公开(公告)号：US20130188970A1

公开(公告)日：2013-07-25

申请号：US13745773

申请日：2013-01-19

申请人： Kalpendu Shastri ,  Vipulkumar Patel ,  Soham Pathak ,  Utpal Chakrabarti ,  Bipin Dama ,  Ravinder Kachru ,  Kishor Desai

发明人： Kalpendu Shastri ,  Vipulkumar Patel ,  Soham Pathak ,  Utpal Chakrabarti ,  Bipin Dama ,  Ravinder Kachru ,  Kishor Desai

IPC分类号： H04B10/12

CPC分类号： H04B10/501 ,  G02B6/3512 ,  G02B6/3692 ,  G02B6/4214 ,  G02B6/4256 ,  G02B6/4292 ,  Y10T29/49002

摘要： An apparatus for transmitting optical signals includes an interposer for supporting opto-electronic components used to create optical output signals. An enclosure is used to encapsulate the populated interposer assembly and includes a silicon sidewall and a transparent lid. The sidewall is etched to include a turning mirror feature with a reflecting surface at a predetermined angle θ, the turning mirror disposed to intercept the optical output signals and re-direct them through the enclosure's transparent lid. A coverplate is disposed over and aligned with the enclosure, where the coverplate includes a silicon sidewall member that is etched to include a turning mirror element with a reflecting surface at the same angle θ as the enclosure's turning mirror element. The optical signals re-directed by the enclosure then pass through the transparent lid of the enclosure, impinge the turning mirror element of the coverplate, and are then re-directed along the longitudinal axis.

摘要翻译： 用于发送光信号的装置包括用于支持用于产生光输出信号的光电组件的插入器。 外壳用于封装填充的插入器组件，并且包括硅侧壁和透明盖。 侧壁被蚀刻以包括具有预定角度θ的反射表面的转向镜特征，转向镜被设置成拦截光学输出信号并将其重新引导通过外壳的透明盖。 盖板设置在外壳上并与壳体对准，其中盖板包括硅侧壁构件，其被蚀刻以包括具有与外壳的转向镜元件相同角度θ的反射表面的转向镜元件。 由外壳重新引导的光学信号然后穿过外壳的透明盖，撞击盖板的转向镜元件，然后沿着纵向轴线重新定向。

公开(公告)号：US20130183008A1

公开(公告)日：2013-07-18

申请号：US13737080

申请日：2013-01-09

申请人： Kalpendu Shastri ,  Soham Pathak ,  Utpal Chakrabarti ,  Vipulkumar Patel ,  Bipin Dama ,  Ravinder Kachru ,  Kishor Desai

发明人： Kalpendu Shastri ,  Soham Pathak ,  Utpal Chakrabarti ,  Vipulkumar Patel ,  Bipin Dama ,  Ravinder Kachru ,  Kishor Desai

IPC分类号： G02B6/42

CPC分类号： G02B6/4292 ,  B82Y20/00 ,  C03C15/00 ,  G02B6/136 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4259 ,  Y10T29/4978

摘要： An apparatus for providing self-aligned optical coupling between an opto-electronic substrate and a fiber array, where the substrate is enclosed by a transparent lid such that the associated optical signals enter and exit the arrangement through the transparent lid. The apparatus takes the form of a two-part connectorized fiber array assembly where the two pieces uniquely mate to form a self-aligned configuration. A first part, in the form of a plate, is attached to the transparent lid in the area where the optical signals pass through. The first plate includes a central opening with inwardly-tapering sidewalls surrounding its periphery. A second plate is also formed to include a central opening and has a lower protrusion with inwardly-tapering sidewalls that mate with the inwardly-tapering sidewalls of the first plate to form the self-aligned connectorized fiber array assembly. The fiber array is then attached to the second plate in a self-aligned fashion.

摘要翻译： 一种用于在光电子基板和光纤阵列之间提供自对准光耦合的装置，其中基板由透明盖包围，使得相关联的光信号通过透明盖进入和离开布置。 该装置采取两部分连接的光纤阵列组件的形式，其中两个部件独特地配合以形成自对准配置。 在光信号通过的区域中，透明盖附着有板的形式的第一部分。 第一板包括具有围绕其周边的向内逐渐变细的侧壁的中心开口。 第二板也形成为包括中心开口并且具有下突起，其具有向内渐缩的侧壁，与第一板的向内渐缩的侧壁配合形成自对准的连接纤维阵列组件。 然后将纤维阵列以自对准的方式附接到第二板。

