公开(公告)号：US08803269B2

公开(公告)日：2014-08-12

申请号：US13463408

申请日：2012-05-03

申请人： Kalpendu Shastri ,  Vipulkumar Patel ,  Mark Webster ,  Prakash Gothoskar ,  Ravinder Kachru ,  Soham Pathak ,  Rao V. Yelamarty ,  Thomas Daugherty ,  Bipin Dama ,  Kaushik Patel ,  Kishor Desai

发明人： Kalpendu Shastri ,  Vipulkumar Patel ,  Mark Webster ,  Prakash Gothoskar ,  Ravinder Kachru ,  Soham Pathak ,  Rao V. Yelamarty ,  Thomas Daugherty ,  Bipin Dama ,  Kaushik Patel ,  Kishor Desai

IPC分类号： H01L31/0232 ,  H01L29/40 ,  H01L23/053 ,  H01L23/12

CPC分类号： H01L25/50 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4257 ,  G02B6/426 ,  H01L25/167 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.

摘要翻译： 光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。 特别地，硅晶片被用作“平台”（插入器），在其上安装或集成多个收发器模块的所有组件，硅插入器的顶表面用作参考平面，用于定义 分离光学元件之间的光信号路径。 实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。

公开(公告)号：US20100316388A1

公开(公告)日：2010-12-16

申请号：US12813562

申请日：2010-06-11

申请人： Kalpendu Shastri ,  Bipin Dama ,  Vipulkumar Patel ,  Mark Webster

发明人： Kalpendu Shastri ,  Bipin Dama ,  Vipulkumar Patel ,  Mark Webster

IPC分类号： H04B10/00

CPC分类号： H04N7/22 ,  G09G5/006 ,  G09G2370/12 ,  G09G2370/18

摘要： An HDMI interconnect arrangement is presented that performs a pulse-amplitude modulation (PAM) conversion of the TMDS audio/video signals in order to simultaneously transmit all three channels over a single optical fiber. The set of three audio/video TMDS channels is applied as an input to a PAM-8 optical modulator, which functions to encode the set of three channels onto an optically-modulated output signal. The modulated optical signal is thereafter coupled into an optical fiber within an active HDMI cable and transmitted to an HDMI receiver (sink). The TMDS CLK signal is not included in this conversion into the optical domain, but remains as a separate electrical signal to be transmitted along a copper signal path within the active HDMI cable.

摘要翻译： 呈现HDMI互连布置，其执行TMDS音频/视频信号的脉冲幅度调制（PAM）转换，以便通过单根光纤同时传输所有三个通道。 三组音频/视频TMDS通道的组合被用作PAM-8光调制器的输入，PAM-8光调制器用于将三个通道的组合编码到光调制的输出信号上。 调制的光信号此后耦合到有源HDMI电缆中的光纤中，并被传输到HDMI接收器（接收器）。 TMDS CLK信号不包含在该转换到光学域中，而是作为单独的电信号保持在有源HDMI电缆内的铜信号路径上传输。

公开(公告)号：US08340529B2

公开(公告)日：2012-12-25

申请号：US12813562

申请日：2010-06-11

申请人： Kalpendu Shastri ,  Bipin Dama ,  Vipulkumar Patel ,  Mark Webster

发明人： Kalpendu Shastri ,  Bipin Dama ,  Vipulkumar Patel ,  Mark Webster

IPC分类号： H04B10/12

CPC分类号： H04N7/22 ,  G09G5/006 ,  G09G2370/12 ,  G09G2370/18

摘要： An HDMI interconnect arrangement is presented that performs a pulse-amplitude modulation (PAM) conversion of the TMDS audio/video signals in order to simultaneously transmit all three channels over a single optical fiber. The set of three audio/video TMDS channels is applied as an input to a PAM-8 optical modulator, which functions to encode the set of three channels onto an optically-modulated output signal. The modulated optical signal is thereafter coupled into an optical fiber within an active HDMI cable and transmitted to an HDMI receiver (sink). The TMDS CLK signal is not included in this conversion into the optical domain, but remains as a separate electrical signal to be transmitted along a copper signal path within the active HDMI cable.

摘要翻译： 呈现HDMI互连布置，其执行TMDS音频/视频信号的脉冲幅度调制（PAM）转换，以便通过单根光纤同时传输所有三个通道。 三组音频/视频TMDS通道的组合被用作PAM-8光调制器的输入，PAM-8光调制器用于将三个通道的组合编码到光调制的输出信号上。 调制的光信号此后耦合到有源HDMI电缆中的光纤中，并被传输到HDMI接收器（接收器）。 TMDS CLK信号不包含在该转换到光学域中，而是作为单独的电信号保持在有源HDMI电缆内的铜信号路径上传输。

公开(公告)号：US20120280344A1

公开(公告)日：2012-11-08

申请号：US13463408

申请日：2012-05-03

申请人： Kalpendu Shastri ,  Vipulkumar Patel ,  Mark Webster ,  Prakash Gothoskar ,  Ravinder Kachru ,  Soham Pathak ,  Rao V. Yelamarty ,  Thomas Daugherty ,  Bipin Dama ,  Kaushik Patel ,  Kishor Desai

发明人： Kalpendu Shastri ,  Vipulkumar Patel ,  Mark Webster ,  Prakash Gothoskar ,  Ravinder Kachru ,  Soham Pathak ,  Rao V. Yelamarty ,  Thomas Daugherty ,  Bipin Dama ,  Kaushik Patel ,  Kishor Desai

IPC分类号： H01L31/12

CPC分类号： H01L25/50 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4257 ,  G02B6/426 ,  H01L25/167 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.

