公开(公告)号：US20060143189A1

公开(公告)日：2006-06-29

申请号：US10522552

申请日：2004-07-09

申请人： Takashi Imaeda ,  Kimitaka Endo ,  Jouji Nakayama ,  Tetsuya Yamamoto ,  Ken-ichiro Shimokura ,  Tsutomu Yabuuchi ,  Hirohisa Tezuka ,  Masato Urano

发明人： Takashi Imaeda ,  Kimitaka Endo ,  Jouji Nakayama ,  Tetsuya Yamamoto ,  Ken-ichiro Shimokura ,  Tsutomu Yabuuchi ,  Hirohisa Tezuka ,  Masato Urano

IPC分类号： G06F7/00

CPC分类号： H04L63/0807 ,  G06F21/335 ,  G06F21/6218 ,  G06F2221/2115 ,  H04L63/102 ,  Y10S707/99939

摘要： A disclosed database access control apparatus generates and stores an access key based on a user ID of a user apparatus. Then, the database access control apparatus sends the access key to the user apparatus with an address of a proxy process server apparatus. The user apparatus sends the access key to the proxy process server apparatus when making a database access request, ad the proxy process server apparatus sends the access key to the database access control apparatus when making a database process request. When receiving the database process request, the database access control apparatus determines whether an access key the same as the access key received from the proxy process server apparatus is stored in the database access control apparatus, and accesses the database only if having the access key.

摘要翻译： 所公开的数据库访问控制装置基于用户装置的用户ID生成并存储访问密钥。 然后，数据库访问控制装置使用代理处理服务器装置的地址向用户装置发送访问密钥。 当进行数据库访问请求时，用户装置将访问密钥发送给代理处理服务器装置，当进行数据库处理请求时，代理处理服务器装置将访问密钥发送到数据库访问控制装置。 数据库访问控制装置在接收到数据库处理请求时，确定与从代理处理服务器装置接收的访问密钥相同的访问密钥是否存储在数据库访问控制装置中，仅在具有访问密钥的情况下访问数据库。

公开(公告)号：US07617238B2

公开(公告)日：2009-11-10

申请号：US10564183

申请日：2004-07-09

申请人： Jouji Nakayama ,  Tetsuya Yamamoto ,  Ken-ichiro Shimokura ,  Tsutomu Yabuuchi ,  Kimitaka Endo ,  Takashi Imaeda

发明人： Jouji Nakayama ,  Tetsuya Yamamoto ,  Ken-ichiro Shimokura ,  Tsutomu Yabuuchi ,  Kimitaka Endo ,  Takashi Imaeda

IPC分类号： G06F7/00

CPC分类号： G06F17/30011 ,  G06F21/6218 ,  G06F2221/2141 ,  G06F2221/2145 ,  Y10S707/99939

摘要： A system management method is disclosed for associating a process object and a process with each node in a tree structure, and operating each node based on the tree structure so as to manage the process object and the process, including: registering a registered user that performs operations for a general node corresponding to the process object or for a function node corresponding to the process; setting the function node as a child node of the general node corresponding to the process object for which the process corresponding to the function node should be performed, and setting the general node as a parent node of the function node; setting registered user operation authority for each registered user; and, when execution of the process corresponding to the function node is requested by the registered user, causing the function node to execute the process only when the process is permitted by the registered user operation authority, of the registered user requesting the process, set in the general node that is a parent node of the function node.

摘要翻译： 公开了一种系统管理方法，用于将过程对象和过程与树结构中的每个节点相关联，并且基于树结构操作每个节点，以便管理过程对象和过程，包括：注册执行的注册用户 对应于过程对象或对应于过程的功能节点的通用节点的操作; 将功能节点设置为与应该执行与功能节点对应的进程的进程对象对应的通用节点的子节点，并将总节点设置为功能节点的父节点; 为每个注册用户设置注册用户操作权限; 并且当被注册用户请求与功能节点相对应的处理的执行时，仅当注册用户操作权限的注册用户的请求进程被许可的功能节点才执行该处理时，设置为 作为功​​能节点的父节点的通用节点。

