公开(公告)号：USRE44303E1

公开(公告)日：2013-06-18

申请号：US13565302

申请日：2012-08-02

申请人： John Bedinger ,  Michael A. Moore ,  Robert B Hallock ,  Kamal Tabatabaie ,  Thomas E. Kazior

发明人： John Bedinger ,  Michael A. Moore ,  Robert B Hallock ,  Kamal Tabatabaie ,  Thomas E. Kazior

IPC分类号： H01L21/469 ,  H01L21/31 ,  H01L23/58 ,  H01L21/76

CPC分类号： H01L23/3192 ,  H01L21/7682 ,  H01L21/76832 ,  H01L21/76834 ,  H01L23/4821 ,  H01L23/5221 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： According to one embodiment of the disclosure, a method for passivating a circuit device generally includes providing a substrate having a substrate surface, forming an electrical component on the substrate surface, and coating the substrate surface and the electrical component with a first protective dielectric layer. The first protective dielectric layer is made of a generally moisture insoluble material having a moisture permeability less than 0.01 gram/meter2/day, a moisture absorption less than 0.04 percent, a dielectric constant less than 10, a dielectric loss less than 0.005, a breakdown voltage strength greater than 8 million volts/centimeter, a sheet resistivity greater than 1015 ohm-centimeter, and a defect density less than 0.5/centimeter2.

摘要翻译： 根据本公开的一个实施例，用于钝化电路器件的方法通常包括提供具有衬底表面的衬底，在衬底表面上形成电子部件，以及用第一保护介电层涂覆衬底表面和电气部件。 第一保护介电层由通常不透水的材料制成，其透湿度小于0.01克/米2 /天，吸湿率小于0.04％，介电常数小于10，介电损耗小于0.005，击穿 电压强度大于800万伏/厘米，电阻率大于1015欧姆厘米，缺陷密度小于0.5 /厘米2。

公开(公告)号：US07902083B2

公开(公告)日：2011-03-08

申请号：US12691216

申请日：2010-01-21

申请人： John M. Bedinger ,  Michael A. Moore ,  Robert B. Hallock ,  Kamal Tabatabaie Alavi ,  Thomas E. Kazior

发明人： John M. Bedinger ,  Michael A. Moore ,  Robert B. Hallock ,  Kamal Tabatabaie Alavi ,  Thomas E. Kazior

IPC分类号： H01L21/469 ,  H01L21/31 ,  H01L23/58 ,  H01L21/76

CPC分类号： H01L23/3192 ,  H01L21/7682 ,  H01L21/76832 ,  H01L21/76834 ,  H01L23/4821 ,  H01L23/5221 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： According to one embodiment of the disclosure, a method for passivating a circuit device generally includes providing a substrate having a substrate surface, forming an electrical component on the substrate surface, and coating the substrate surface and the electrical component with a first protective dielectric layer. The first protective dielectric layer is made of a generally moisture insoluble material having a moisture permeability less than 0.01 gram/meter2/day, a moisture absorption less than 0.04 percent, a dielectric constant less than 10, a dielectric loss less than 0.005, a breakdown voltage strength greater than 8 million volts/centimeter, a sheet resistivity greater than 1015 ohm-centimeter, and a defect density less than 0.5/centimeter2.

摘要翻译： 根据本公开的一个实施例，用于钝化电路器件的方法通常包括提供具有衬底表面的衬底，在衬底表面上形成电子部件，以及用第一保护介电层涂覆衬底表面和电气部件。 第一保护介电层由通常不透水的材料制成，其透湿度小于0.01克/米2 /天，吸湿率小于0.04％，介电常数小于10，介电损耗小于0.005，击穿 电压强度大于800万伏/厘米，电阻率大于1015欧姆厘米，缺陷密度小于0.5 /厘米2。

公开(公告)号：US20100120254A1

公开(公告)日：2010-05-13

申请号：US12691216

申请日：2010-01-21

申请人： John M. Bedinger ,  Michael A. Moore ,  Robert B. Hallock ,  Kamal Tabatabaie Alavi ,  Thomas E. Kazior

发明人： John M. Bedinger ,  Michael A. Moore ,  Robert B. Hallock ,  Kamal Tabatabaie Alavi ,  Thomas E. Kazior

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： H01L23/3192 ,  H01L21/7682 ,  H01L21/76832 ,  H01L21/76834 ,  H01L23/4821 ,  H01L23/5221 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： According to one embodiment of the disclosure, a method for passivating a circuit device generally includes providing a substrate having a substrate surface, forming an electrical component on the substrate surface, and coating the substrate surface and the electrical component with a first protective dielectric layer. The first protective dielectric layer is made of a generally moisture insoluble material having a moisture permeability less than 0.01 gram/meter2/day, a moisture absorption less than 0.04 percent, a dielectric constant less than 10, a dielectric loss less than 0.005, a breakdown voltage strength greater than 8 million volts/centimeter, a sheet resistivity greater than 1015 ohm-centimeter, and a defect density less than 0.5/centimeter2.

