制造用于互补金属氧化物半导体（CMOS）器件的两个金属栅极叠层的方法。 诸如金属层，金属合金层或金属氮化物层的公共层可以沉积到栅极电介质上。 可以在有源区上沉积和图案化第一掩模层，暴露公共层的一部分。 可以在形成第一掩模层的公共层中沉积第一离子。 类似地，第二掩模层可以在另一个有源区和第一金属层上沉积和图案化，并且公共层的另一部分被暴露。 可以在公共层中沉积第二离子，形成第二掩模层。

    Methods for dual metal gate CMOS integration
    4.
    发明申请
    Methods for dual metal gate CMOS integration 审中-公开
    双金属栅极CMOS集成方法

    公开(公告)号：US20070048920A1

    公开(公告)日：2007-03-01

    申请号：US11212127

    申请日：2005-08-25

    申请人： Seung-Chul Song ,  Zhibo Zhang ,  Byoung Lee ,  Naim Moumen ,  Joel Barnett ,  Muhammad Hussain ,  Rino Choi ,  Husam Alshareef

    发明人： Seung-Chul Song ,  Zhibo Zhang ,  Byoung Lee ,  Naim Moumen ,  Joel Barnett ,  Muhammad Hussain ,  Rino Choi ,  Husam Alshareef

    IPC分类号： H01L21/8238 ,  H01L21/8234 ,  H01L21/4763 ,  H01L21/3205

    CPC分类号： H01L21/823842

    摘要： Methods for fabricating two metal gate stacks for complementary metal oxide semiconductor (CMOS) devices are provided. A first metal layer may be deposited onto a gate dielectric. Next a mask layer may be deposited on the first metal layer and subsequently etch. The first metal layer is then etched. Without removing the mask layer, a second metal layer may be deposited. In one embodiment, the mask layer is a second metal layer. In other embodiments, the mask layer is a silicon layer. Subsequent fabrication steps include depositing another metal layer (e.g., another PMOS metal layer), depositing a cap, etching the cap to define gate stacks, and simultaneously etching the first and second gate region having a similar thickness with differing metal layers.

    摘要翻译： 提供了用于制造用于互补金属氧化物半导体（CMOS）器件的两个金属栅极叠层的方法。 可以将第一金属层沉积到栅极电介质上。 接下来，掩模层可以沉积在第一金属层上并随后蚀刻。 然后蚀刻第一金属层。 在不去除掩模层的情况下，可沉积第二金属层。 在一个实施例中，掩模层是第二金属层。 在其他实施例中，掩模层是硅层。 随后的制造步骤包括沉积另一金属层（例如，另一个PMOS金属层），沉积帽，蚀刻帽以限定栅极堆叠，以及同时用不同的金属层蚀刻具有相似厚度的第一和第二栅极区域。

    Semiconductor transistors having high-K gate dielectric layers, metal gate electrode regions, and low fringing capacitances
    6.
    发明授权
    Semiconductor transistors having high-K gate dielectric layers, metal gate electrode regions, and low fringing capacitances 有权
    具有高K栅极电介质层，金属栅电极区域和低边缘电容的半导体晶体管

    公开(公告)号：US08232612B2

    公开(公告)日：2012-07-31

    申请号：US12645981

    申请日：2009-12-23

    申请人： James William Adkisson ,  Michael P. Chudzik ,  Jeffrey Peter Gambino ,  Renee T. Mo ,  Naim Moumen

    发明人： James William Adkisson ,  Michael P. Chudzik ,  Jeffrey Peter Gambino ,  Renee T. Mo ,  Naim Moumen

    IPC分类号： H01L21/00

    CPC分类号： H01L29/4983 ,  H01L29/4966 ,  H01L29/518 ,  H01L29/6653 ,  H01L29/66545 ,  H01L29/6659 ,  H01L29/7833 ,  Y10S257/90

    摘要： A semiconductor structure. The structure includes (i) a semiconductor substrate which includes a channel region, (ii) first and second source/drain regions on the semiconductor substrate, (iii) a gate dielectric region, and (iv) a gate electrode region, (v) a plurality of interconnect layers on the gate electrode region, and (vi) first and second spaces. The gate dielectric region is disposed between and in direct physical contact with the channel region and the gate electrode region. The gate electrode region is disposed between and in direct physical contact with the gate dielectric region and the interconnect layers. The first and second spaces are in direct physical contact with the gate electrode region. The first space is disposed between the first source/drain region and the gate electrode region. The second space is disposed between the second source/drain region and the gate electrode region.

