公开(公告)号：US20130188970A1

公开(公告)日：2013-07-25

申请号：US13745773

申请日：2013-01-19

申请人： Kalpendu Shastri ,  Vipulkumar Patel ,  Soham Pathak ,  Utpal Chakrabarti ,  Bipin Dama ,  Ravinder Kachru ,  Kishor Desai

发明人： Kalpendu Shastri ,  Vipulkumar Patel ,  Soham Pathak ,  Utpal Chakrabarti ,  Bipin Dama ,  Ravinder Kachru ,  Kishor Desai

IPC分类号： H04B10/12

CPC分类号： H04B10/501 ,  G02B6/3512 ,  G02B6/3692 ,  G02B6/4214 ,  G02B6/4256 ,  G02B6/4292 ,  Y10T29/49002

摘要： An apparatus for transmitting optical signals includes an interposer for supporting opto-electronic components used to create optical output signals. An enclosure is used to encapsulate the populated interposer assembly and includes a silicon sidewall and a transparent lid. The sidewall is etched to include a turning mirror feature with a reflecting surface at a predetermined angle θ, the turning mirror disposed to intercept the optical output signals and re-direct them through the enclosure's transparent lid. A coverplate is disposed over and aligned with the enclosure, where the coverplate includes a silicon sidewall member that is etched to include a turning mirror element with a reflecting surface at the same angle θ as the enclosure's turning mirror element. The optical signals re-directed by the enclosure then pass through the transparent lid of the enclosure, impinge the turning mirror element of the coverplate, and are then re-directed along the longitudinal axis.

摘要翻译： 用于发送光信号的装置包括用于支持用于产生光输出信号的光电组件的插入器。 外壳用于封装填充的插入器组件，并且包括硅侧壁和透明盖。 侧壁被蚀刻以包括具有预定角度θ的反射表面的转向镜特征，转向镜被设置成拦截光学输出信号并将其重新引导通过外壳的透明盖。 盖板设置在外壳上并与壳体对准，其中盖板包括硅侧壁构件，其被蚀刻以包括具有与外壳的转向镜元件相同角度θ的反射表面的转向镜元件。 由外壳重新引导的光学信号然后穿过外壳的透明盖，撞击盖板的转向镜元件，然后沿着纵向轴线重新定向。

公开(公告)号：US20130183008A1

公开(公告)日：2013-07-18

申请号：US13737080

申请日：2013-01-09

申请人： Kalpendu Shastri ,  Soham Pathak ,  Utpal Chakrabarti ,  Vipulkumar Patel ,  Bipin Dama ,  Ravinder Kachru ,  Kishor Desai

发明人： Kalpendu Shastri ,  Soham Pathak ,  Utpal Chakrabarti ,  Vipulkumar Patel ,  Bipin Dama ,  Ravinder Kachru ,  Kishor Desai

IPC分类号： G02B6/42

CPC分类号： G02B6/4292 ,  B82Y20/00 ,  C03C15/00 ,  G02B6/136 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4259 ,  Y10T29/4978

摘要： An apparatus for providing self-aligned optical coupling between an opto-electronic substrate and a fiber array, where the substrate is enclosed by a transparent lid such that the associated optical signals enter and exit the arrangement through the transparent lid. The apparatus takes the form of a two-part connectorized fiber array assembly where the two pieces uniquely mate to form a self-aligned configuration. A first part, in the form of a plate, is attached to the transparent lid in the area where the optical signals pass through. The first plate includes a central opening with inwardly-tapering sidewalls surrounding its periphery. A second plate is also formed to include a central opening and has a lower protrusion with inwardly-tapering sidewalls that mate with the inwardly-tapering sidewalls of the first plate to form the self-aligned connectorized fiber array assembly. The fiber array is then attached to the second plate in a self-aligned fashion.

