Memory element circuitry with stressed transistors
    1.
    发明授权
    Memory element circuitry with stressed transistors 有权
    具有应力晶体管的存储元件电路

    公开(公告)号:US08218353B1

    公开(公告)日:2012-07-10

    申请号:US12561236

    申请日:2009-09-16

    IPC分类号: G11C11/00

    CPC分类号: G11C11/412

    摘要: Integrated circuits with memory elements are provided. The memory elements may be arranged in a memory block. The memory block may include cross-coupled inverters that store data. The stored data may be used to program pass transistors. Transistors in the memory block may be stressed. Depending on the type of stress-inducing layer used, a tensile stress or a compressive stress may be built in into the transistors. Stressed transistors may help improve the routing speed of the memory block. Stressed transistors may be implemented using dual gate-oxide process.

    摘要翻译: 提供具有存储元件的集成电路。 存储器元件可以被布置在存储器块中。 存储器块可以包括存储数据的交叉耦合的反相器。 存储的数据可用于编程传输晶体管。 存储器块中的晶体管可能受到压力。 根据所使用的应力诱导层的类型,可以将内部的拉伸应力或压应力内置到晶体管中。 受压的晶体管可能有助于提高存储器块的布线速度。 可以使用双栅极氧化工艺来实施受压晶体管。

    Integrated circuits with asymmetric and stacked transistors
    2.
    发明授权
    Integrated circuits with asymmetric and stacked transistors 有权
    具有不对称和堆叠晶体管的集成电路

    公开(公告)号:US08482963B1

    公开(公告)日:2013-07-09

    申请号:US12629831

    申请日:2009-12-02

    IPC分类号: G11C11/00

    CPC分类号: G11C11/412

    摘要: Asymmetric transistors may be formed by creating pocket implants on one source-drain terminal of a transistor and not the other. Asymmetric transistors may also be formed using dual-gate structures having first and second gate conductors of different work functions. Stacked transistors may be formed by stacking two transistors of the same channel type in series. One of the source-drain terminals of each of the two transistors is connected to a common node. The gates of the two transistors are also connected together. The two transistors may have different threshold voltages. The threshold voltage of the transistor that is located higher in the stacked transistor may be provided with a lower threshold voltage than the other transistor in the stacked transistor. Stacked transistors may be used to reduce leakage currents in circuits such as memory cells. Asymmetric transistors may also be used in memory cells to reduce leakage.

    摘要翻译: 不对称晶体管可以通过在晶体管的一个源极 - 漏极端子上而不是另一个产生凹穴注入来形成。 也可以使用具有不同功函数的第一和第二栅极导体的双栅结构来形成非对称晶体管。 可以通过堆叠相同通道类型的两个晶体管串联形成堆叠晶体管。 两个晶体管中的每一个的源极 - 漏极端子之一连接到公共节点。 两个晶体管的栅极也连接在一起。 两个晶体管可以具有不同的阈值电压。 位于堆叠晶体管中较高的晶体管的阈值电压可以具有比堆叠晶体管中的另一个晶体管更低的阈值电压。 堆叠的晶体管可用于减少诸如存储器单元的电路中的漏电流。 不对称晶体管也可用于存储器单元中以减少泄漏。

    MULTIPORT MEMORY ELEMENT CIRCUITRY
    3.
    发明申请
    MULTIPORT MEMORY ELEMENT CIRCUITRY 有权
    多媒体存储元件电路

    公开(公告)号:US20120311401A1

    公开(公告)日:2012-12-06

    申请号:US13149249

    申请日:2011-05-31

    IPC分类号: G11C7/00 G06F11/10 H03M13/05

    摘要: Integrated circuits with multiport memory elements may be provided. A multiport memory element may include a latching circuit, a first set of address transistors, and a second set of address transistors. The latching circuit may include cross-coupled inverters, each of which includes a pull-up transistor and a pull-down transistor. The first set of address transistors may couple the latching circuit to a write port, whereas the second set of address transistors may couple the latching circuit to a read port. The pull-down transistors and the second set of address transistors may have body bias terminals that are controlled by a control signal. During data loading operations, the control signal may be temporarily elevated to weaken the pull-down transistors and the second set of address transistors to improve the write margin of the multiport memory element.

    摘要翻译: 可以提供具有多端口存储器元件的集成电路。 多端口存储元件可以包括锁存电路,第一组地址晶体管和第二组地址晶体管。 锁存电路可以包括交叉耦合的反相器,每个反相器包括上拉晶体管和下拉晶体管。 第一组地址晶体管可以将锁存电路耦合到写入端口,而第二组地址晶体管可以将锁存电路耦合到读取端口。 下拉晶体管和第二组地址晶体管可以具有由控制信号控制的体偏置端子。 在数据加载操作期间,控制信号可以临时升高以削弱下拉晶体管和第二组地址晶体管,以改善多端口存储器元件的写入裕度。

    Multiport memory element circuitry
    6.
    发明授权
    Multiport memory element circuitry 有权
    多端口存储元件电路

    公开(公告)号:US08755218B2

    公开(公告)日:2014-06-17

    申请号:US13149249

    申请日:2011-05-31

    IPC分类号: G11C11/00

    摘要: Integrated circuits with multiport memory elements may be provided. A multiport memory element may include a latching circuit, a first set of address transistors, and a second set of address transistors. The latching circuit may include cross-coupled inverters, each of which includes a pull-up transistor and a pull-down transistor. The first set of address transistors may couple the latching circuit to a write port, whereas the second set of address transistors may couple the latching circuit to a read port. The pull-down transistors and the second set of address transistors may have body bias terminals that are controlled by a control signal. During data loading operations, the control signal may be temporarily elevated to weaken the pull-down transistors and the second set of address transistors to improve the write margin of the multiport memory element.

