公开(公告)号：US20120326014A1

公开(公告)日：2012-12-27

申请号：US13470373

申请日：2012-05-14

申请人： KAI-WEN WU ,  YI-ZHONG SHEU

发明人： KAI-WEN WU ,  YI-ZHONG SHEU

IPC分类号： G01J1/42

CPC分类号： G02B6/4249 ,  G02B6/4292

摘要： An optical fiber connector assembly includes an optical socket and an optical plug. The optical socket defines a recess, and a coupling surface in the recess, with light emitters and light detectors on the coupling surface. Each light emitter includes a light emitting surface exposed in the recess, and is configured for converting a first electrical signal into a first optical signal. Each light detector includes a light incident surface exposed in the recess, and is configured for converting a second optical signal into a second electrical signal. The optical plug can be inserted into the recess, and includes optical output fibers aligned with the light emitting surface for outputting the first optical signal from the light emitting surface, and optical input fibers aligned with the light incident surface for inputting the second optical signal to the light incident surface.

摘要翻译： 光纤连接器组件包括光插座和光插头。 光学插座在凹槽中限定凹槽和耦合表面，在耦合表面上具有发光体和光检测器。 每个光发射器包括暴露在凹部中的发光表面，并且被配置为将第一电信号转换为第一光信号。 每个光检测器包括暴露在凹部中的光入射表面，并且被配置为将第二光信号转换为第二电信号。 光插头可以插入到凹部中，并且包括与发光表面对准的光输出光纤，用于从发光表面输出第一光信号，以及与光入射面对准的光输入光纤，用于将第二光信号输入到 光入射面。

公开(公告)号：US20130121649A1

公开(公告)日：2013-05-16

申请号：US13336011

申请日：2011-12-23

申请人： KAI-WEN WU ,  YI-ZHONG SHEU

发明人： KAI-WEN WU ,  YI-ZHONG SHEU

IPC分类号： G02B6/36

CPC分类号： G02B6/4292 ,  G02B6/3817

摘要： An optical fiber connector includes a body, a photoelectric conversion module received in the body, a receiving member, and two L-shaped optical fibers. The photoelectric conversion module includes a base, a light emitting unit, and a light receiving unit. The light emitting unit and the light receiving unit are mounted on the base. The receiving member is disposed over the light emitting unit and the light receiving unit and defines two L-shaped receiving holes. The optical fibers are received in the respective receiving holes. One end of one of the two optical fibers is optically aligned and coupled with the light emitting unit. One end of the other optical fiber is optically aligned and coupled with the light receiving unit.

摘要翻译： 光纤连接器包括主体，容纳在主体中的光电转换模块，接收构件和两个L形光纤。 光电转换模块包括基座，发光单元和光接收单元。 发光单元和光接收单元安装在基座上。 接收构件设置在发光单元和光接收单元之上并且限定两个L形接收孔。 光纤被容纳在相应的接收孔中。 两个光纤中的一个的一端光学对准并与发光单元耦合。 另一光纤的一端光学对准并与光接收单元耦合。

公开(公告)号：US20130302036A1

公开(公告)日：2013-11-14

申请号：US13564735

申请日：2012-08-02

申请人： KAI-WEN WU

发明人： KAI-WEN WU

IPC分类号： H04B10/14

CPC分类号： G02B6/43

摘要： A circuit board assembly includes a first circuit board, and a second circuit board, a first optical transceiver, a number of first light wave guides, a second optical transceiver, and a number of second light wave guides. The first circuit board defines a number of first through holes. The second circuit board defines a number of second and third through holes. Each of the third through holes is aligned with a respective first though hole. The first optical transceiver is optically coupled with the second through holes. The first light wave guides are mounted on one surface of the first circuit board and optically coupled with the second through holes. The second optical transceiver is optically coupled with the third through holes. The second light wave guides are mounted on another surface of the first circuit board and are optically coupled with the first through holes.