摘要翻译： 一种用于在光电子基板和光纤阵列之间提供自对准光耦合的装置，其中基板由透明盖包围，使得相关联的光信号通过透明盖进入和离开布置。 该装置采取两部分连接的光纤阵列组件的形式，其中两个部件独特地配合以形成自对准配置。 在光信号通过的区域中，透明盖附着有板的形式的第一部分。 第一板包括具有围绕其周边的向内逐渐变细的侧壁的中心开口。 第二板也形成为包括中心开口并且具有下突起，其具有向内渐缩的侧壁，与第一板的向内渐缩的侧壁配合形成自对准的连接纤维阵列组件。 然后将纤维阵列以自对准的方式附接到第二板。

公开(公告)号：US20120280344A1

公开(公告)日：2012-11-08

申请号：US13463408

申请日：2012-05-03

申请人： Kalpendu Shastri ,  Vipulkumar Patel ,  Mark Webster ,  Prakash Gothoskar ,  Ravinder Kachru ,  Soham Pathak ,  Rao V. Yelamarty ,  Thomas Daugherty ,  Bipin Dama ,  Kaushik Patel ,  Kishor Desai

发明人： Kalpendu Shastri ,  Vipulkumar Patel ,  Mark Webster ,  Prakash Gothoskar ,  Ravinder Kachru ,  Soham Pathak ,  Rao V. Yelamarty ,  Thomas Daugherty ,  Bipin Dama ,  Kaushik Patel ,  Kishor Desai

IPC分类号： H01L31/12

CPC分类号： H01L25/50 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4257 ,  G02B6/426 ,  H01L25/167 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.

摘要翻译： 光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。 特别地，硅晶片被用作平台（插入器），用于多个收发器模块的所有部件安装或集成在该平台上，硅插入器的顶表面用作用于定义光信号的参考平面 分离的光学元件之间的路径。 实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。

公开(公告)号：US08803269B2

公开(公告)日：2014-08-12

申请号：US13463408

申请日：2012-05-03

申请人： Kalpendu Shastri ,  Vipulkumar Patel ,  Mark Webster ,  Prakash Gothoskar ,  Ravinder Kachru ,  Soham Pathak ,  Rao V. Yelamarty ,  Thomas Daugherty ,  Bipin Dama ,  Kaushik Patel ,  Kishor Desai

发明人： Kalpendu Shastri ,  Vipulkumar Patel ,  Mark Webster ,  Prakash Gothoskar ,  Ravinder Kachru ,  Soham Pathak ,  Rao V. Yelamarty ,  Thomas Daugherty ,  Bipin Dama ,  Kaushik Patel ,  Kishor Desai

IPC分类号： H01L31/0232 ,  H01L29/40 ,  H01L23/053 ,  H01L23/12

CPC分类号： H01L25/50 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4257 ,  G02B6/426 ,  H01L25/167 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

摘要： A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.

摘要翻译： 光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。 特别地，硅晶片被用作“平台”（插入器），在其上安装或集成多个收发器模块的所有组件，硅插入器的顶表面用作参考平面，用于定义 分离光学元件之间的光信号路径。 实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。

公开(公告)号：US20130101250A1

公开(公告)日：2013-04-25

申请号：US13656528

申请日：2012-10-19

申请人： Kishor Desai ,  Ravinder Kachru ,  Vipulkumar Patel ,  Bipin Dama ,  Kalpendu Shastri ,  Soham Pathak

发明人： Kishor Desai ,  Ravinder Kachru ,  Vipulkumar Patel ,  Bipin Dama ,  Kalpendu Shastri ,  Soham Pathak

IPC分类号： G02B6/12 ,  H01L33/52

CPC分类号： G02B6/4255 ,  G02B6/12 ,  G02B6/13 ,  G02B6/4201 ,  G02B6/4257 ,  G02B6/4292 ,  G02B6/43 ,  H01L21/50 ,  H01L23/04 ,  H01L23/48 ,  H01L25/167 ,  H01L31/0203 ,  H01L33/52 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/165 ,  H01L2924/16788 ,  H05K1/0268 ,  H05K1/0274 ,  H05K2201/10121 ,  H01L2924/0105 ,  H01L2924/01079

摘要： An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.