公开(公告)号：US07454421B2

公开(公告)日：2008-11-18

申请号：US10522552

申请日：2004-07-09

申请人： Takashi Imaeda ,  Kimitaka Endo ,  Jouji Nakayama ,  Tetsuya Yamamoto ,  Ken-ichiro Shimokura ,  Tsutomu Yabuuchi ,  Hirohisa Tezuka ,  Masato Urano

发明人： Takashi Imaeda ,  Kimitaka Endo ,  Jouji Nakayama ,  Tetsuya Yamamoto ,  Ken-ichiro Shimokura ,  Tsutomu Yabuuchi ,  Hirohisa Tezuka ,  Masato Urano

IPC分类号： G06F17/30

CPC分类号： H04L63/0807 ,  G06F21/335 ,  G06F21/6218 ,  G06F2221/2115 ,  H04L63/102 ,  Y10S707/99939

摘要： A database access control apparatus generates and stores an access key based on a user ID of a user apparatus. Then, the database access control apparatus sends the access key to the user apparatus with an address of a proxy process server apparatus. The user apparatus sends the access key to the proxy process server apparatus when making a database access request, and the proxy process server apparatus sends the access key to the database access control apparatus when making a database process request. When receiving the database process request, the database access control apparatus determines whether an access key same as the access key received from the proxy process server apparatus is stored in the database access control apparatus, and accesses the database only if having the access key.

摘要翻译： 数据库访问控制装置基于用户装置的用户ID生成并存储访问密钥。 然后，数据库访问控制装置使用代理处理服务器装置的地址向用户装置发送访问密钥。 当进行数据库访问请求时，用户装置将访问密钥发送给代理处理服务器装置，并且代理处理服务器装置在进行数据库处理请求时将访问密钥发送到数据库访问控制装置。 数据库访问控制装置在接收到数据库处理请求时，确定与从代理处理服务器装置接收的访问密钥相同的访问密钥是否存储在数据库访问控制装置中，只有具有访问密钥才能访问数据库。

公开(公告)号：US20060190588A1

公开(公告)日：2006-08-24

申请号：US10564183

申请日：2004-07-09

申请人： Jouji Nakayama ,  Tetsuya Yamamoto ,  Ken-chiro Shimokura ,  Tsutomu Yabuuchi ,  Kimitaka Endo ,  Takashi Imaeda

发明人： Jouji Nakayama ,  Tetsuya Yamamoto ,  Ken-chiro Shimokura ,  Tsutomu Yabuuchi ,  Kimitaka Endo ,  Takashi Imaeda

IPC分类号： G06F15/173

CPC分类号： G06F17/30011 ,  G06F21/6218 ,  G06F2221/2141 ,  G06F2221/2145 ,  Y10S707/99939

摘要： A system management method is disclosed for associating a process object and a process with each node in a tree structure, and operating each node based on the tree structure so as to manage the process object and the process, including: registering a registered user that performs operations for a general node corresponding to the process object or for a function node corresponding to the process; setting the function node as a child node of the general node corresponding to the process object for which the process corresponding to the function node should be performed, and setting the general node as a parent node of the function node; setting registered user operation authority for each registered user; and, when execution of the process corresponding to the function node is requested by the registered user, causing the function node to execute the process only when the process is permitted by the registered user operation authority, of the registered user requesting the process, set in the general node that is a parent node of the function node.

公开(公告)号：US20050161804A1

公开(公告)日：2005-07-28

申请号：US11029423

申请日：2005-01-06

申请人： Tomoo Iijima ,  Kimitaka Endo

发明人： Tomoo Iijima ,  Kimitaka Endo

IPC分类号： H05K3/06 ,  H05K3/10 ,  H05K3/20 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H01L21/44 ,  H01L23/48

CPC分类号： H05K3/4617 ,  H01L2924/0002 ,  H05K3/06 ,  H05K3/108 ,  H05K3/20 ,  H05K3/386 ,  H05K3/4038 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0113 ,  H05K2203/0143 ,  H05K2203/0156 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/063 ,  H05K2203/1189 ,  H05K2203/1461 ,  H05K2203/1476 ,  H05K2203/1572 ,  H01L2924/00

摘要： A connecting member between wiring films is provided in which: a normal copper foil, which is a general-purpose component and not expensive, or the like can be used as a material; formation of bumps is sufficiently achieved by conducting etching one time; and a necessary number of layers can be laminated and pressed collectively at a time. Bumps, which are formed approximately in a cone-shape, for connecting wiring films of a multilayer wiring substrate are embedded in a second resin film that serves as an interlayer insulating film.