    摘要翻译: 可以提供具有多端口存储器元件的集成电路。 多端口存储元件可以包括锁存电路,第一组地址晶体管和第二组地址晶体管。 锁存电路可以包括交叉耦合的反相器,每个反相器包括上拉晶体管和下拉晶体管。 第一组地址晶体管可以将锁存电路耦合到写入端口,而第二组地址晶体管可以将锁存电路耦合到读取端口。 下拉晶体管和第二组地址晶体管可以具有由控制信号控制的体偏置端子。 在数据加载操作期间,控制信号可以临时升高以削弱下拉晶体管和第二组地址晶体管,以改善多端口存储器元件的写入裕度。

    Integrated circuits with asymmetric transistors
    7.
    发明授权
    Integrated circuits with asymmetric transistors 有权
    具有不对称晶体管的集成电路

    公开(公告)号:US08638594B1

    公开(公告)日:2014-01-28

    申请号:US13110823

    申请日:2011-05-18

    IPC分类号: G11C11/00 H01L21/02

    摘要: Integrated circuits with memory elements are provided. A memory element may include a storage circuit coupled to data lines through access transistors. Access transistors may be used to read data from and write data into the storage circuit. An access transistor may have asymmetric source-drain resistances. The access transistor may have a first source-drain that is coupled to a data line and a second source-drain that is coupled to the storage circuit. The second source-drain may have a contact resistance that is greater than the contact resistance associated with the first source-drain. Access transistors with asymmetric source-drain resistances may have a first drive strength when passing a low signal and a second drive strength when passing a high signal to the storage circuit. The second drive strength may be less than the first drive strength. Access transistors with asymmetric drive strengths may be used to improve memory read/write performance.

    摘要翻译: 提供具有存储元件的集成电路。 存储元件可以包括通过存取晶体管耦合到数据线的存储电路。 存取晶体管可用于从存储电路读取数据并将数据写入存储电路。 存取晶体管可以具有不对称的源极 - 漏极电阻。 存取晶体管可以具有耦合到数据线的第一源极 - 漏极和耦合到存储电路的第二源极 - 漏极。 第二源极 - 漏极可以具有大于与第一源极 - 漏极相关联的接触电阻的接触电阻。 具有不对称源极 - 漏极电阻的存取晶体管在通过高信号到存储电路时通过低信号和第二驱动强度时可具有第一驱动强度。 第二驱动强度可能小于第一驱动强度。 具有非对称驱动强度的存取晶体管可用于提高存储器读/写性能。

    Using thick spacer for bitline implant then remove
    9.
    发明授权
    Using thick spacer for bitline implant then remove 有权
    使用厚间隔物进行位线植入,然后移除

    公开(公告)号:US07888218B2

    公开(公告)日:2011-02-15

    申请号:US11724775

    申请日:2007-03-16

    IPC分类号: H01L21/336

    CPC分类号: H01L27/115 H01L27/11568

    摘要: The present invention pertains to a system method of forming at least a portion of a dual bit memory core array upon a semiconductor substrate, the method comprising forming adjacent first memory cell process assemblies; comprising a charge trapping dielectric, a first polysilicon layer and defining a first bitline opening there between, forming first polysilicon layer features over the charge trapping dielectric layer, depositing a layer of second spacer material over the charge trapping dielectric and the first polysilicon layer features, forming a sidewall spacer adjacent to the charge trapping dielectric and the first polysilicon layer features to define a second bitline opening between the adjacent memory cells, performing a bitline implant, or pocket implants, or both into the bitline opening to establish buried bitlines within the substrate having respective bitline widths that are narrower than the respective widths of the first bitline openings, removing the sidewall spacers, and performing back end processing.

    摘要翻译: 本发明涉及一种在半导体衬底上形成双位存储器芯阵列的至少一部分的系统方法,该方法包括形成相邻的第一存储单元处理组件; 包括电荷捕获电介质,第一多晶硅层并且在其间限定第一位线开口,在电荷俘获电介质层上形成第一多晶硅层特征,在电荷俘获电介质和第一多晶硅层特征之上沉积第二间隔物材料层, 形成与电荷俘获电介质相邻的侧壁间隔物,并且第一多晶硅层的特征在于限定相邻存储器单元之间的第二位线开口,执行位线注入或凹坑注入,或两者进入位线开口以在衬底内建立掩埋位线 具有比第一位线开口的相应宽度窄的各自的位线宽度,去除侧壁间隔件,以及执行后端处理。

    Programming a memory device
    10.
    发明授权
    Programming a memory device 有权
    编程内存设备

    公开(公告)号:US07269067B2

    公开(公告)日:2007-09-11

    申请号:US11174560

    申请日:2005-07-06

    IPC分类号: G11C11/34

    摘要: A method of programming a memory cell in a non-volatile memory device includes applying a first voltage to a control gate associated with the memory cell and applying a second voltage to a drain region associated with the memory cell. The method also includes applying a positive bias to a source region associated with the memory cell and/or applying a negative bias to a substrate region associated with the memory cell.

    摘要翻译: 一种对非易失性存储器件中的存储器单元进行编程的方法包括:将第一电压施加到与存储器单元相关联的控制栅极,并将第二电压施加到与存储器单元相关联的漏极区域。 该方法还包括向与存储器单元相关联的源极区域施加正偏压和/或将负偏压施加到与存储器单元相关联的衬底区域。