摘要翻译： 电路板组件包括第一电路板和第二电路板，第一光收发器，多个第一光波导，第二光收发器和多个第二光波导。 第一个电路板定义了多个第一通孔。 第二电路板限定了多个第二和第三通孔。 每个第三通孔与相应的第一通孔对齐。 第一光收发器与第二通孔光学耦合。 第一光波导安装在第一电路板的一个表面上并与第二通孔光耦合。 第二光收发器与第三通孔光学耦合。 第二光波导安装在第一电路板的另一个表面上并与第一通孔光学耦合。

公开(公告)号：US20130251313A1

公开(公告)日：2013-09-26

申请号：US13555175

申请日：2012-07-22

申请人： KAI-WEN WU

发明人： KAI-WEN WU

IPC分类号： G02B6/36 ,  H01L23/48

CPC分类号： H01L25/0657 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L25/167 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48472 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2924/12042 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A high-frequency transmission module includes a first chip, a second chip, and a conductive wire. The first chip includes a first top surface and a number of pads arranged along a periphery of the first top surface. The pads include a first bonding pad. The second chip includes a second top surface and a second bonding pad on the second top surface. The second chip is positioned on the first top surface such that the pads are uncovered by the second chip and the second bonding pad is mostly closed to the first bonding pad. The conductive wire bonds to the first bonding pad and the second bonding pad to electrically connect the second chip to the first chip and is configured to transmit high-frequency signals between the first chip and the second chip.

摘要翻译： 高频传输模块包括第一芯片，第二芯片和导线。 第一芯片包括沿着第一顶表面的周边布置的第一顶表面和多个焊盘。 焊盘包括第一焊盘。 第二芯片包括在第二顶表面上的第二顶表面和第二焊盘。 第二芯片位于第一顶表面上，使得焊盘不被第二芯片覆盖，并且第二焊盘大部分封闭到第一焊盘。 导线键合到第一焊盘和第二接合焊盘，以将第二芯片电连接到第一芯片，并且被配置为在第一芯片和第二芯片之间传输高频信号。

公开(公告)号：US20130049233A1

公开(公告)日：2013-02-28

申请号：US13284978

申请日：2011-10-30

申请人： KAI-WEN WU

发明人： KAI-WEN WU

IPC分类号： H01L33/62 ,  H01L21/56

CPC分类号： H01L23/3185 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L33/48 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83141 ,  H01L2224/83192 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01S5/0226 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package includes a substrate, a pad, a double-sided adhesive tape, a chip, and a sealing member. The pad is arranged on the substrate and has a top surface facing away from the substrate. The double-sided adhesive tape includes a first paste surface and an opposing second paste surface. The first paste surface is attached to the top surface. The chip is attached onto the second paste surface and includes a light emitting surface or a light receiving surface facing away from the second paste surface. The sealing member is formed on the pad and tightly surrounds the chip and the double-sided adhesive.

摘要翻译： 芯片封装包括衬底，衬垫，双面胶带，芯片和密封构件。 衬垫布置在衬底上并且具有背离衬底的顶表面。 双面胶带包括第一糊状表面和相对的第二糊状表面。 第一浆料表面附着到顶部表面。 该芯片附着在第二糊状表面上，并且包括背离第二糊状物表面的发光表面或光接收表面。 密封构件形成在垫上并紧密地包围芯片和双面粘合剂。

公开(公告)号：US20130306837A1

公开(公告)日：2013-11-21

申请号：US13552659

申请日：2012-07-19

申请人： KAI-WEN WU

发明人： KAI-WEN WU

IPC分类号： G01J1/04

CPC分类号： H05K1/111 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2201/10121 ,  Y02P70/611

摘要： An optical-electrical converting device includes a substrate, an electrical circuit layer, at least one auxiliary pad, and an optical-electrical converting lens. The electrical circuit layer includes at least one circuit portion. The optical-electrical lens includes at least one first supporting portion and at least one second supporting portion. Each of the at least one first supporting portion is positioned on a respective one of the at least one first circuit portion, and each of the at least one second supporting portion is positioned on a respective one of the at least one auxiliary pad. The electrical circuit layer and the at least one auxiliary pad are arranged on the substrate. The thickness of the at least one first circuit portion layer is substantially equal to the thickness of the at least one auxiliary pad.

摘要翻译： 光电转换装置包括衬底，电路层，至少一个辅助衬垫和光电转换透镜。 电路层包括至少一个电路部分。 光电透镜包括至少一个第一支撑部分和至少一个第二支撑部分。 所述至少一个第一支撑部分中的每一个位于所述至少一个第一电路部分中的相应一个上，并且所述至少一个第二支撑部分中的每个位于所述至少一个辅助垫中的相应一个上。 电路层和至少一个辅助衬垫布置在衬底上。 至少一个第一电路部分层的厚度基本上等于至少一个辅助焊盘的厚度。

公开(公告)号：US20130285243A1

公开(公告)日：2013-10-31

申请号：US13559622

申请日：2012-07-27

申请人： KAI-WEN WU

发明人： KAI-WEN WU

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L2224/26165 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83874 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15153 ,  H05K1/0274 ,  H05K3/305 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/2018 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00

摘要： A chip assembly includes a PCB, a connecting pad fixed on the PCB, and a chip. The connecting pad defines a through hole. The chip is received in the through hole and fixed on the PCB by an adhesive distributed in the through hole. A thickness of the adhesive is less than that of the connecting pad.