摘要翻译： 提供布线膜之间的连接部件，其中：作为通用部件的普通铜箔并不昂贵等，可以用作材料; 通过进行一次蚀刻来充分实现凸块的形成; 并且可以一次层叠和压制必要数量的层。 形成为大致锥形的用于连接多层布线基板的布线膜的凸起嵌入在用作层间绝缘膜的第二树脂膜中。

公开(公告)号：US08859420B2

公开(公告)日：2014-10-14

申请号：US13085126

申请日：2011-04-12

申请人： Kimitaka Endo ,  Norihito Masuda ,  Tomokazu Shimada

发明人： Kimitaka Endo ,  Norihito Masuda ,  Tomokazu Shimada

IPC分类号： H01L23/04 ,  H01L23/498 ,  H01L23/538 ,  H05K3/46 ,  H01L21/48 ,  H05K3/20 ,  H05K3/42 ,  H05K3/06

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/5383 ,  H01L2924/0002 ,  H05K3/064 ,  H05K3/205 ,  H05K3/423 ,  H05K3/4647 ,  H05K2203/0384 ,  H05K2203/0542 ,  H05K2203/0733 ,  Y10S438/931 ,  Y10T29/49124 ,  H01L2924/00

摘要： A method of fabricating an interconnect element may include fabricating a metal layer that overlies a carrier layer and that includes a plurality of metal traces; providing a dielectric element to overlie the metal layer and the carrier layer; providing a plurality of metal posts; and removing the carrier layer to expose the first major surface of the dielectric element and the outer surfaces of the plurality of metal traces.

摘要翻译： 制造互连元件的方法可以包括制造覆盖载体层并且包括多个金属迹线的金属层; 提供介电元件以覆盖金属层和载体层; 提供多个金属柱; 以及去除载体层以暴露介质元件的第一主表面和多个金属迹线的外表面。

公开(公告)号：US08505199B2

公开(公告)日：2013-08-13

申请号：US12228890

申请日：2008-08-15

申请人： Jinsu Kwon ,  Kimitaka Endo ,  Sean Moran

发明人： Jinsu Kwon ,  Kimitaka Endo ,  Sean Moran

IPC分类号： H01R43/16 ,  H05K1/11

CPC分类号： H05K1/11 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/05 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2203/0384 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2924/00

摘要： An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element. The interconnection element typically includes a plurality of terminals in conductive communication with the metal posts. The terminals can be connected through the dielectric element to the metal posts. The posts may be defined by plating a metal onto exposed co-planar surfaces of a mandrel and interior surfaces of openings in a mandrel, after which the mandrel can be removed.

摘要翻译： 提供互连元件用于与具有微电子器件或其上的布线中的至少一个的另一元件的导电互连。 互连元件包括具有主表面的电介质元件。 包括多个暴露的金属柱的电镀金属层可以向外突出超过介电元件的主表面。 一些金属柱可以通过电介质元件彼此电绝缘。 互连元件通常包括与金属柱导电连通的多个端子。 端子可以通过电介质元件连接到金属柱。 可以通过将金属镀在芯棒的暴露的共平面表面和心轴中的开口的内表面上来定义柱，然后可以去除心轴。

公开(公告)号：US20100071944A1

公开(公告)日：2010-03-25

申请号：US12519950

申请日：2007-12-17

申请人： Kimitaka Endo

发明人： Kimitaka Endo

IPC分类号： H05K1/16 ,  H05K3/30

CPC分类号： H01L23/5389 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/50 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H05K1/0231 ,  H05K1/188 ,  H05K3/243 ,  H05K3/328 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/10636 ,  H05K2203/0369 ,  H05K2203/0384 ,  Y02P70/611 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A multiple wiring layer interconnection element includes capacitors or other electrical components embedded between a first exposed wiring layer and a second exposed wiring layer of the interconnection element. Internal wiring layers and are provided between exposed surfaces of the respective capacitors, the internal wiring layers being electrically insulated from the capacitors by dielectric layers. The internal wiring layers are isolated from each other by an internal dielectric layer. Conductive vias provide conductive interconnection between the two internal wiring layers. A method of fabricating a multiple wiring layer interconnection element is also provided.

