公开(公告)号：US08803269B2

公开(公告)日：2014-08-12

申请号：US13463408

申请日：2012-05-03

申请人： Kalpendu Shastri ,  Vipulkumar Patel ,  Mark Webster ,  Prakash Gothoskar ,  Ravinder Kachru ,  Soham Pathak ,  Rao V. Yelamarty ,  Thomas Daugherty ,  Bipin Dama ,  Kaushik Patel ,  Kishor Desai

发明人： Kalpendu Shastri ,  Vipulkumar Patel ,  Mark Webster ,  Prakash Gothoskar ,  Ravinder Kachru ,  Soham Pathak ,  Rao V. Yelamarty ,  Thomas Daugherty ,  Bipin Dama ,  Kaushik Patel ,  Kishor Desai

IPC分类号： H01L31/0232 ,  H01L29/40 ,  H01L23/053 ,  H01L23/12

CPC分类号： H01L25/50 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4257 ,  G02B6/426 ,  H01L25/167 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.

摘要翻译： 光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。 特别地，硅晶片被用作“平台”（插入器），在其上安装或集成多个收发器模块的所有组件，硅插入器的顶表面用作参考平面，用于定义 分离光学元件之间的光信号路径。 实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。

公开(公告)号：US20120280344A1

公开(公告)日：2012-11-08

申请号：US13463408

申请日：2012-05-03

申请人： Kalpendu Shastri ,  Vipulkumar Patel ,  Mark Webster ,  Prakash Gothoskar ,  Ravinder Kachru ,  Soham Pathak ,  Rao V. Yelamarty ,  Thomas Daugherty ,  Bipin Dama ,  Kaushik Patel ,  Kishor Desai

发明人： Kalpendu Shastri ,  Vipulkumar Patel ,  Mark Webster ,  Prakash Gothoskar ,  Ravinder Kachru ,  Soham Pathak ,  Rao V. Yelamarty ,  Thomas Daugherty ,  Bipin Dama ,  Kaushik Patel ,  Kishor Desai

IPC分类号： H01L31/12

CPC分类号： H01L25/50 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4257 ,  G02B6/426 ,  H01L25/167 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.

摘要翻译： 光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。 特别地，硅晶片被用作平台（插入器），用于多个收发器模块的所有部件安装或集成在该平台上，硅插入器的顶表面用作用于定义光信号的参考平面 分离的光学元件之间的路径。 实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。

公开(公告)号：US20130202255A1

公开(公告)日：2013-08-08

申请号：US13755843

申请日：2013-01-31

申请人： Chris Kiyoshi Togami ,  Soham Pathak ,  Kalpendu Shastri ,  Kishor Desai ,  Ravinder Kachru ,  Bipin Dama ,  Vipulkumar Patel

发明人： Chris Kiyoshi Togami ,  Soham Pathak ,  Kalpendu Shastri ,  Kishor Desai ,  Ravinder Kachru ,  Bipin Dama ,  Vipulkumar Patel

IPC分类号： G02B6/42 ,  G02B6/43

CPC分类号： G02B6/421 ,  G02B6/3885 ,  G02B6/4204 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4292 ,  G02B6/43

摘要： An apparatus for providing single mode optical signal coupling between an opto-electronic transceiver and a single mode optical fiber array takes the form of a lens array and a ferrule component. The lens array includes a plurality of separate lens element disposed to intercept a like plurality of single mode optical output signal from the opto-electronic transceiver and provide as an output a focused version thereof. The ferrule component includes a plurality of single mode fiber stubs that are passively aligned with the lens array and support the transmission of the focused, single mode optical output signals towards the associated single mode optical fiber array.

摘要翻译： 用于在光电收发器和单模光纤阵列之间提供单模光信号耦合的装置采用透镜阵列和套圈部件的形式。 透镜阵列包括多个单独的透镜元件，其设置成截取来自光电收发器的类似多个单模光输出信号，并提供其聚焦版本的输出。 套圈组件包括与透镜阵列无源对准的多个单模光纤短截线，并支持将聚焦的单模光输出信号传输到相关联的单模光纤阵列。

公开(公告)号：US20130188970A1

公开(公告)日：2013-07-25

申请号：US13745773

申请日：2013-01-19

申请人： Kalpendu Shastri ,  Vipulkumar Patel ,  Soham Pathak ,  Utpal Chakrabarti ,  Bipin Dama ,  Ravinder Kachru ,  Kishor Desai