公开(公告)号：US08803269B2

公开(公告)日：2014-08-12

申请号：US13463408

申请日：2012-05-03

申请人： Kalpendu Shastri ,  Vipulkumar Patel ,  Mark Webster ,  Prakash Gothoskar ,  Ravinder Kachru ,  Soham Pathak ,  Rao V. Yelamarty ,  Thomas Daugherty ,  Bipin Dama ,  Kaushik Patel ,  Kishor Desai

发明人： Kalpendu Shastri ,  Vipulkumar Patel ,  Mark Webster ,  Prakash Gothoskar ,  Ravinder Kachru ,  Soham Pathak ,  Rao V. Yelamarty ,  Thomas Daugherty ,  Bipin Dama ,  Kaushik Patel ,  Kishor Desai

IPC分类号： H01L31/0232 ,  H01L29/40 ,  H01L23/053 ,  H01L23/12

CPC分类号： H01L25/50 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4257 ,  G02B6/426 ,  H01L25/167 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.

摘要翻译： 光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。 特别地，硅晶片被用作“平台”（插入器），在其上安装或集成多个收发器模块的所有组件，硅插入器的顶表面用作参考平面，用于定义 分离光学元件之间的光信号路径。 实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。

公开(公告)号：US20130101250A1

公开(公告)日：2013-04-25

申请号：US13656528

申请日：2012-10-19

申请人： Kishor Desai ,  Ravinder Kachru ,  Vipulkumar Patel ,  Bipin Dama ,  Kalpendu Shastri ,  Soham Pathak

发明人： Kishor Desai ,  Ravinder Kachru ,  Vipulkumar Patel ,  Bipin Dama ,  Kalpendu Shastri ,  Soham Pathak

IPC分类号： G02B6/12 ,  H01L33/52

CPC分类号： G02B6/4255 ,  G02B6/12 ,  G02B6/13 ,  G02B6/4201 ,  G02B6/4257 ,  G02B6/4292 ,  G02B6/43 ,  H01L21/50 ,  H01L23/04 ,  H01L23/48 ,  H01L25/167 ,  H01L31/0203 ,  H01L33/52 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/165 ,  H01L2924/16788 ,  H05K1/0268 ,  H05K1/0274 ,  H05K2201/10121 ,  H01L2924/0105 ,  H01L2924/01079

摘要： An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.

摘要翻译： 提供了一种光电子组件，其包括用于支撑多个互连的光学和电气部件的基板（通常为硅或玻璃）。 设置一层密封材料以概述衬底的限定的周边区域。 将模制的玻璃盖设置在基底上并结合到基底上，其中模制的玻璃盖构造成产生与限定的基底周边区域匹配的覆盖区。 模制玻璃盖的底表面包括一层接合材料，其在接触时接触基底的密封材料层，形成结合组件。 在一种形式中，提出了一种晶片级组装工艺，其中多个光电组件设置在硅晶片上，并且多个玻璃盖被模制在一片玻璃中，然后将其粘合到硅晶片上。

公开(公告)号：US20120280344A1

公开(公告)日：2012-11-08

申请号：US13463408

申请日：2012-05-03

申请人： Kalpendu Shastri ,  Vipulkumar Patel ,  Mark Webster ,  Prakash Gothoskar ,  Ravinder Kachru ,  Soham Pathak ,  Rao V. Yelamarty ,  Thomas Daugherty ,  Bipin Dama ,  Kaushik Patel ,  Kishor Desai

发明人： Kalpendu Shastri ,  Vipulkumar Patel ,  Mark Webster ,  Prakash Gothoskar ,  Ravinder Kachru ,  Soham Pathak ,  Rao V. Yelamarty ,  Thomas Daugherty ,  Bipin Dama ,  Kaushik Patel ,  Kishor Desai

IPC分类号： H01L31/12

CPC分类号： H01L25/50 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4257 ,  G02B6/426 ,  H01L25/167 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.

摘要翻译： 光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。 特别地，硅晶片被用作平台（插入器），用于多个收发器模块的所有部件安装或集成在该平台上，硅插入器的顶表面用作用于定义光信号的参考平面 分离的光学元件之间的路径。 实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。

公开(公告)号：US20130202255A1

公开(公告)日：2013-08-08

申请号：US13755843

申请日：2013-01-31

申请人： Chris Kiyoshi Togami ,  Soham Pathak ,  Kalpendu Shastri ,  Kishor Desai ,  Ravinder Kachru ,  Bipin Dama ,  Vipulkumar Patel

发明人： Chris Kiyoshi Togami ,  Soham Pathak ,  Kalpendu Shastri ,  Kishor Desai ,  Ravinder Kachru ,  Bipin Dama ,  Vipulkumar Patel

IPC分类号： G02B6/42 ,  G02B6/43

CPC分类号： G02B6/421 ,  G02B6/3885 ,  G02B6/4204 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4292 ,  G02B6/43

摘要： An apparatus for providing single mode optical signal coupling between an opto-electronic transceiver and a single mode optical fiber array takes the form of a lens array and a ferrule component. The lens array includes a plurality of separate lens element disposed to intercept a like plurality of single mode optical output signal from the opto-electronic transceiver and provide as an output a focused version thereof. The ferrule component includes a plurality of single mode fiber stubs that are passively aligned with the lens array and support the transmission of the focused, single mode optical output signals towards the associated single mode optical fiber array.