摘要翻译： 多个布线层互连元件包括嵌入在互连元件的第一暴露布线层和第二暴露布线层之间的电容器或其它电气元件。 内部布线层设置在各电容器的露出面之间，内部配线层通过电介质层与电容器电绝缘。 内部布线层通过内部电介质层彼此隔离。 导电通孔在两个内部布线层之间提供导电互连。 还提供了制造多重布线层互连元件的方法。

公开(公告)号：US20100044860A1

公开(公告)日：2010-02-25

申请号：US12462208

申请日：2009-07-30

申请人： Belgacem Haba ,  Chang Myung Ryu ,  Kimitaka Endo ,  Christopher Paul Wade

发明人： Belgacem Haba ,  Chang Myung Ryu ,  Kimitaka Endo ,  Christopher Paul Wade

IPC分类号： H01L23/498 ,  H01L21/768

CPC分类号： H01L24/89 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13017 ,  H01L2224/13021 ,  H01L2224/13609 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An interconnection element can include a substrate, e.g., a connection substrate, element of a package, circuit panel or microelectronic substrate, e.g., semiconductor chip, the substrate having a plurality of metal conductive elements such as conductive pads, contacts, bond pads, traces, or the like exposed at the surface. A plurality of solid metal posts may overlie and project away from respective ones of the conductive elements. An intermetallic layer can be disposed between the posts and the conductive elements, such layer providing electrically conductive interconnection between the posts and the conductive elements. Bases of the posts adjacent to the intermetallic layer can be aligned with the intermetallic layer.

摘要翻译： 互连元件可以包括衬底，例如连接衬底，封装的元件，电路板或微电子衬底，例如半导体芯片，衬底具有多个金属导电元件，例如导电焊盘，触点，接合焊盘，迹线 ，或类似物暴露在表面。 多个固体金属柱可以覆盖并突出远离相应的导电元件。 金属间层可以设置在柱和导电元件之间，这种层在柱和导电元件之间提供导电互连。 与金属间化合物层相邻的柱的基底可与金属间层对准。

公开(公告)号：US20050224256A1

公开(公告)日：2005-10-13

申请号：US11085108

申请日：2005-03-22

申请人： Kenji Osawa ,  Masayuki Osawa ,  Tomokazu Shimada ,  Kimitaka Endo ,  Tomoo Iijima

发明人： Kenji Osawa ,  Masayuki Osawa ,  Tomokazu Shimada ,  Kimitaka Endo ,  Tomoo Iijima

IPC分类号： H01L21/4763 ,  H01L21/48 ,  H01L21/60 ,  H01L23/50 ,  H05K1/11 ,  H05K1/16 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K3/4614 ,  H01L2924/0002 ,  H05K3/423 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0384 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/1152 ,  H01L2924/00

摘要： To increase the dimensional accuracy of an interlayer member used for producing a multilayer wiring board which is inserted between two wiring layers to establish interlayer insulation and interlayer electrical connection between the wiring layers, to thereby increase a layout density. A mask film is formed on a main surface of a sheet-like carrier layer. A metal column for interlayer connection is formed on the main surface of the carrier layer by plating a copper using the mask film as a mask. The mask film is removed. An interlayer insulating layer and a protective sheet are laminated on the main surface of the carrier layer in such a manner that the metal column for interlayer connection penetrates them. The interlayer insulating layer and the protective sheet are polished until the upper surface of the metal column for interlayer connection is exposed. Then, the carrier layer is removed. Furthermore, the protective sheet is removed.

摘要翻译： 为了提高用于制造插入在两个布线层之间的多层布线板的层间构件的尺寸精度，以​​建立布线层之间的层间绝缘和层间电连接，从而增加布局密度。 在片状载体层的主表面上形成掩模膜。 通过使用掩模膜作为掩模将铜电镀形成在载体层的主表面上的用于层间连接的金属柱。 去除掩模膜。 层间绝缘层和保护片层叠在载体层的主表面上，使得用于层间连接的金属柱穿透它们。 抛光层间绝缘层和保护片，直到露出用于层间连接的金属柱的上表面。 然后，移除载体层。 此外，去除保护片。