摘要翻译： 光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。 特别地，硅晶片被用作平台（插入器），用于多个收发器模块的所有部件安装或集成在该平台上，硅插入器的顶表面用作用于定义光信号的参考平面 分离的光学元件之间的路径。 实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。

公开(公告)号：US20120237160A1

公开(公告)日：2012-09-20

申请号：US13421833

申请日：2012-03-15

申请人： Kalpendu Shastri ,  Bipin Dama ,  Mark Webster ,  David Piede

发明人： Kalpendu Shastri ,  Bipin Dama ,  Mark Webster ,  David Piede

IPC分类号： G02B6/12

CPC分类号： H01P3/00 ,  G02F1/011 ,  G02F1/0121 ,  G02F1/0327 ,  G02F1/225 ,  G02F1/2255 ,  G02F2201/124 ,  G02F2201/126 ,  H05K1/0245 ,  H05K2201/09245 ,  H05K2201/09254 ,  H05K2201/10121

摘要： A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.

摘要翻译： 在常规电子集成电路（IC）和光电子组件之间布置电信号的配置被形成为在相邻路径上承载相反信号的信号路径阵列，以降低与IC和IC之间的连接相关联的电感 光电子组件。 信号路径阵列可以采取在IC和子组件之间的引线阵列的形式，形成在光电子组件上的导电迹线阵列，或两者。

公开(公告)号：US08724939B2

公开(公告)日：2014-05-13

申请号：US13421833

申请日：2012-03-15

申请人： Kalpendu Shastri ,  Bipin Dama ,  Mark Webster ,  David Piede

发明人： Kalpendu Shastri ,  Bipin Dama ,  Mark Webster ,  David Piede

IPC分类号： G02B6/12 ,  G02F1/01 ,  G02F1/035

CPC分类号： H01P3/00 ,  G02F1/011 ,  G02F1/0121 ,  G02F1/0327 ,  G02F1/225 ,  G02F1/2255 ,  G02F2201/124 ,  G02F2201/126 ,  H05K1/0245 ,  H05K2201/09245 ,  H05K2201/09254 ,  H05K2201/10121

摘要： A configuration for routing electrical signals between a conventional electronic integrated circuit (IC) and an opto-electronic subassembly is formed as an array of signal paths carrying oppositely-signed signals on adjacent paths to lower the inductance associated with the connection between the IC and the opto-electronic subassembly. The array of signal paths can take the form of an array of wirebonds between the IC and the subassembly, an array of conductive traces formed on the opto-electronic subassembly, or both.

摘要翻译： 在常规电子集成电路（IC）和光电子组件之间布置电信号的配置被形成为在相邻路径上承载相反信号的信号路径阵列，以降低与IC和IC之间的连接相关的电感 光电子组件。 信号路径阵列可以采取在IC和子组件之间的引线阵列的形式，形成在光电子组件上的导电迹线阵列，或两者。

公开(公告)号：US20100316391A1

公开(公告)日：2010-12-16

申请号：US12796868

申请日：2010-06-09

申请人： Kalpendu Shastri ,  Bipin Dama ,  Mark Webster

发明人： Kalpendu Shastri ,  Bipin Dama ,  Mark Webster

IPC分类号： H04B10/12

CPC分类号： H04B10/801 ,  H04B10/505 ,  H04B10/516 ,  H04B10/524 ,  H04L7/0008 ,  H04L7/0075

摘要： An optical interconnection arrangement for use in high data applications is presented that eliminates the need for extensive serialization/de-serialization (SERDES) functionality by utilizing pulse amplitude modulation (PAM) techniques to represent the data in the optical domain while utilizing a separate channel for transmitting an optical clock signal, eliminating the need for clock recovery circuitry on the receive end of the arrangement.

