公开(公告)号：US20240422892A1

公开(公告)日：2024-12-19

申请号：US18706411

申请日：2022-11-17

Applicant: Kuprion Inc.

Inventor： Alfred A. Zinn

IPC: H05K1/02

Abstract: Heat spreaders may be tailored for coefficient of thermal expansion (CTE) matching with electronic components or other heat-producing components in thermal communication therewith. In some cases, the heat-producing component may be bonded to the heat spreader while realizing the CTE matching. Copper nanoparticles may be consolidated under mild conditions with a CTE modifier to define a heat spreader configured for contacting a heat source and a heat sink, in which at least a portion of the heat spreader comprises a copper composite comprising the CTE modifier. The copper composite may be present in a thermally conductive body or a coating thereon that defines the heat spreader. The copper composite may contact a heat-producing component for promoting effective heat transfer and robust bonding between the two, such as within a printed circuit board (PCB), followed by dissipation of the heat to a heat sink or other heat-receiving structure.

公开(公告)号：US12091567B2

公开(公告)日：2024-09-17

申请号：US17591264

申请日：2022-02-02

Applicant: Kuprion, Inc.

Inventor： Zhenggang Li ,  Yeng Ming Lam ,  Chee Lip Gan ,  Jaewon Kim ,  Alfred A. Zinn

IPC: C09D11/52 ,  B22F1/052 ,  B22F1/0545 ,  B22F1/102 ,  B41M5/00 ,  B41M7/00 ,  B82Y30/00 ,  B82Y40/00 ,  C09D5/24 ,  C09D11/033 ,  C09D11/037 ,  C09D11/322 ,  C09D11/36 ,  C09D11/38 ,  H01B1/02 ,  H01B1/22 ,  H01B5/14 ,  H01B13/00 ,  H05K1/09 ,  H05K3/12 ,  B22F7/08 ,  B22F10/10 ,  B22F10/25 ,  B22F10/28 ,  B22F10/40 ,  B22F10/64

CPC classification number: C09D11/52 ,  B22F1/052 ,  B22F1/0545 ,  B22F1/102 ,  B41M5/0023 ,  B41M7/009 ,  B82Y40/00 ,  C09D5/24 ,  C09D11/033 ,  C09D11/037 ,  C09D11/322 ,  C09D11/36 ,  C09D11/38 ,  H01B1/026 ,  H01B1/22 ,  H01B5/14 ,  H01B13/0016 ,  H05K1/097 ,  H05K3/1283 ,  B22F7/08 ,  B22F10/10 ,  B22F10/25 ,  B22F10/28 ,  B22F10/40 ,  B22F10/64 ,  B22F2998/10 ,  B22F2999/00 ,  B82Y30/00 ,  H05K2201/0245 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/0272 ,  B22F2999/00 ,  B22F1/054 ,  B22F1/0547 ,  B22F1/065 ,  B22F1/0551 ,  B22F2998/10 ,  B22F10/10 ,  B22F3/10 ,  B22F2999/00 ,  B22F1/065 ,  B22F1/054 ,  B22F1/0551 ,  B22F1/0547 ,  B22F2999/00 ,  B22F1/056 ,  B22F1/0547 ,  B22F1/065 ,  B22F1/0551 ,  B22F2999/00 ,  B22F1/065 ,  B22F1/056 ,  B22F1/0551 ,  B22F1/0547

Abstract: According to embodiments of the present invention, an ink composition is provided. The ink composition includes a plurality of nanostructures distributed in at least two cross-sectional dimension ranges, wherein each nanostructure of the plurality of nanostructures is free of a cross-sectional dimension of more than 200 nm. According to further embodiments of the present invention, a method for forming a conductive member and a conductive device are also provided.

公开(公告)号：US20200214121A1

公开(公告)日：2020-07-02

申请号：US16802899

申请日：2020-02-27

Applicant: Kuprion, Inc.

Inventor： Alfred A. Zinn

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/40

Abstract: Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer.

公开(公告)号：US20240206048A1

公开(公告)日：2024-06-20

申请号：US18413275

申请日：2024-01-16

Applicant: Kuprion Inc.

Inventor： Alfred A. Zinn

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K1/0206 ,  H05K1/09 ,  H05K1/112 ,  H05K1/115 ,  H05K3/4053 ,  H05K1/0204 ,  H05K1/097 ,  H05K2201/0257 ,  H05K2201/066

Abstract: Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions, such as copper nanoparticle paste compositions, may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer. Adherence of the monolithic metal bodies within the vias may be promoted by a coating upon the walls of the vias. A tin coating, for example, may be particularly suitable for promoting adherence of a monolithic metal body comprising copper.

公开(公告)号：US11910520B2

公开(公告)日：2024-02-20

申请号：US17201528

申请日：2021-03-15

Applicant: Kuprion, Inc.