摘要翻译： 根据本公开的一个实施例，用于钝化电路器件的方法通常包括提供具有衬底表面的衬底，在衬底表面上形成电子部件，以及用第一保护介电层涂覆衬底表面和电气部件。 第一保护介电层由通常不透水的材料制成，其透湿度小于0.01克/米2 /天，吸湿率小于0.04％，介电常数小于10，介电损耗小于0.005，击穿 电压强度大于800万伏/厘米，电阻率大于1015欧姆厘米，缺陷密度小于0.5 /厘米2。

公开(公告)号：US07767589B2

公开(公告)日：2010-08-03

申请号：US11848820

申请日：2007-08-31

申请人： John M. Bedinger ,  Michael A. Moore ,  Robert B. Hallock ,  Kamal Tabatabaie Alavi ,  Thomas E. Kazior

发明人： John M. Bedinger ,  Michael A. Moore ,  Robert B. Hallock ,  Kamal Tabatabaie Alavi ,  Thomas E. Kazior

IPC分类号： H01L21/469 ,  H01L21/31 ,  H01L23/58 ,  H01L21/76

CPC分类号： H01L23/3192 ,  H01L21/7682 ,  H01L21/76832 ,  H01L21/76834 ,  H01L23/4821 ,  H01L23/5221 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： According to one embodiment of the disclosure, a method for passivating a circuit device generally includes providing a substrate having a substrate surface, forming an electrical component on the substrate surface, and coating the substrate surface and the electrical component with a first protective dielectric layer. The first protective dielectric layer is made of a generally moisture insoluble material having a moisture permeability less than 0.01 gram/meter2/day, a moisture absorption less than 0.04 percent, a dielectric constant less than 10, a dielectric loss less than 0.005, a breakdown voltage strength greater than 8 million volts/centimeter, a sheet resistivity greater than 1015 ohm-centimeter, and a defect density less than 0.5/centimeter2.

摘要翻译： 根据本公开的一个实施例，用于钝化电路器件的方法通常包括提供具有衬底表面的衬底，在衬底表面上形成电子部件，以及用第一保护介电层涂覆衬底表面和电气部件。 第一保护介电层由通常不透水的材料制成，其透湿度小于0.01克/米2 /天，吸湿率小于0.04％，介电常数小于10，介电损耗小于0.005，击穿 电压强度大于800万伏/厘米，电阻率大于1015欧姆厘米，缺陷密度小于0.5 /厘米2。

公开(公告)号：US20080185174A1

公开(公告)日：2008-08-07

申请号：US11848820

申请日：2007-08-31

申请人： John M. Bedinger ,  Michael A. Moore ,  Robert B. Hallock ,  Kamal Tabatabaie Alavi ,  Thomas E. Kazior

发明人： John M. Bedinger ,  Michael A. Moore ,  Robert B. Hallock ,  Kamal Tabatabaie Alavi ,  Thomas E. Kazior

IPC分类号： H05K1/16 ,  H01L21/31 ,  H01L21/76

CPC分类号： H01L23/3192 ,  H01L21/7682 ,  H01L21/76832 ,  H01L21/76834 ,  H01L23/4821 ,  H01L23/5221 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： According to one embodiment of the disclosure, a method for passivating a circuit device generally includes providing a substrate having a substrate surface, forming an electrical component on the substrate surface, and coating the substrate surface and the electrical component with a first protective dielectric layer. The first protective dielectric layer is made of a generally moisture insoluble material having a moisture permeability less than 0.01 gram/meter2/day, a moisture absorption less than 0.04 percent, a dielectric constant less than 10, a dielectric loss less than 0.005, a breakdown voltage strength greater than 8 million volts/centimeter, a sheet resistivity greater than 1015 ohm-centimeter, and a defect density less than 0.5/centimeter2.

摘要翻译： 根据本公开的一个实施例，用于钝化电路器件的方法通常包括提供具有衬底表面的衬底，在衬底表面上形成电子部件，以及用第一保护介电层涂覆衬底表面和电气部件。 第一保护介电层由通常不透湿的材料制成，其透湿度小于0.01克/米2天，吸湿率小于0.04％，介电常数小于10，a 介电损耗小于0.005，击穿电压强度大于800万伏/厘米，薄层电阻率大于10欧姆厘米，缺陷密度小于0.5 /厘米2， / SUP>。

公开(公告)号：US20150207218A1

公开(公告)日：2015-07-23

申请号：US13604204

申请日：2012-09-05

申请人： John Bedinger ,  Michael A. Moore ,  Waid A. Paine

发明人： John Bedinger ,  Michael A. Moore ,  Waid A. Paine

IPC分类号： H01Q1/42 ,  C23C16/46 ,  C23C16/455

CPC分类号： H01Q1/42 ,  B05D1/60 ,  B05D2203/30 ,  C04B35/14 ,  C04B2235/6027 ,  C04B2235/72 ,  H01Q1/422

摘要： A radome is provided and includes a substrate formed of moisture permeable material and a coating disposed on a surface of the SCFS substrate. The coating includes a layer of inorganic material disposed adjacent to at least one layer of organic material.