摘要翻译： 用于在光电收发器和单模光纤阵列之间提供单模光信号耦合的装置采用透镜阵列和套圈部件的形式。 透镜阵列包括多个单独的透镜元件，其设置成截取来自光电收发器的类似多个单模光输出信号，并提供其聚焦版本的输出。 套圈组件包括与透镜阵列无源对准的多个单模光纤短截线，并支持将聚焦的单模光输出信号传输到相关联的单模光纤阵列。

公开(公告)号：US20130182996A1

公开(公告)日：2013-07-18

申请号：US13737029

申请日：2013-01-09

申请人： Kalpendu Shastri ,  Soham Pathak ,  John Fangman ,  Vipulkumar Patel ,  Kishor Desai ,  Ravinder Kachru

发明人： Kalpendu Shastri ,  Soham Pathak ,  John Fangman ,  Vipulkumar Patel ,  Kishor Desai ,  Ravinder Kachru

IPC分类号： G02B6/42 ,  G02B6/12

CPC分类号： G02B6/42 ,  G02B6/12 ,  G02B6/3886 ,  G02B6/4214 ,  G02B6/4259 ,  G02B6/4292 ,  Y10T29/49155

摘要： An apparatus for providing releasable attachment between a fiber connector and an opto-electronic assembly, the opto-electronic assembly utilizing an interposer substrate to support a plurality of opto-electronic components that generates optical output signals and receives optical input signals. An enclosure is used to cover the interposer substrate and includes a transparent region through which the optical output and input signals pass unimpeded. A magnetic connector component is attached to the lid and positioned to surround the transparent region, with a fiber connector for supporting one or more optical fibers magnetically attached to the connector component by virtue of a metallic component contained in the fiber connector. This arrangement provides releasable attachment of the fiber connector to the enclosure in a manner where the optical output and input signals align with the optical fibers in the connector.

摘要翻译： 一种用于在光纤连接器和光电子组件之间提供可释放附件的装置，所述光电组件利用插入器基板来支撑产生光输出信号并接收光输入信号的多个光电元件。 外壳用于覆盖插入器基板，并且包括透明区域，光输出和输入信号通过该透明区域畅通无阻。 磁性连接器部件附接到盖子并且被定位成围绕透明区域，光纤连接器用于通过光纤连接器中包含的金属部件来支撑一个或多个磁性地附接到连接器部件的光纤。 这种布置以光输出和输入信号与连接器中的光纤对准的方式提供光纤连接器到外壳的可释放附接。

公开(公告)号：US07003196B2

公开(公告)日：2006-02-21

申请号：US10935145

申请日：2004-09-07

申请人： Margaret Ghiron ,  Prakash Gothoskar ,  Robert Keith Montgomery ,  Vipulkumar Patel ,  Soham Pathak ,  Kalpendu Shastri ,  Katherine A. Yanushefski

发明人： Margaret Ghiron ,  Prakash Gothoskar ,  Robert Keith Montgomery ,  Vipulkumar Patel ,  Soham Pathak ,  Kalpendu Shastri ,  Katherine A. Yanushefski

IPC分类号： G02B6/34

CPC分类号： G02B6/12007 ,  G02B6/122 ,  G02B6/29311 ,  G02B6/34

摘要： A coupling arrangement for allowing multiple wavelengths to be coupled into and out of a relatively thin silicon optical waveguide layer utilizes a diffractive optical element, in the form of a volume phase grating, in combination with a prism coupling structure. The diffractive optical element is formed to comprise a predetermined modulation index sufficient to diffract the various wavelengths through angles associated with improving the coupling efficiency of each wavelength into the silicon waveguide. The diffractive optical element may be formed as a separate element, or formed as an integral part of the coupling facet of the prism coupler.