摘要翻译： 提供了一种光电子组件，其包括用于支撑多个互连的光学和电气部件的基板（通常为硅或玻璃）。 设置一层密封材料以概述衬底的限定的周边区域。 将模制的玻璃盖设置在基底上并结合到基底上，其中模制的玻璃盖构造成产生与限定的基底周边区域匹配的覆盖区。 模制玻璃盖的底表面包括一层接合材料，其在接触时接触基底的密封材料层，形成结合组件。 在一种形式中，提出了一种晶片级组装工艺，其中多个光电组件设置在硅晶片上，并且多个玻璃盖被模制在一片玻璃中，然后将其粘合到硅晶片上。

公开(公告)号：US20130202255A1

公开(公告)日：2013-08-08

申请号：US13755843

申请日：2013-01-31

申请人： Chris Kiyoshi Togami ,  Soham Pathak ,  Kalpendu Shastri ,  Kishor Desai ,  Ravinder Kachru ,  Bipin Dama ,  Vipulkumar Patel

发明人： Chris Kiyoshi Togami ,  Soham Pathak ,  Kalpendu Shastri ,  Kishor Desai ,  Ravinder Kachru ,  Bipin Dama ,  Vipulkumar Patel

IPC分类号： G02B6/42 ,  G02B6/43

CPC分类号： G02B6/421 ,  G02B6/3885 ,  G02B6/4204 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4292 ,  G02B6/43

摘要： An apparatus for providing single mode optical signal coupling between an opto-electronic transceiver and a single mode optical fiber array takes the form of a lens array and a ferrule component. The lens array includes a plurality of separate lens element disposed to intercept a like plurality of single mode optical output signal from the opto-electronic transceiver and provide as an output a focused version thereof. The ferrule component includes a plurality of single mode fiber stubs that are passively aligned with the lens array and support the transmission of the focused, single mode optical output signals towards the associated single mode optical fiber array.

摘要翻译： 用于在光电收发器和单模光纤阵列之间提供单模光信号耦合的装置采用透镜阵列和套圈部件的形式。 透镜阵列包括多个单独的透镜元件，其设置成截取来自光电收发器的类似多个单模光输出信号，并提供其聚焦版本的输出。 套圈组件包括与透镜阵列无源对准的多个单模光纤短截线，并支持将聚焦的单模光输出信号传输到相关联的单模光纤阵列。

公开(公告)号：US20130182996A1

公开(公告)日：2013-07-18

申请号：US13737029

申请日：2013-01-09

申请人： Kalpendu Shastri ,  Soham Pathak ,  John Fangman ,  Vipulkumar Patel ,  Kishor Desai ,  Ravinder Kachru

发明人： Kalpendu Shastri ,  Soham Pathak ,  John Fangman ,  Vipulkumar Patel ,  Kishor Desai ,  Ravinder Kachru

IPC分类号： G02B6/42 ,  G02B6/12

CPC分类号： G02B6/42 ,  G02B6/12 ,  G02B6/3886 ,  G02B6/4214 ,  G02B6/4259 ,  G02B6/4292 ,  Y10T29/49155

摘要： An apparatus for providing releasable attachment between a fiber connector and an opto-electronic assembly, the opto-electronic assembly utilizing an interposer substrate to support a plurality of opto-electronic components that generates optical output signals and receives optical input signals. An enclosure is used to cover the interposer substrate and includes a transparent region through which the optical output and input signals pass unimpeded. A magnetic connector component is attached to the lid and positioned to surround the transparent region, with a fiber connector for supporting one or more optical fibers magnetically attached to the connector component by virtue of a metallic component contained in the fiber connector. This arrangement provides releasable attachment of the fiber connector to the enclosure in a manner where the optical output and input signals align with the optical fibers in the connector.