摘要翻译： 提出了一种用于高数据应用的光互连装置，通过利用脉冲幅度调制（PAM）技术来表示光域中的数据，消除了对广泛的串行/解序列化（SERDES）功能的需要，同时利用单独的信道 发送光时钟信号，消除了对该装置接收端的时钟恢复电路的需要。

公开(公告)号：US08364042B2

公开(公告)日：2013-01-29

申请号：US12796868

申请日：2010-06-09

申请人： Kalpendu Shastri ,  Bipin Dama ,  Mark Webster

发明人： Kalpendu Shastri ,  Bipin Dama ,  Mark Webster

IPC分类号： H04B10/00

CPC分类号： H04B10/801 ,  H04B10/505 ,  H04B10/516 ,  H04B10/524 ,  H04L7/0008 ,  H04L7/0075

摘要： An optical interconnection arrangement for use in high data applications is presented that eliminates the need for extensive serialization/de-serialization (SERDES) functionality by utilizing pulse amplitude modulation (PAM) techniques to represent the data in the optical domain while utilizing a separate channel for transmitting an optical clock signal, eliminating the need for clock recovery circuitry on the receive end of the arrangement.

摘要翻译： 提出了一种用于高数据应用的光互连装置，通过利用脉冲幅度调制（PAM）技术来表示光域中的数据，消除了对广泛的串行/解序列化（SERDES）功能的需要，同时利用单独的信道 发送光时钟信号，消除了对该装置接收端的时钟恢复电路的需要。

公开(公告)号：US07447395B2

公开(公告)日：2008-11-04

申请号：US11810591

申请日：2007-06-06

申请人： Robert Keith Montgomery ,  Margaret Ghiron ,  Prakash Gothoskar ,  Paulius Mindaugas Mosinskis ,  Vipulkumar Patel ,  Kalpendu Shastri ,  Mark Webster

发明人： Robert Keith Montgomery ,  Margaret Ghiron ,  Prakash Gothoskar ,  Paulius Mindaugas Mosinskis ,  Vipulkumar Patel ,  Kalpendu Shastri ,  Mark Webster

IPC分类号： G02B6/12 ,  G02F1/295

CPC分类号： G02F1/025 ,  G02F1/0147 ,  G02F1/225 ,  G02F2201/126

摘要： A silicon-based optical modulator structure includes one or more separate localized heating elements for changing the refractive index of an associated portion of the structure and thereby providing corrective adjustments to address unwanted variations in device performance. Heating is provided by thermo-optic devices such as, for example, silicon-based resistors, silicide resistors, forward-biased PN junctions, and the like, where any of these structures may easily be incorporated with a silicon-based optical modulator. The application of a DC voltage to any of these structures will generate heat, which then transfers into the waveguiding area. The increase in local temperature of the waveguiding area will, in turn, increase the refractive index of the waveguiding in the area. Control of the applied DC voltage results in controlling the refractive index.

摘要翻译： 基于硅的光学调制器结构包括一个或多个单独的局部加热元件，用于改变结构的相关部分的折射率，从而提供校正调整以解决器件性能的不期望的变化。 加热由诸如硅基电阻器，硅化物电阻器，正向偏置PN结等的热光器件提供，其中这些结构中的任何一种可以容易地与硅基光学调制器结合。 对这些结构中的任何一个施加直流电压将产生热量，然后传递到波导区域。 波导区域的局部温度的增加又将增加该区域中波导的折射率。 施加的直流电压的控制导致控制折射率。

公开(公告)号：US20070292075A1

公开(公告)日：2007-12-20

申请号：US11810591

申请日：2007-06-06

申请人： Robert Keith Montgomery ,  Margaret Ghiron ,  Prakash Gothoskar ,  Paulius Mindaugas Mosinskis ,  Vipulkumar Patel ,  Kalpendu Shastri ,  Mark Webster

发明人： Robert Keith Montgomery ,  Margaret Ghiron ,  Prakash Gothoskar ,  Paulius Mindaugas Mosinskis ,  Vipulkumar Patel ,  Kalpendu Shastri ,  Mark Webster

IPC分类号： G02B6/12

CPC分类号： G02F1/025 ,  G02F1/0147 ,  G02F1/225 ,  G02F2201/126

摘要： A silicon-based optical modulator structure includes one or more separate localized heating elements for changing the refractive index of an associated portion of the structure and thereby providing corrective adjustments to address unwanted variations in device performance. Heating is provided by thermo-optic devices such as, for example, silicon-based resistors, silicide resistors, forward-biased PN junctions, and the like, where any of these structures may easily be incorporated with a silicon-based optical modulator. The application of a DC voltage to any of these structures will generate heat, which then transfers into the waveguiding area. The increase in local temperature of the waveguiding area will, in turn, increase the refractive index of the waveguiding in the area. Control of the applied DC voltage results in controlling the refractive index

摘要翻译： 基于硅的光学调制器结构包括一个或多个单独的局部加热元件，用于改变结构的相关部分的折射率，从而提供校正调整以解决器件性能的不期望的变化。 加热由诸如硅基电阻器，硅化物电阻器，正向偏置PN结等的热光器件提供，其中这些结构中的任何一种可以容易地与硅基光学调制器结合。 对这些结构中的任何一个施加直流电压将产生热量，然后传递到波导区域。 波导区域的局部温度的增加又将增加该区域中波导的折射率。 施加的直流电压的控制导致控制折射率