    摘要翻译： 半导体结构。 该结构包括（i）半导体衬底，其包括沟道区，（ii）半导体衬底上的第一和第二源极/漏极区，（iii）栅极电介质区，和（iv）栅电极区，（v） 栅电极区上的多个互连层，以及（vi）第一和第二空间。 栅极电介质区域设置在沟道区域和栅电极区域之间并与其直接物理接触。 栅电极区域设置在栅极电介质区域和互连层之间并与其直接物理接触。 第一和第二空间与栅电极区域直接物理接触。 第一空间设置在第一源极/漏极区域和栅极电极区域之间。 第二空间设置在第二源极/漏极区域和栅极电极区域之间。

    Gate Effective-Workfunction Modification for CMOS
    7.
    发明申请
    Gate Effective-Workfunction Modification for CMOS 有权
    门有效功能修改CMOS

    公开(公告)号：US20110121401A1

    公开(公告)日：2011-05-26

    申请号：US13019949

    申请日：2011-02-02

    申请人： Dae-Gyu Park ,  Michael P. Chudzik ,  Rashmi Jha ,  Siddarth A. Krishnan ,  Naim Moumen ,  Vijay Narayanan ,  Vamsi Paruchuri

    发明人： Dae-Gyu Park ,  Michael P. Chudzik ,  Rashmi Jha ,  Siddarth A. Krishnan ,  Naim Moumen ,  Vijay Narayanan ,  Vamsi Paruchuri

    IPC分类号： H01L27/092

    CPC分类号： H01L21/823857 ,  H01L21/823842 ,  H01L29/785

    摘要： CMOS circuit structures are disclosed with the PFET and NFET devices having high-k dielectric layers consisting of the same gate insulator material, and metal gate layers consisting of the same gate metal material. The PFET device has a “p” interface control layer which is capable of shifting the effective-workfunction of the gate in the p-direction. In a representative embodiment of the invention the “p” interface control layer is aluminum oxide. The NFET device may have an “n” interface control layer. The materials of the “p” and “n” interface control layers are differing materials. The “p” and “n” interface control layers are positioned to the opposite sides of their corresponding high-k dielectric layers. Methods for fabricating the CMOS circuit structures with the oppositely positioned “p” and “n” interface control layers are also disclosed.

    摘要翻译： 公开了CMOS电路结构，其中PFET和NFET器件具有由相同的栅极绝缘体材料构成的高k电介质层以及由相同栅极金属材料组成的金属栅极层。 PFET器件具有能够沿p方向移动栅极的有效功能的“p”接口控制层。 在本发明的代表性实施例中，“p”界面控制层是氧化铝。 NFET器件可以具有“n”个界面控制层。 “p”和“n”界面控制层的材料是不同的材料。 “p”和“n”界面控制层位于其相应的高k电介质层的相对侧。 还公开了制造具有相对定位的“p”和“n”界面控制层的CMOS电路结构的方法。

    Methods of forming mixed gate CMOS with single poly deposition
    8.
    发明授权
    Methods of forming mixed gate CMOS with single poly deposition 有权
    使用单个聚合物沉积形成混合栅极CMOS的方法

    公开(公告)号：US07741181B2

    公开(公告)日：2010-06-22

    申请号：US11936061

    申请日：2007-11-06

    申请人： Bruce B. Doris ,  Charlotte DeWan Adams ,  Naim Moumen ,  Ying Zhang

    发明人： Bruce B. Doris ,  Charlotte DeWan Adams ,  Naim Moumen ,  Ying Zhang

    IPC分类号： H01L21/8234

    CPC分类号： H01L21/823842 ,  H01L21/28079 ,  H01L21/28088 ,  H01L21/823857 ,  H01L29/785

    摘要： A method for fabricating metal gate and polysilicon gate FET devices on the same chip is disclosed. The method avoids the use of two separate masks during gate stack fabrication of the differing gates. By using a single mask, tighter NFET to PFET distances can be achieved, and the fabrication process is simplified. After blanket disposing layers for the fabrication of the metal gate stack, a covering protective material layer is formed, again in blanket fashion. A block level mask is used to clear the surface for the gate insulator formation in the poly gate device regions. During oxidation, which forms the gate dielectric for the poly gate devices, the protective material prevents damage of the metal gate device regions. Following oxidation, a single common polysilicon cover is disposed in blanket manner for continuing the fabrication of the gate stacks. The protective material is selected in such a way to be either easily removable upon oxidation, or to be conductive upon oxidation. In this latter case the oxidized protective material is incorporated into the metal gate stack, which incorporation results in a novel CMOS structure.

    摘要翻译： 公开了一种在同一芯片上制造金属栅极和多晶硅栅极FET器件的方法。 该方法避免了在不同栅极的栅堆叠制造期间使用两个分离的掩模。 通过使用单个掩模，可以实现更紧密的NFET至PFET距离，并简化制造工艺。 在用于制造金属栅极堆叠的毯布设置层之后，再次以毯子形式形成覆盖保护材料层。 块级别掩模用于清除多晶硅栅极器件区域中的栅极绝缘体形成的表面。 在形成用于多晶硅栅极器件的栅极电介质的氧化期间，保护材料防止金属栅极器件区域的损坏。 在氧化之后，以橡皮布方式设置单个公共多晶硅盖，以继续制造栅极堆叠。 保护材料选择为在氧化时易于除去或在氧化时导电。 在后一种情况下，氧化的保护材料被并入到金属栅极堆叠中，其结合形成了新的CMOS结构。

    Disposable metallic or semiconductor gate spacer
    9.
    发明授权
    Disposable metallic or semiconductor gate spacer 失效
    一次性金属或半导体栅极间隔物