发明人： Kalpendu Shastri ,  Vipulkumar Patel ,  Soham Pathak ,  Utpal Chakrabarti ,  Bipin Dama ,  Ravinder Kachru ,  Kishor Desai

IPC分类号： H04B10/12

CPC分类号： H04B10/501 ,  G02B6/3512 ,  G02B6/3692 ,  G02B6/4214 ,  G02B6/4256 ,  G02B6/4292 ,  Y10T29/49002

摘要： An apparatus for transmitting optical signals includes an interposer for supporting opto-electronic components used to create optical output signals. An enclosure is used to encapsulate the populated interposer assembly and includes a silicon sidewall and a transparent lid. The sidewall is etched to include a turning mirror feature with a reflecting surface at a predetermined angle θ, the turning mirror disposed to intercept the optical output signals and re-direct them through the enclosure's transparent lid. A coverplate is disposed over and aligned with the enclosure, where the coverplate includes a silicon sidewall member that is etched to include a turning mirror element with a reflecting surface at the same angle θ as the enclosure's turning mirror element. The optical signals re-directed by the enclosure then pass through the transparent lid of the enclosure, impinge the turning mirror element of the coverplate, and are then re-directed along the longitudinal axis.

摘要翻译： 用于发送光信号的装置包括用于支持用于产生光输出信号的光电组件的插入器。 外壳用于封装填充的插入器组件，并且包括硅侧壁和透明盖。 侧壁被蚀刻以包括具有预定角度θ的反射表面的转向镜特征，转向镜被设置成拦截光学输出信号并将其重新引导通过外壳的透明盖。 盖板设置在外壳上并与壳体对准，其中盖板包括硅侧壁构件，其被蚀刻以包括具有与外壳的转向镜元件相同角度θ的反射表面的转向镜元件。 由外壳重新引导的光学信号然后穿过外壳的透明盖，撞击盖板的转向镜元件，然后沿着纵向轴线重新定向。

公开(公告)号：US20130183008A1

公开(公告)日：2013-07-18

申请号：US13737080

申请日：2013-01-09

申请人： Kalpendu Shastri ,  Soham Pathak ,  Utpal Chakrabarti ,  Vipulkumar Patel ,  Bipin Dama ,  Ravinder Kachru ,  Kishor Desai

发明人： Kalpendu Shastri ,  Soham Pathak ,  Utpal Chakrabarti ,  Vipulkumar Patel ,  Bipin Dama ,  Ravinder Kachru ,  Kishor Desai

IPC分类号： G02B6/42

CPC分类号： G02B6/4292 ,  B82Y20/00 ,  C03C15/00 ,  G02B6/136 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4259 ,  Y10T29/4978

摘要： An apparatus for providing self-aligned optical coupling between an opto-electronic substrate and a fiber array, where the substrate is enclosed by a transparent lid such that the associated optical signals enter and exit the arrangement through the transparent lid. The apparatus takes the form of a two-part connectorized fiber array assembly where the two pieces uniquely mate to form a self-aligned configuration. A first part, in the form of a plate, is attached to the transparent lid in the area where the optical signals pass through. The first plate includes a central opening with inwardly-tapering sidewalls surrounding its periphery. A second plate is also formed to include a central opening and has a lower protrusion with inwardly-tapering sidewalls that mate with the inwardly-tapering sidewalls of the first plate to form the self-aligned connectorized fiber array assembly. The fiber array is then attached to the second plate in a self-aligned fashion.

摘要翻译： 一种用于在光电子基板和光纤阵列之间提供自对准光耦合的装置，其中基板由透明盖包围，使得相关联的光信号通过透明盖进入和离开布置。 该装置采取两部分连接的光纤阵列组件的形式，其中两个部件独特地配合以形成自对准配置。 在光信号通过的区域中，透明盖附着有板的形式的第一部分。 第一板包括具有围绕其周边的向内逐渐变细的侧壁的中心开口。 第二板也形成为包括中心开口并且具有下突起，其具有向内渐缩的侧壁，与第一板的向内渐缩的侧壁配合形成自对准的连接纤维阵列组件。 然后将纤维阵列以自对准的方式附接到第二板。

公开(公告)号：US20130101250A1

公开(公告)日：2013-04-25

申请号：US13656528

申请日：2012-10-19

申请人： Kishor Desai ,  Ravinder Kachru ,  Vipulkumar Patel ,  Bipin Dama ,  Kalpendu Shastri ,  Soham Pathak

发明人： Kishor Desai ,  Ravinder Kachru ,  Vipulkumar Patel ,  Bipin Dama ,  Kalpendu Shastri ,  Soham Pathak

IPC分类号： G02B6/12 ,  H01L33/52

CPC分类号： G02B6/4255 ,  G02B6/12 ,  G02B6/13 ,  G02B6/4201 ,  G02B6/4257 ,  G02B6/4292 ,  G02B6/43 ,  H01L21/50 ,  H01L23/04 ,  H01L23/48 ,  H01L25/167 ,  H01L31/0203 ,  H01L33/52 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/165 ,  H01L2924/16788 ,  H05K1/0268 ,  H05K1/0274 ,  H05K2201/10121 ,  H01L2924/0105 ,  H01L2924/01079

摘要： An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.