摘要翻译： 用于允许多个波长耦合到相对薄的硅光波导层中的耦合布置利用体积相位光栅的形式的衍射光学元件与棱镜耦合结构组合。 衍射光学元件被形成为包括足以将各种波长衍射成与提高每个波长到硅波导的耦合效率相关联的角度的预定调制指数。 衍射光学元件可以形成为单独的元件，或者形成为棱镜耦合器的耦合面的整体部分。

公开(公告)号：US20050194990A1

公开(公告)日：2005-09-08

申请号：US11075430

申请日：2005-03-08

申请人： Prakash Gothoskar ,  Margaret Ghiron ,  Robert Montgomery ,  Vipulkumar Patel ,  Kalpendu Shastri ,  Soham Pathak ,  David Piede ,  Katherine Yanushefski

发明人： Prakash Gothoskar ,  Margaret Ghiron ,  Robert Montgomery ,  Vipulkumar Patel ,  Kalpendu Shastri ,  Soham Pathak ,  David Piede ,  Katherine Yanushefski

IPC分类号： G01R31/26

CPC分类号： G02B6/30 ,  G02B6/34 ,  G02B2006/12107

摘要： A wafer-level testing arrangement for opto-electronic devices formed in a silicon-on-insulator (SOI) wafer structure utilizes a single opto-electronic testing element to perform both optical and electrical testing. Beam steering optics may be formed on the testing element and used to facilitate the coupling between optical probe signals and optical coupling elements (e.g., prism couplers, gratings) formed on the top surface of the SOI structure. The optical test signals are thereafter directed into optical waveguides formed in the top layer of the SOI structure. The opto-electronic testing element also comprises a plurality of electrical test pins that are positioned to contact a plurality of bondpad test sites on the opto-electronic device and perform electrical testing operations. The optical test signal results may be converted into electrical representations within the SOI structure and thus returned to the testing element as electrical signals.

摘要翻译： 用于在绝缘体上硅（SOI）晶片结构中形成的光电器件的晶片级测试装置利用单个光电测试元件执行光学和电学测试。 光束转向光学元件可以形成在测试元件上，并且用于促进光学探针信号与形成在SOI结构的顶表面上的光耦合元件（例如，棱镜耦合器，光栅）之间的耦合。 此后，光学测试信号被引导到形成在SOI结构的顶层中的光波导中。 光电测试元件还包括多个电测试引脚，其被定位成接触光电器件上的多个接合焊盘测试点并执行电测试操作。 光学测试信号结果可以转换为SOI结构内的电气表示，并因此作为电信号返回到测试元件。

公开(公告)号：US20050189591A1

公开(公告)日：2005-09-01

申请号：US11069852

申请日：2005-02-28

申请人： Prakash Gothoskar ,  Margaret Ghiron ,  Robert Montgomery ,  Vipulkumar Patel ,  Kalpendu Shastri ,  Soham Pathak ,  Katherine Yanushefski

发明人： Prakash Gothoskar ,  Margaret Ghiron ,  Robert Montgomery ,  Vipulkumar Patel ,  Kalpendu Shastri ,  Soham Pathak ,  Katherine Yanushefski

IPC分类号： G02B6/12 ,  H01L27/15

CPC分类号： G02B6/12004 ,  G02F1/025 ,  G02F1/292 ,  G02F2001/294

摘要： An arrangement for actively controlling, in two dimensions, the manipulation of light within an SOI-based optical structure utilizes doped regions formed within the SOI layer and a polysilicon layer of a silicon-insulator-silicon capacitive (SISCAP) structure. The regions are oppositely doped so as to form an active device, where the application of a voltage potential between the oppositely doped regions functions to modify the refractive index in the affected area and alter the properties of an optical signal propagating through the region. The doped regions may be advantageously formed to exhibit any desired “shaped” (such as, for example, lenses, prisms, Bragg gratings, etc.), so as to manipulate the propagating beam as a function of the known properties of these devices. One or more active devices of the present invention may be included within a SISCAP formed, SOI-based optical element (such as, for example, a Mach-Zehnder interferometer, ring resonator, optical switch, etc.) so as to form an active, tunable element.

摘要翻译： 用于主动地控制SOI基光学结构内的光的操纵的布置利用形成在SOI层内的掺杂区域和硅绝缘体 - 硅电容（SISCAP）结构的多晶硅层。 这些区域相反地掺杂以形成有源器件，其中在相对掺杂区域之间施加电压电位用于改变受影响区域中的折射率并改变传播通过该区域的光信号的特性。 可以有利地形成掺杂区域以呈现任何期望的“成形”（例如，透镜，棱镜，布拉格光栅等），以便根据这些器件的已知特性来操纵传播光束。 本发明的一个或多个有源器件可以包括在形成SISCAP的SOI基光学元件（例如，诸如Mach-Zehnder干涉仪，环形谐振器，光学开关等）中，以形成活跃的 ，可调元素。