摘要翻译： 芯片组件包括PCB，固定在PCB上的连接焊盘和芯片。 连接垫定义一个通孔。 芯片被容纳在通孔中并通过分布在通孔中的粘合剂固定在PCB上。 粘合剂的厚度小于连接垫的厚度。

公开(公告)号：US20130269983A1

公开(公告)日：2013-10-17

申请号：US13534217

申请日：2012-06-27

申请人： KAI-WEN WU

发明人： KAI-WEN WU

IPC分类号： H05K1/18 ,  G01R31/28 ,  H01R43/00

CPC分类号： H05K1/0253 ,  H01R12/53 ,  H01R13/6474 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/111 ,  H05K1/117 ,  H05K3/40 ,  H05K2201/09372 ,  H05K2201/10287 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155

摘要： A circuit board assembly includes a circuit board, at least one pad formed on the circuit board, and at least one connection line. Each of the at least one connection line includes a connection end connected to a respective one of the at least one pad and has the same resistance value as the respective pad.

公开(公告)号：US20130146752A1

公开(公告)日：2013-06-13

申请号：US13446246

申请日：2012-04-13

申请人： KAI-WEN WU

发明人： KAI-WEN WU

IPC分类号： H01L31/147 ,  H01S3/10

CPC分类号： H01L31/147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/16152 ,  H01S5/02208 ,  H01S5/02288 ,  H01L2924/00014

摘要： An optical-electrical module includes a base board, a laser diode, an integrated circuit, and a lens unit. The laser diode and the integrated circuit are both fixed on the base board. The lens unit and the base board cooperatively define a receiving space to receive the laser diode and the integrated circuit. The laser diode has a transmitting window at an end of the laser diode away from the base board. The integrated circuit drives the laser diode to transmit optical signals. The lens unit has an inner surface facing the base board, and the inner surface of the lens unit has a light transmitting area. The lens unit includes a metal film formed on the inner surface of the lens unit except on the light transmitting area.

摘要翻译： 光电模块包括基板，激光二极管，集成电路和透镜单元。 激光二极管和集成电路都固定在基板上。 透镜单元和基板协作地限定了接收激光二极管和集成电路的接收空间。 激光二极管在激光二极管的远离基板的一端具有发射窗口。 集成电路驱动激光二极管传输光信号。 透镜单元具有面向基板的内表面，并且透镜单元的内表面具有透光区域。 透镜单元包括形成在透镜单元的内表面上的除了透光区域之外的金属膜。

公开(公告)号：US20130142485A1

公开(公告)日：2013-06-06

申请号：US13337163

申请日：2011-12-26

申请人： KAI-WEN WU

发明人： KAI-WEN WU

IPC分类号： G02B6/38

CPC分类号： G02B6/32 ,  G02B6/3853 ,  G02B6/3882 ,  G02B6/3885

摘要： An optical fiber coupling assembly includes a first optical fiber connector and a second optical fiber connector. The first optical fiber connector includes a first body having a first light incident surface, first optical lenses, first plugs, and second plugs. The first optical lenses, the first plugs, and the second plugs are formed on the first light incident surface. The first optical lenses are positioned between the first plugs, and the first plugs are positioned between the second plugs. The second plugs are longer than the first plugs. The second optical fiber connector includes a second body having a second light incident surface and second optical lenses formed on the second light incident surface. First engaging holes and second engaging holes are defined in the second light incident surface. The first plugs are inserted into the first engaging holes, and the second plugs are inserted into the second engaging holes.

摘要翻译： 光纤耦合组件包括第一光纤连接器和第二光纤连接器。 第一光纤连接器包括具有第一光入射表面的第一本体，第一光学透镜，第一插头和第二插头。 第一光学透镜，第一插头和第二插头形成在第一光入射表面上。 第一光学透镜位于第一插头之间，第一插头位于第二插头之间。 第二个插头比第一个插头长。 第二光纤连接器包括具有第二光入射表面的第二主体和形成在第二光入射表面上的第二光学透镜。 第一接合孔和第二接合孔限定在第二光入射表面中。 第一插头插入到第一接合孔中，第二插头插入到第二接合孔中。