摘要翻译： 设置有天线罩，并且包括由透湿材料形成的基板和设置在SCFS基板的表面上的涂层。 涂层包括与至少一层有机材料相邻布置的无机材料层。

公开(公告)号：US09112275B2

公开(公告)日：2015-08-18

申请号：US13604204

申请日：2012-09-05

申请人： John Bedinger ,  Michael A. Moore ,  Waid A. Paine

发明人： John Bedinger ,  Michael A. Moore ,  Waid A. Paine

IPC分类号： B32B15/01 ,  B05D5/12 ,  H01Q1/42 ,  C04B35/14

CPC分类号： H01Q1/42 ,  B05D1/60 ,  B05D2203/30 ,  C04B35/14 ,  C04B2235/6027 ,  C04B2235/72 ,  H01Q1/422

摘要： A radome is provided and includes a substrate formed of moisture permeable material and a coating disposed on a surface of the SCFS substrate. The coating includes a layer of inorganic material disposed adjacent to at least one layer of organic material.

摘要翻译： 设置有天线罩，并且包括由透湿材料形成的基板和设置在SCFS基板的表面上的涂层。 涂层包括与至少一层有机材料相邻布置的无机材料层。

公开(公告)号：US08148830B2

公开(公告)日：2012-04-03

申请号：US12533409

申请日：2009-07-31

申请人： John M. Bedinger ,  Michael A. Moore

发明人： John M. Bedinger ,  Michael A. Moore

IPC分类号： H01L23/29

CPC分类号： H05K3/284 ,  H01L23/3192 ,  H01L23/4821 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19041 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2203/1322 ,  Y10T29/49124 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49982 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29075 ,  H01L2924/00014

摘要： A circuit board assembly includes a circuit board having an outer surface configured with a plurality of discrete electrical components. The assembly includes a first protective dielectric layer overlying the outer surface, and a second dielectric layer overlying the first protective dielectric layer and the discrete electrical components. The second dielectric layer includes a dielectric material having modulus of elasticity less than 3.5 Giga-Pascal (GPa), a dielectric constant less than 3.0, a dielectric loss less than 0.008, a moisture absorption less than 0.04 percent, a breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), a temperature stability to 300° Celsius, pinhole free in films greater than 50 Angstroms, hydrophobic with a wetting angle greater than 45 degrees, capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 30%.

摘要翻译： 电路板组件包括具有被配置有多个分立的电气部件的外表面的电路板。 该组件包括覆盖在外表面上的第一保护介电层和覆盖第一保护介电层和分立电气部件的第二介电层。 第二电介质层包括弹性模量小于3.5千兆帕（GPa），介电常数小于3.0的介电材料，小于0.008的介电损耗，小于0.04％的吸湿性，超过的击穿电压强度 200万伏/厘米（MV /厘米），温度稳定至300摄氏度，大于50埃的薄膜中无针孔，疏水性大于45度的润湿角度，能够在3D结构下保形地沉积， 厚度均匀度小于或等于30％。

公开(公告)号：US5928078A

公开(公告)日：1999-07-27

申请号：US28261

申请日：1998-02-23

申请人： Michael A. Moore ,  Scott M. Barboza

发明人： Michael A. Moore ,  Scott M. Barboza

IPC分类号： F24F13/068 ,  F24F13/08 ,  F24F13/06

CPC分类号： F24F13/084 ,  F24F13/068 ,  F24F13/08

摘要： A connection flange, used to fasten a floor register to a precut hole while providing an integral connection means for an air duct fitting.

摘要翻译： 连接法兰，用于将地板寄存器固定到预切孔，同时提供用于空气管道配件的整体连接装置。

公开(公告)号：US5109756A

公开(公告)日：1992-05-05

申请号：US646211

申请日：1991-01-28

申请人： Scott M. Barboza ,  Michael A. Moore

发明人： Scott M. Barboza ,  Michael A. Moore

IPC分类号： F24F13/062

CPC分类号： F24F13/062

摘要： An air diffuser assembly having multiple, various size inlet collars joined together with frustum shaped sections. Each of these sections contain a tear-away band around its perimeter which allows removal of unneeded collar sections. The assembly is mounted using a number of quick mounting clips.

摘要翻译： 空气扩散器组件，其具有多个不同大小的入口套环，其与截头锥形部分连接在一起。 这些部分中的每一个都围绕其周边包含撕开带，其允许去除不需要的衣领部分。 该组件使用许多快速安装夹安装。