摘要翻译： 一种用于在光纤连接器和光电子组件之间提供可释放附件的装置，所述光电组件利用插入器基板来支撑产生光输出信号并接收光输入信号的多个光电元件。 外壳用于覆盖插入器基板，并且包括透明区域，光输出和输入信号通过该透明区域畅通无阻。 磁性连接器部件附接到盖子并且被定位成围绕透明区域，光纤连接器用于通过光纤连接器中包含的金属部件来支撑一个或多个磁性地附接到连接器部件的光纤。 这种布置以光输出和输入信号与连接器中的光纤对准的方式提供光纤连接器到外壳的可释放附接。

公开(公告)号：US08963310B2

公开(公告)日：2015-02-24

申请号：US13216918

申请日：2011-08-24

申请人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

发明人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

IPC分类号： H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/49575 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic assembly includes a substrate, a first and second microelectronic elements, a lead finger, electrical connections extending between contacts of the second microelectronic element and the lead fingers, and an encapsulant overlying at least portions of the first and second microelectronic elements, lead finger and electrical connections. The substrate has contacts at a first surface and terminals at an opposed second surface that are electrically connected with the substrate contacts. The first microelectronic element has contacts exposed at its front face. The front face of the first microelectronic element is joined to the substrate contacts. The second microelectronic element overlies the first microelectronic element and has contacts at a front face facing away from the substrate. The lead frame has lead fingers, wherein the second surface of the substrate and the lead fingers define a common interface for electrical interconnection to a component external to the microelectronic assembly.

摘要翻译： 微电子组件包括衬底，第一和第二微电子元件，引线指，在第二微电子元件的触点和引线指之间延伸的电连接，以及覆盖第一和第二微电子元件的至少一部分的引线指 和电气连接。 基板在第一表面具有接触，在相对的第二表面具有与基板触点电连接的端子。 第一微电子元件在其前面具有暴露的触点。 第一微电子元件的正面连接到基板触点。 第二微电子元件覆盖第一微电子元件并且在面向背离衬底的前面具有接触。 引线框架具有引线指，其中基板的第二表面和引线指限定用于与微电子组件外部的部件的电互连的公共接口。

公开(公告)号：US20130063918A1

公开(公告)日：2013-03-14

申请号：US13232436

申请日：2011-09-14

申请人： Belgacem Haba ,  Kishor Desai

发明人： Belgacem Haba ,  Kishor Desai

IPC分类号： H05K7/00 ,  B32B38/08 ,  H05K1/00 ,  H05K1/11 ,  H05K1/16

CPC分类号： H01L23/49827 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/17104 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/19107 ,  Y10T29/49128 ,  Y10T428/24521 ,  Y10T428/24802 ,  H01L2924/00 ,  H01L2924/00012

摘要： An interconnection component includes a first support portion has a plurality of first conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent a first surface and a second end adjacent a second surface. A second support portion has a plurality of second conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent the first surface and a second end adjacent the second surface. A redistribution layer is disposed between the second surfaces of the first and second support portions, electrically connecting at least some of the first vias with at least some of the second vias. The first and second support portions can have a coefficient of thermal expansion (“CTE”) of less than 12 parts per million per degree, Celsius (“ppm/° C.”).

摘要翻译： 互连部件包括第一支撑部分，其具有大致垂直于其表面延伸的多个第一导电通孔，使得每个通孔具有邻近第一表面的第一端和邻近第二表面的第二端。 第二支撑部分具有大致垂直于其表面延伸穿过的多个第二导电通路，使得每个通孔具有邻近第一表面的第一端和邻近第二表面的第二端。 再分配层设置在第一和第二支撑部分的第二表面之间，将至少一些第一通孔与至少一些第二通孔电连接。 第一和第二支撑部分的热膨胀系数（CTE）可以低于每百万摄氏度（ppm /℃）的百万分之十二。

公开(公告)号：US20130049179A1

公开(公告)日：2013-02-28

申请号：US13216918

申请日：2011-08-24

申请人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

发明人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49575 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic assembly includes a substrate, a first and second microelectronic elements, a lead finger, electrical connections extending between contacts of the second microelectronic element and the lead fingers, and an encapsulant overlying at least portions of the first and second microelectronic elements, lead finger and electrical connections. The substrate has contacts at a first surface and terminals at an opposed second surface that are electrically connected with the substrate contacts. The first microelectronic element has contacts exposed at its front face. The front face of the first microelectronic element is joined to the substrate contacts. The second microelectronic element overlies the first microelectronic element and has contacts at a front face facing away from the substrate. The lead frame has lead fingers, wherein the second surface of the substrate and the lead fingers define a common interface for electrical interconnection to a component external to the microelectronic assembly.