摘要翻译： 提供了一种光电子组件，其包括用于支撑多个互连的光学和电气部件的基板（通常为硅或玻璃）。 设置一层密封材料以概述衬底的限定的周边区域。 将模制的玻璃盖设置在基底上并结合到基底上，其中模制的玻璃盖构造成产生与限定的基底周边区域匹配的覆盖区。 模制玻璃盖的底表面包括一层接合材料，其在接触时接触基底的密封材料层，形成结合组件。 在一种形式中，提出了一种晶片级组装工艺，其中多个光电组件设置在硅晶片上，并且多个玻璃盖被模制在一片玻璃中，然后将其粘合到硅晶片上。

公开(公告)号：US20130182996A1

公开(公告)日：2013-07-18

申请号：US13737029

申请日：2013-01-09

申请人： Kalpendu Shastri ,  Soham Pathak ,  John Fangman ,  Vipulkumar Patel ,  Kishor Desai ,  Ravinder Kachru

发明人： Kalpendu Shastri ,  Soham Pathak ,  John Fangman ,  Vipulkumar Patel ,  Kishor Desai ,  Ravinder Kachru

IPC分类号： G02B6/42 ,  G02B6/12

CPC分类号： G02B6/42 ,  G02B6/12 ,  G02B6/3886 ,  G02B6/4214 ,  G02B6/4259 ,  G02B6/4292 ,  Y10T29/49155

摘要： An apparatus for providing releasable attachment between a fiber connector and an opto-electronic assembly, the opto-electronic assembly utilizing an interposer substrate to support a plurality of opto-electronic components that generates optical output signals and receives optical input signals. An enclosure is used to cover the interposer substrate and includes a transparent region through which the optical output and input signals pass unimpeded. A magnetic connector component is attached to the lid and positioned to surround the transparent region, with a fiber connector for supporting one or more optical fibers magnetically attached to the connector component by virtue of a metallic component contained in the fiber connector. This arrangement provides releasable attachment of the fiber connector to the enclosure in a manner where the optical output and input signals align with the optical fibers in the connector.

摘要翻译： 一种用于在光纤连接器和光电子组件之间提供可释放附件的装置，所述光电组件利用插入器基板来支撑产生光输出信号并接收光输入信号的多个光电元件。 外壳用于覆盖插入器基板，并且包括透明区域，光输出和输入信号通过该透明区域畅通无阻。 磁性连接器部件附接到盖子并且被定位成围绕透明区域，光纤连接器用于通过光纤连接器中包含的金属部件来支撑一个或多个磁性地附接到连接器部件的光纤。 这种布置以光输出和输入信号与连接器中的光纤对准的方式提供光纤连接器到外壳的可释放附接。

公开(公告)号：US20130183010A1

公开(公告)日：2013-07-18

申请号：US13742483

申请日：2013-01-16

申请人： John Fangman ,  Vipulkumar Patel ,  Ravinder Kachru

发明人： John Fangman ,  Vipulkumar Patel ,  Ravinder Kachru

IPC分类号： G02B6/36 ,  B32B37/12 ,  G02B6/32

CPC分类号： G02B6/36 ,  B32B37/1292 ,  G02B6/32 ,  G02B6/4204 ,  G02B6/4214 ,  G02B6/4239 ,  G02B6/4244 ,  G02B6/4246

摘要： An opto-electronic apparatus comprises a substrate for supporting a plurality of components forming an opto-electronic assembly and an optical component attached to the substrate with an adhesive material, such as a solder or epoxy. The optical component is formed to include a plurality of bond slots disposed in parallel across at least a portion of the bottom surface of the optical component, the plurality of bond slots providing a path for a liquid adhesive material and improving the ability to displace the liquid adhesive material as the component is pressed into the surface of the substrate during the attachment process.