    公开(公告)号：US07682917B2

    公开(公告)日：2010-03-23

    申请号：US12016326

    申请日：2008-01-18

    申请人： Stephen W. Bedell ,  Michael Chudzik ,  William K. Henson ,  Naim Moumen ,  Vijay Narayanan ,  Devendra K. Sadana ,  Kathryn T. Schonenberg ,  Ghavam Shahidi

    发明人： Stephen W. Bedell ,  Michael Chudzik ,  William K. Henson ,  Naim Moumen ,  Vijay Narayanan ,  Devendra K. Sadana ,  Kathryn T. Schonenberg ,  Ghavam Shahidi

    IPC分类号： H01L21/336

    CPC分类号： H01L29/7847 ,  H01L21/324 ,  H01L21/823807 ,  H01L21/823864 ,  H01L29/665 ,  H01L29/6653 ,  H01L29/6656

    摘要： A disposable spacer is formed directly on or in close proximity to the sidewalls of a gate electrode and a gate dielectric. The disposable spacer comprises a material that scavenges oxygen such as a metal, a metal nitride, or a semiconductor material having high reactivity with oxygen. The disposable gate spacer absorbs any oxygen during subsequent high temperature processing such as a stress memorization anneal. A metal is deposited over, and reacted with, the gate electrode and source and drain regions to form metal semiconductor alloy regions. The disposable gate spacer is subsequently removed selective to the metal semiconductor alloy regions. A porous or non-porous low-k dielectric material is deposited to provide a low parasitic capacitance between the gate electrode and the source and drain regions. The gate dielectric maintains the original dielectric constant since the disposable gate spacer prevents absorption of additional oxygen during high temperature processes.

    摘要翻译： 一次性间隔物直接形成在栅极电极和栅极电介质的侧壁上或紧邻栅电极的侧壁上。 一次性间隔件包括清除氧的材料，例如金属，金属氮化物或具有高氧反应性的半导体材料。 一次性栅极间隔件在随后的高温处理例如应力记忆退火期间吸收任何氧气。 将金属沉积在栅电极和源极和漏极区上并与其反应以形成金属半导体合金区域。 一次性栅极间隔物随后被选择性地移除到金属半导体合金区域。 沉积多孔或非多孔低k电介质材料以在栅极电极和源极和漏极区域之间提供低的寄生电容。 栅极电介质保持原始介电常数，因为一次性栅极间隔物可防止在高温过程中吸收额外的氧。

    Mixed gate CMOS with single poly deposition
    10.
    发明申请
    Mixed gate CMOS with single poly deposition 有权
    混合栅极CMOS与单个聚合物沉积

    公开(公告)号：US20090114992A1

    公开(公告)日：2009-05-07

    申请号：US11936061

    申请日：2007-11-06

    申请人： Bruce B. Doris ,  Charlotte DeWan Adams ,  Naim Moumen ,  Ying Zhang

    发明人： Bruce B. Doris ,  Charlotte DeWan Adams ,  Naim Moumen ,  Ying Zhang

    IPC分类号： H01L29/10 ,  H01L21/8238

    CPC分类号： H01L21/823842 ,  H01L21/28079 ,  H01L21/28088 ,  H01L21/823857 ,  H01L29/785

    摘要： A method for fabricating metal gate and polysilicon gate FET devices on the same chip is disclosed. The method avoids the use of two separate masks during gate stack fabrication of the differing gates. By using a single mask, tighter NFET to PFET distances can be achieved, and the fabrication process is simplified. After blanket disposing layers for the fabrication of the metal gate stack, a covering protective material layer is formed, again in blanket fashion. A block level mask is used to clear the surface for the gate insulator formation in the poly gate device regions. During oxidation, which forms the gate dielectric for the poly gate devices, the protective material prevents damage of the metal gate device regions. Following oxidation, a single common polysilicon cover is disposed in blanket manner for continuing the fabrication of the gate stacks. The protective material is selected in such a way to be either easily removable upon oxidation, or to be conductive upon oxidation. In this latter case the oxidized protective material is incorporated into the metal gate stack, which incorporation results in a novel CMOS structure.

    摘要翻译： 公开了一种在同一芯片上制造金属栅极和多晶硅栅极FET器件的方法。 该方法避免了在不同栅极的栅堆叠制造期间使用两个分离的掩模。 通过使用单个掩模，可以实现更紧密的NFET至PFET距离，并简化制造工艺。 在用于制造金属栅极堆叠的毯布设置层之后，再次以毯子形式形成覆盖保护材料层。 块级别掩模用于清除多晶硅栅极器件区域中的栅极绝缘体形成的表面。 在形成用于多晶硅栅极器件的栅极电介质的氧化期间，保护材料防止金属栅极器件区域的损坏。 在氧化之后，以橡皮布方式设置单个公共多晶硅盖，以继续制造栅极堆叠。 保护材料选择为在氧化时易于除去或在氧化时导电。 在后一种情况下，氧化的保护材料被并入到金属栅极堆叠中，其结合形成了新的CMOS结构。