Inventor： Alfred A. Zinn

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/30 ,  H01L21/48 ,  H01L21/50 ,  H01L21/52 ,  H01L23/48 ,  H01L23/373 ,  H05K3/40 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/0206 ,  H05K1/09 ,  H05K1/112 ,  H05K1/115 ,  H05K3/4053 ,  H05K1/0204 ,  H05K1/097 ,  H05K2201/0257 ,  H05K2201/066

Abstract: Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions, such as copper nanoparticle paste compositions, may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer. Adherence of the monolithic metal bodies within the vias may be promoted by a coating upon the walls of the vias. A tin coating, for example, may be particularly suitable for promoting adherence of a monolithic metal body comprising copper.

公开(公告)号：US11735548B2

公开(公告)日：2023-08-22

申请号：US17266749

申请日：2019-08-08

Applicant: Kuprion Inc.

Inventor： Alfred A. Zinn

IPC: H01L23/00 ,  H01L23/10 ,  H01L23/373 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L24/13 ,  H01L23/10 ,  H01L23/3733 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2225/0652 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541

Abstract: Electronic assemblies may be fabricated with interconnects of different types present in multiple locations and comprising fused copper nanoparticles. Each interconnect or a portion thereof comprises a bulk copper matrix formed from fusion of copper nanoparticles or a reaction product formed from copper nanoparticles. The interconnects may comprise a copper-based wire bonding assembly, a copper-based flip chip connection, a copper-based hermetic seal assembly, a copper-based connector between an IC substrate and a package substrate, a copper-based component interconnect, a copper-based interconnect comprising via copper for establishing electrical communication between opposite faces of a package substrate, a copper-based interconnect defining a heat channel formed from via copper, and any combination thereof.

公开(公告)号：US20210227680A1

公开(公告)日：2021-07-22

申请号：US17201528

申请日：2021-03-15

Applicant: Kuprion, Inc.

Inventor： Alfred A. Zinn

IPC: H05K1/02 ,  H05K3/40 ,  H05K1/09

Abstract: Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions, such as copper nanoparticle paste compositions, may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer. Adherence of the monolithic metal bodies within the vias may be promoted by a coating upon the walls of the vias. A tin coating, for example, may be particularly suitable for promoting adherence of a monolithic metal body comprising copper.

公开(公告)号：US12016118B2

公开(公告)日：2024-06-18

申请号：US17760079

申请日：2021-02-26

Applicant: KUPRION INC.

Inventor： Alfred A. Zinn ,  Khanh Nguyen

IPC: H05K1/09 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/10 ,  H05K3/30 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0306 ,  H05K1/092 ,  H05K1/115 ,  H05K1/181 ,  H05K1/183 ,  H05K3/107 ,  H05K3/303 ,  H05K3/4038 ,  H05K3/46 ,  H05K2201/09227 ,  H05K2201/09563

Abstract: Printed circuit boards may be formed using ceramic substrates with high thermal conductivity to facilitate heat dissipation. Metal nanoparticles, such as copper nanoparticles, may be used to form conductive traces and fill through-plane vias upon the ceramic substrates. Multi-layer printed circuit boards may comprise two or more ceramic substrates adhered together, wherein each ceramic substrate has one or more conductive traces defined thereon and the one or more conductive traces are formed through consolidation of metal nanoparticles. The one or more conductive traces in a first ceramic substrate layer are in electrical communication with at least one second ceramic substrate layer adjacent thereto.

公开(公告)号：US11503700B2

公开(公告)日：2022-11-15

申请号：US16802899

申请日：2020-02-27

Applicant: Kuprion, Inc.

Inventor： Alfred A. Zinn

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/10 ,  H05K3/40 ,  H01L23/00 ,  H01L23/10

Abstract: Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer.

公开(公告)号：US11141785B2

公开(公告)日：2021-10-12

申请号：US16740776

申请日：2020-01-13

Applicant: Kuprion Inc.

Inventor： Alfred A. Zinn

IPC: B22F1/00 ,  B22F1/02 ,  B22F9/24 ,  B01J13/02 ,  B22F9/18 ,  B82Y40/00

Abstract: Metal nanoparticles and compositions derived therefrom can be used in a number of different applications. Methods for making metal nanoparticles can include providing a first metal salt in a solvent; converting the first metal salt into an insoluble compound that constitutes a plurality of nanoparticle seeds; and after forming the plurality of nanoparticle seeds, reacting a reducing agent with at least a portion of a second metal salt in the presence of at least one surfactant and the plurality of nanoparticle seeds to form a plurality of metal nanoparticles. Each metal nanoparticle can include a metal shell formed around a nucleus derived from a nanoparticle seed, and the metal shell can include a metal from the second metal salt. The methods can be readily scaled to produce bulk quantities of metal nanoparticles.