摘要翻译： 光电设备包括用于支撑形成光电组件的多个部件的基板和用粘合剂材料（例如焊料或环氧树脂）附接到基板的光学部件。 光学部件被形成为包括平行地布置在光学部件的底表面的至少一部分上的多个接合槽，多个接合槽提供用于液体粘合剂材料的路径并且提高了使液体移位的能力 作为组分的粘合剂材料在附着过程中被压入基材的表面。

公开(公告)号：US5204770A

公开(公告)日：1993-04-20

申请号：US721459

申请日：1991-07-05

申请人： Ravinder Kachru ,  Emily Y. Xu ,  Stefan Kroll ,  David L. Huestis ,  Myung-Keun Kim

发明人： Ravinder Kachru ,  Emily Y. Xu ,  Stefan Kroll ,  David L. Huestis ,  Myung-Keun Kim

IPC分类号： G02F1/35 ,  G02F2/02 ,  G02F3/00 ,  G06E3/00 ,  G06K9/74

CPC分类号： G06K9/74 ,  G02F2/02 ,  G06E3/003

摘要： An image processing apparatus having a third-order nonlinear stimulated photon echo medium (1). The photon echo medium (1) can store large numbers of images in the form of a Fourier transformed pattern by spectral modulation. The spectral modulation is carried out by sending optical pulses in an optical pulse train having (or not having) image information to the medium (1) so that the population in the ground and excited states are modulated after the passage of the pulse trains and pulses. The Fourier transformed pattern is converted back to temporal modulation, consisting of a sequence of echo pulses that reproduce the original data pulse train. By using the apparatus, ultrafast operation such as convolution and correlation between a number of reference images and a test image can be achieved.

摘要翻译： PCT No.PCT / US90 / 01345 Sec。 371日期1991年7月5日 102（e）日期1991年7月5日PCT 1990年3月15日提交。一种具有三阶非线性受激光子回波介质（1）的图像处理装置。 光子回波介质（1）可以通过光谱调制以傅里叶变换图案的形式存储大量的图像。 通过在具有（或不具有）图像信息的光脉冲串中向介质（1）发送光脉冲来执行频谱调制，使得在脉冲串和脉冲通过之后调制地面和激发态的群体 。 傅里叶变换图案被转换回到时间调制，其由再现原始数据脉冲串的回波脉冲序列组成。 通过使用该装置，可以实现诸如卷积的超快速操作和多个参考图像与测试图像之间的相关性。

公开(公告)号：US5978108A

公开(公告)日：1999-11-02

申请号：US922035

申请日：1997-09-02

申请人： Yu Sheng Bai ,  Ravinder Kachru

发明人： Yu Sheng Bai ,  Ravinder Kachru

IPC分类号： G11B7/0065 ,  G03H1/02 ,  G03H1/04 ,  G11C13/04

CPC分类号： G11B7/0065 ,  G03H1/265 ,  G03H2001/026 ,  G03H2001/0268 ,  G03H2001/266

摘要： Ferroelectric materials are disclosed as reversible holographic recording media (25) for use in two-photon recording systems. The ferroelectric materials disclosed herein provide long-lived electronic states intermediate the ferroelectric material's valence and conduction bands. These intermediate states have a sufficiently long life (on the order of 1 to 100 milliseconds) that low-power continuous wave ("cw") lasers (1) can be used to record interference patterns on them. Thus, two-photon holographic recording systems are also disclosed which do not require high-power, short pulse length, mode-locked or Q-switched lasers. The disclosed two-photon holographic recording systems provide for absorption of a first photon which excites electrons of holographic recording media to an intermediate state. Thereafter, upon absorption of a second photon, the electrons are promoted to the media's conduction band where they are arranged according to the interference pattern provided by the recording system. Importantly, the disclosed holographic recording systems employ visible and near IR cw lasers such as diode lasers.

摘要翻译： 铁电材料被公开为用于双光子记录系统的可逆全息记录介质（25）。 本文公开的铁电材料提供了在铁电材料的价带和导带之间的长寿命的电子态。 这些中间状态具有足够长的使用寿命（大约1到100毫秒），可以使用低功率连续波（“cw”）激光器（1）来记录干涉图案。 因此，还公开了不需要大功率，短脉冲长度，锁模或Q开关激光器的双光子全息记录系统。 所公开的双光子全息记录系统提供了将全息记录介质的电子激发到中间状态的第一光子的吸收。 此后，在吸收第二光子时，电子被提升到介质的导带，在它们的导带中，它们根据由记录系统提供的干涉图案排列。 重要的是，所公开的全息记录系统采用诸如二极管激光器之类的可见光和近红外激光器。